EXC28B Datasheet PDF - Panasonic Semiconductor
| Part Number | EXC28B | |
| Description | Chip Bead Array | |
| Manufacturers | Panasonic Semiconductor | |
| Logo |  |
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Chip Bead Array
Type: EXC28B
Chip Bead Array
■ Features
● Space saving
● SSOP package (0.5 mm pitch) compatibility
● Small size and lightweight
Type: EXC28BB
● Suitable for high speed signals (over 50 MHz)
● Excellent cross talk characteristics (100 MHz:<-25 dB)
Type: EXC28BA
● Reduces waveform ringing noise
● Excellent cross talk characteristics (100 MHz:<-30 dB)
■ Recommended Applications
● Small digital equipment such as PCs, printers, HDD,
DVD-ROMs, CD-ROMs, LCDs.
● Digital audio and video equipment such as DSC,
DVC, CD Players, DVD Players, MD Players.
● Electronic musical instruments, and other digital
equipment.
■ Explanation of Part Numbers
1234
EXC2
5
8
Product Code
Size
6 7 8 9 10
BB1 2 1
Type Characteristics Nominal Impedance
11 12
U
Form Suffix
Noise Filter
Chip size 1005 mm
x4 Array
Multilayer
B Chip bead
A Ringing Suppression Type
B High Speed Signal Type
The first two digits are
significant figure of
impedance value and the
third one denotes the
number of zeros following
Code
Packing
U Embossed Carrier Taping
■ Construction
■ Dimensions in mm (not to scale)
Ferrite Core
A
EF
B
D
C
Inner Conductor
Electrode
Type
(inches) A
Dimensions (mm)
BCDE
Mass
F
(Weight)
[mg/pc.]
EXC28B
(0804)
1.00±0.15
2.0±0.2
0.5±0.1 0.20±0.15 0.5±0.1 0.25±0.10
5.2
Design and specifications are each subject to change without notice. Ask factory for the current technical specifications before purchase and/or use.
Should a safety concern arise regarding this product, please be sure to contact us immediately.
Feb. 2006
www.DataSheet.in
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Safety Precautions (Common precautions for EMI Filters, ESD Suppressors, Fuses, and MR Sensors)
• When using our products, no matter what sort of equipment they might be used for, be sure to make a written
agreement on the specifications with us in advance. The design and specifications in this catalog are subject
to change without prior notice.
• Do not use the products beyond the specifications described in this catalog.
• This catalog explains the quality and performance of the products as individual components. Before use, check
and evaluate their operations when installed in your products.
• Install the following systems for a failsafe design to ensure safety if these products are to be used in equipment
where a defect in these products may cause the loss of human life or other significant damage, such as damage to
vehicles (automobile, train, vessel), traffic lights, medical equipment, aerospace equipment, electric heating
appliances, combustion/gas equipment, rotating equipment, and disaster/crime prevention equipment.
✽ Systems equipped with a protection circuit and a protection device
✽ Systems equipped with a redundant circuit or other system to prevent an unsafe status in the event of a single fault
(1) Precautions for use
• These products are designed and manufactured for general and standard use in general electronic equipment
(e.g. AV equipment, home electric appliances, office equipment, information and communication equipment)
• These products are not intended for use in the following special conditions. Before using the products,
carefully check the effects on their quality and performance, and determine whether or not they can be used.
1. In liquid, such as water, oil, chemicals, or organic solvent
2. In direct sunlight, outdoors, or in dust
3. In salty air or air with a high concentration of corrosive gas, such as Cl2, H2S, NH3, SO2, or NO2
4. Electric Static Discharge (ESD) Environment (except ESD Suppressors)
These components are sensitive to static electricity and can be damaged under static shock (ESD).
Please take measures to avoid any of these environments.
Smaller components are more sensitive to ESD environment.
5. Electromagnetic Environment
Avoid any environment where strong electromagnetic waves exist.
6. In an environment where these products cause dew condensation
7. Sealing or coating of these products or a printed circuit board on which these products are mounted, with
resin or other materials
• These products generate Joule heat when energized. Carefully position these products so that their heat will
not affect the other components.
• Carefully position these products so that their temperatures will not exceed the category temperature range due
to the effects of neighboring heat-generating components. Do not mount or place heat-generating components
or inflammables, such as vinyl-coated wires, near these products (except Thermal Cutoffs).
• Note that non-cleaning solder, halogen-based highly active flux, or water-soluble flux may deteriorate the
performance or reliability of the products.
• Carefully select a flux cleaning agent for use after soldering. An unsuitable agent may deteriorate the performance
or reliability. In particular, when using water or a water-soluble cleaning agent, be careful not to leave water
residues. Otherwise, the insulation performance may be deteriorated.
(2) Precautions for storage
The performance of these products, including the solderability, is guaranteed for a year from the date of arrival
at your company, provided that they remain packed as they were when delivered and stored at a temperature
of 5 °C to 35 °C and a relative humidity of 45 % to 85 %. (Micro Chip Fuses: Guaranteed for 6 months from the
date of arrival at your company)
The performance of EMI Filters is guaranteed for 6 months or a year from the outgoing inspection date indicated on
the packages, provided that they are stored at a temperature of -5 °C to +40 °C and a relative humidity of 40 %
to 60 %. Check the guarantee period in the specifications. The performance of Thermal Cutoffs is guaranteed for a
year from the outgoing inspection date indicated on the packages, provided that they are stored at a temperature of
-10 °C to +40 °C and a relative humidity of 30 % to 75 %.
Even within the above guarantee periods, do not store these products in the following conditions. Otherwise,
their electrical performance and/or solderability may be deteriorated, and the packaging materials (e.g. taping
materials) may be deformed or deteriorated, resulting in mounting failures.
1. In salty air or in air with a high concentration of corrosive gas, such as Cl2, H2S, NH3, SO2, or NO2
2. In direct sunlight
<Package markings>
Package markings include the product number, quantity, and country of origin.
In principle, the country of origin should be indicated in English.
www.DataSheet.in
– EL113 –
Jan. 2008
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Part DetailsOn this page, you can learn information such as the schematic, equivalent, pinout, replacement, circuit, and manual for EXC28B electronic component. |
| Information | Total 5 Pages | |
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| Download | [ EXC28B.PDF Datasheet ] | |
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