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FAN5626 데이터시트 PDF




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부품번호 FAN5626 기능
기능 (FAN5622 - FAN5626) 2-channel Linear LED Driver
제조업체 Fairchild Semiconductor
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FAN5626 데이터시트, 핀배열, 회로
DataSheet.in
May 2010
FAN5622 / FAN5624 / FAN5626
Linear LED Drivers with Single-Wire Digital Interface
Features
ƒ Family of Three Linear Current-Sink LED Drivers that
Support 2, 4, or 6 LED Outputs
ƒ Current Sink Driver for Each LED Output:
30mA Maximum Output Current
50mV Drop-out at 15mA IOUT
Better than 3% Matching between Channels
External RSET
ƒ Single-Wire Digital Control Interface for Easy
Programming
32 Linear Steps of Dimming Control
ƒ Less than 1µA Shut-Down Current
ƒ Short-Circuit, Under-Voltage, and Thermal Protection
ƒ Wide Input Voltage Range: 2.7 to 5.5V
ƒ Small Form-Factor Packages:
FAN5622: 6-pin Super SOT23
FAN5624: 10-lead 1.4x1.8x0.55mm UMLP
FAN5626: 10-lead 1.6x2.1x0.55mm MicroPak™ MLP
Applications
ƒ Mobile Handsets
ƒ Mobile Internet Devices
ƒ PMP and MP3 Players
ƒ LCD Modules
Description
The FAN5622, FAN5624, and FAN5626 are two-, four-, and
six- channel current-sink linear LED drivers used to backlight
the main LCD displays or keypads in mobile electronics, such
as cellular phone handsets.
A very low dropout of 50mV allows driving LEDs without any
inductors or switch capacitors. The brightness levels of the
LED outputs are programmed through single-wire digital
control interface. The user can program 32 linear dimming
steps and turn on and off the LEDs through this interface by
applying digital pulses.
The FAN562x family of linear LED drivers provides high
efficiency due to the low drop-out voltage of the LED driver.
Good matching between different channels of LED output is
provided across the entire 32 dimming steps. These LED
drivers also integrate short circuit, under-voltage, and thermal
protection to ensure for a more robust solution.
The FAN5622, FAN5624, and FAN5626 are available in very
small form-factor packages: 6-pin Super SOT23, 10-lead
UMLP, and 10-lead MicroPak™ MLP, respectively.
Figure 1. Typical Application of FAN5622
Ordering Information
Part Number
FAN5622SX
FAN5624UMPX
FAN5626LX
# of Channels
2
4
6
Temperature
Range
-40 to 85°C
-40 to 85°C
-40 to 85°C
Package
6-Lead SSOT23
10-Lead UMLP
10-Lead MicroPak™ MLP
Packing
Tape and Reel
Tape and Reel
Tape and Reel
© 2010 Fairchild Semiconductor Corporation
FAN5622 / FAN5624 / FAN5626 • Rev. 1.0.1
www.fairchildsemi.com




FAN5626 pdf, 반도체, 판매, 대치품
DataSheet.in
Absolute Maximum Ratings
Stresses exceeding the absolute maximum ratings may damage the device. The device may not function or be operable above
the recommended operating conditions and stressing the parts to these levels is not recommended. In addition, extended
exposure to stresses above the recommended operating conditions may affect device reliability. The absolute maximum ratings
are stress ratings only.
Symbol
VIN Pin
VCC Other Pins(1)
Parameter
ESD
Human Body Model per JESD22-A114
Electrostatic Discharge Protection Level
Charged Device Model per JESD22-C101
TJ
TSTG
Junction Temperature
Storage Temperature
TL Lead Soldering Temperature, 10 Seconds
Note:
1. Lesser of 6.0V or VIN+0.3V.
Min. Max.
-0.3 6.0
-0.3
VIN +
0.3
3.0
1.5
–40 +150
–65 +150
+260
Units
V
V
kV
kV
°C
°C
°C
Recommended Operating Conditions
The Recommended Operating Conditions table defines the conditions for actual device operation. Recommended operating
conditions are specified to ensure optimal performance to the datasheet specifications. Fairchild does not recommend exceeding
them or designing to absolute maximum ratings.
Symbol
VIN
TA
TJ
ILED(FS)
Parameter
Power Supply Voltage Range
Operating Ambient Temperature Range
Operating Junction Temperature Range
Full-Scale LED Current
Min.
2.7
-40
-40
5
Max.
5.5
+85
+125
30
Units
V
°C
°C
mA
Thermal Properties
Junction-to-ambient thermal resistance is a function of application and board layout. This data is measured with boards in
accordance to JEDEC standard JESD51. Special attention must be paid not to exceed junction temperature TJ(max) at a given
ambient temperature TA.
Symbol Parameter
θJA_SSOT23-6
θJA_UMLP10
θJA_MicroPAK_MLP10
Junction-to-Ambient Thermal Resistance, SSOT23-6 Package
Junction-to-Ambient Thermal Resistance, UMLP10 Package(2)
Junction-to-Ambient Thermal Resistance, MicroPak™ MLP10 package(3)
Notes:
2. Recommended not to exceed 132mW of maximum power dissipation.
3. Recommended not to exceed 198mW of maximum power dissipation.
Typical
235
287
220
Units
°C/W
°C/W
°C/W
© 2010 Fairchild Semiconductor Corporation
FAN5622 / FAN5624 / FAN5626 • Rev. 1.0.1
4
www.fairchildsemi.com

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FAN5626 전자부품, 판매, 대치품
DataSheet.in
Typical Performance Characteristics
Figure 14. Startup Waveform for FAN5626
Figure 15. Shutdown Waveform for FAN5626
Figure 16. Dimming Operation
© 2010 Fairchild Semiconductor Corporation
FAN5622 / FAN5624 / FAN5626 • Rev. 1.0.1
7
www.fairchildsemi.com

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