|
|
Número de pieza | ETP01-1621 | |
Descripción | Protection | |
Fabricantes | STMicroelectronics | |
Logotipo | ||
Hay una vista previa y un enlace de descarga de ETP01-1621 (archivo pdf) en la parte inferior de esta página. Total 7 Páginas | ||
No Preview Available ! www.DataSheet4U.com
ETP01-xx21
Protection for Ethernet lines
Features
■ Differential and common mode protection
■ Telcordia GR1089 Intrabuilding: 100 A, 2/10 µs
■ ITU-T K20/21: 37.5 A, 5/310 µs
■ Low capacitance: 13 pF max at 0 V
■ UL94 V0 approved resin
■ SO8 package is JEDEC registered
Benefits
■ Trisil™ technology is not subject to ageing and
provides a fail safe mode in short circuit for a
better protection.
■ This series is used to help equipment to meet
main standards such as UL61950, IEC950 /
CSA C22.2 and UL1459.
Complies with the following standards
■ IEC 61000-4-2: Level 4
– 15 kV (air discharge)
– 8 kV (contact discharge)
■ MIL STD 883E-Method 3015-7: class3:
– 25 kV (Human body model)
■ TELCORDIA GR-1089 Core: 100 A, 2/10 µs
■ ITU-T K20/21: 37.5 A, 5/310 µs
■ IEC 61000-4-5: 2 kV, 42 Ω, 48 A, 8/20 µs
SO-8
Figure 1. Schematic diagram
T1
GND
GND
T2
T1
GND
GND
T2
Applications
This series can meet subscriber and central office
requirements.
■ Protection against telecommunications surge
standards on:
– 10/100 Mbps Ethernet
– Ethernet Gigabit
– T1 / E1 line cards
TM: Trisil is a trademark of STMicroelectronics
Description
The ETP01 series is a low capacitance transient
surge arrestor designed for protection of high
debit rate communication network. Planar
technology used combines a high surge capability
to comply with Telcordia GR1089 Intrabuilding
and ITU-T K20/21, and low capacitance to avoid
distortion of high speed signals such as Ethernet.
March 2008
Rev 1
1/7
www.st.com
7
1 page ETP01-xx21
3 Package information
www.DataSheet4U.com
Package information
● Epoxy meets UL94, V0
In order to meet environmental requirements, ST offers these devices in ECOPACK®
packages. These packages have a lead-free second level interconnect. The category of
second level interconnect is marked on the inner box label, in compliance with JEDEC
Standard JESD97. The maximum ratings related to soldering conditions are also marked on
the inner box label. ECOPACK is an ST trademark. ECOPACK specifications are available at
www.st.com.
Table 3. SO-8 dimensions
be
ppp C
D
Seating
Plane
C
A2 A
C
A1 k
85
E1 E
14
Dimensions
Ref. Millimeters
Inches
h x 45°
L
L1
Min.
A
A1 0.1
A2 1.25
b 0.28
C 0.17
D 4.80
E 5.80
E1 3.80
e
h 0.25
L 0.40
L1
k 0°
ppp
Typ. Max. Min. Typ. Max.
1.75 0.069
0.25 0.004
0.049
0.48 0.011
0.010
0.019
0.23 0.007
0.009
4.90 5.00 0.189 0.193 0.197
6.00 6.20 0.228 0.236 0.244
3.90 4.00 0.150 0.154 0.157
1.27 0.050
0.50 0.010
0.020
1.27 0.016
0.050
1.04 0.041
8° 0°
8°
0.10 0.004
Figure 7. Footprint dimensions
in mm (inches)
Figure 8. Marking
6.8
(0.268)
4.2
(0.165)
0.6
(0.024)
1.27
(0.050)
XXXXX : Marking
ZZ : Manufacturing location
Y : Year
WW : week
xxxxxx
z z y ww
â
Pin 1
5/7
5 Page |
Páginas | Total 7 Páginas | |
PDF Descargar | [ Datasheet ETP01-1621.PDF ] |
Número de pieza | Descripción | Fabricantes |
ETP01-1621 | Protection | STMicroelectronics |
Número de pieza | Descripción | Fabricantes |
SLA6805M | High Voltage 3 phase Motor Driver IC. |
Sanken |
SDC1742 | 12- and 14-Bit Hybrid Synchro / Resolver-to-Digital Converters. |
Analog Devices |
DataSheet.es es una pagina web que funciona como un repositorio de manuales o hoja de datos de muchos de los productos más populares, |
DataSheet.es | 2020 | Privacy Policy | Contacto | Buscar |