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PDF BUK663R5-55C Data sheet ( Hoja de datos )

Número de pieza BUK663R5-55C
Descripción N-channel TrenchMOS FET
Fabricantes NXP Semiconductors 
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DataSheet.in
BUK663R5-55C
N-channel TrenchMOS FET
Rev. 01 — 3 August 2010
Objective data sheet
1. Product profile
1.1 General description
Intermediate level gate drive N-channel enhancement mode Field-Effect Transistor (FET)
in a plastic package using advanced TrenchMOS technology. This product has been
designed and qualified to the appropriate AEC Q101 standard for use in high performance
automotive applications.
1.2 Features and benefits
„ AEC Q101 compliant
„ Suitable for intermediate level gate
drive sources
„ Suitable for thermally demanding
environments due to 175 °C rating
1.3 Applications
„ 12 V and 24 V Automotive systems
„ ABS/ESP
„ Engine management
„ HVAC
„ Motors, lamps and solenoid control
„ Transmission control
„ Ultra high performance power
switching
1.4 Quick reference data
Table 1. Quick reference data
Symbol Parameter
Conditions
VDS drain-source voltage Tj 25 °C; Tj 175 °C
ID drain current VGS = 10 V; Tmb = 25 °C;
see Figure 1
Ptot total power dissipation Tmb = 25 °C; see Figure 2
Static characteristics
RDSon
drain-source on-state
resistance
Avalanche ruggedness
EDS(AL)S
non-repetitive
drain-source
avalanche energy
VGS = 10 V; ID = 15 A;
Tj = 25 °C; see Figure 5
ID = 100 A; Vsup 55 V;
RGS = 50 ; VGS = 10 V;
Tj(init) = 25 °C; unclamped
[1] Continuous current is limited by package.
Min Typ Max Unit
- - 55 V
[1] - - 100 A
- - 263 W
- 2.7 3.5 m
- - 551 mJ

1 page




BUK663R5-55C pdf
DataSheet.in
NXP Semiconductors
BUK663R5-55C
N-channel TrenchMOS FET
6. Characteristics
Table 6. Characteristics
Symbol
Parameter
Static characteristics
V(BR)DSS
drain-source breakdown
voltage
VGS(th)
gate-source threshold voltage
IDSS
IGSS
RDSon
drain leakage current
gate leakage current
drain-source on-state
resistance
Dynamic characteristics
QG(tot)
total gate charge
QGS
QGD
Ciss
Coss
Crss
td(on)
tr
td(off)
tf
LD
gate-source charge
gate-drain charge
input capacitance
output capacitance
reverse transfer capacitance
turn-on delay time
rise time
turn-off delay time
fall time
internal drain inductance
LS internal source inductance
Source-drain diode
VSD source-drain voltage
trr reverse recovery time
Qr recovered charge
Conditions
ID = 250 µA; VGS = 0 V; Tj = 25 °C
ID = 250 µA; VGS = 0 V; Tj = -55 °C
ID = 1 mA; VDS = VGS; Tj = 25 °C;
see Figure 4
ID = 1 mA; VDS = VGS; Tj = -55 °C;
see Figure 4
ID = 1 mA; VDS = VGS; Tj = 175 °C;
see Figure 4
VDS = 55 V; VGS = 0 V; Tj = 175 °C
VDS = 55 V; VGS = 0 V; Tj = 25 °C
VDS = 0 V; VGS = 20 V; Tj = 25 °C
VDS = 0 V; VGS = -20 V; Tj = 25 °C
VGS = 5 V; ID = 15 A; Tj = 25 °C;
see Figure 5
VGS = 10 V; ID = 15 A; Tj = 25 °C;
see Figure 5
VGS = 4.5 V; ID = 15 A; Tj = 25 °C;
see Figure 5
VGS = 10 V; ID = 15 A; Tj = 175 °C;
see Figure 5
ID = 25 A; VDS = 40 V; VGS = 10 V
ID = 25 A; VDS = 40 V; VGS = 5 V
ID = 25 A; VDS = 40 V; VGS = 10 V
VGS = 0 V; VDS = 25 V; f = 1 MHz;
Tj = 25 °C
VDS = 30 V; RL = 1.2 ; VGS = 10 V;
RG(ext) = 10
from drain lead 6 mm from package
to centre of die ; Tj = 25 °C
from source lead to source bond
pad ; Tj = 25 °C
IS = 25 A; VGS = 0 V; Tj = 25 °C
IS = 20 A; dIS/dt = -100 A/µs;
VGS = 0 V; VDS = 25 V
BUK663R5-55C
Objective data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 01 — 3 August 2010
Min Typ Max Unit
55 - - V
50 - - V
1.5 2.1 2.5 V
- - 2.8 V
0.8 - - V
- - 500 µA
-
0.02 1
µA
- 2 100 nA
- 2 100 nA
- [tbd] [tbd] m
- 2.7 3.5 m
- [tbd] [tbd] m
- - 7.4 m
- [tbd] [tbd] nC
- [tbd] [tbd] nC
- [tbd] [tbd] nC
- [tbd] [tbd] nC
- [tbd] [tbd] pF
- [tbd] [tbd] pF
- [tbd] [tbd] pF
- [tbd] [tbd] ns
- [tbd] [tbd] ns
- [tbd] [tbd] ns
- [tbd] [tbd] ns
- 4.5 - nH
- 7.5 - nH
- 0.85 1.2 V
- [tbd] [tbd] ns
- [tbd] [tbd] nC
© NXP B.V. 2010. All rights reserved.
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BUK663R5-55C arduino
DataSheet.in
NXP Semiconductors
11. Contents
1 Product profile . . . . . . . . . . . . . . . . . . . . . . . . . . .1
1.1 General description . . . . . . . . . . . . . . . . . . . . . .1
1.2 Features and benefits . . . . . . . . . . . . . . . . . . . . .1
1.3 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . .1
1.4 Quick reference data . . . . . . . . . . . . . . . . . . . . .1
2 Pinning information . . . . . . . . . . . . . . . . . . . . . . .2
3 Ordering information . . . . . . . . . . . . . . . . . . . . . .2
4 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . .3
5 Thermal characteristics . . . . . . . . . . . . . . . . . . .4
6 Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . .5
7 Package outline . . . . . . . . . . . . . . . . . . . . . . . . . .7
8 Revision history . . . . . . . . . . . . . . . . . . . . . . . . . .8
9 Legal information. . . . . . . . . . . . . . . . . . . . . . . . .9
9.1 Data sheet status . . . . . . . . . . . . . . . . . . . . . . . .9
9.2 Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .9
9.3 Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . . .9
9.4 Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . .10
10 Contact information. . . . . . . . . . . . . . . . . . . . . .10
BUK663R5-55C
N-channel TrenchMOS FET
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section ‘Legal information’.
© NXP B.V. 2010.
All rights reserved.
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: [email protected]
Date of release: 3 August 2010
Document identifier: BUK663R5-55C

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