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TSSOP 데이터시트 PDF




STATS ChipPAC에서 제조한 전자 부품 TSSOP은 전자 산업 및 응용 분야에서
광범위하게 사용되는 반도체 소자입니다.


PDF 형식의 TSSOP 자료 제공

부품번호 TSSOP 기능
기능 Small Outline Packages
제조업체 STATS ChipPAC
로고 STATS ChipPAC 로고


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TSSOP 데이터시트, 핀배열, 회로
TSSOP and MSOP
Small Outline Packages
• Wide range of body sizes
• 8 to 56 lead counts
• Thermally enhanced versions
available (TSSOP-ep and
MSOP-ep)
FEATURES
TSSOP
Body Size: 3.0 x 4.4mm to 14.0 x 6.1mm
Lead Count: 8L to 56L
Lead Pitch: 0.50mm & 0.65mm
Package Height: 1.20mm max.
JEDEC standard compliant (MO-153)
Lead-free (Pb-free) and Green
Thermal Enhancements: ep (exposed pad)
MSOP
Body Size: 3 x 3mm
Lead Count: 8L & 10L
Lead Pitch: 0.65mm (8L) and 0.50mm (10L)
JEDEC standard compliant
Lead-free (Pb-free) and Green
Thermal enhancements: ep (exposed pad)
APPLICATIONS
• Analog and Operation Amplifiers
• Controllers and Drivers
• Logic, Memory, and RF/Wireless
• Disk drives, video/audio and consumer electronics/
appliances
www.DataSheet.in
www.statschippac.com
DESCRIPTION
STATS ChipPAC offers a complete line of Small Outline
Package (SOP) families including TSSOP, TSSOP-ep, and MSOP.
STATS ChipPAC’s TSSOP (Thin Shrink Small Outline Package) is
suitable for applications requiring a thin profile. TSSOP is a
leadframe based, plastic encapsulated package with gull wing
shaped leads on two sides with lead count ranging from 8 to
56 leads. The ultra thin TSSOP is made possible by optimal wire
looping control during the wire bonding process as well as
optimal package warpage control during the molding process.
TSSOP is designed to fill the niche of low pin count devices
where low profile and small footprint are key design consider-
ations. The TSSOP features 0.5 and 0.65mm lead pitch, and is
ideal for low pin count analog and mixed signal devices in
handheld applications such as PDAs and mobile / cellular
phones.
Taking the reliability of Small Outline Packages (SOP) one
step further, STATS ChipPAC offers a Micro Small Outline
Package (MSOP) for applications requiring thin, small, and
high reliability. This smaller package offers a smaller footprint,
shorter wires for improved electrical connections, and better
moisture reliability (MRT/MSL).
In addition to standard TSSOP and MSOP, STATS ChipPAC
offers thermally enhanced “ep” versions featuring an exposed
die paddle for efficient heat dissipation. The exposed die
attach pad design of the TSSOP package can provide excellent
thermal dissipation by soldering the copper die attach pad
directly onto the PCB, and is ideal for low pin count analog and
mixed signal devices.
STATS ChipPAC uses the latest leadframe technology and
state of the art design and simulation tools to achieve
optimum electrical and thermal performance. STATS ChipPAC’s
state of the art assembly facility and proven materials assure
high yield manufacturing and long term reliability.





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관련 데이터시트

부품번호상세설명 및 기능제조사
TSSOP

Small Outline Packages

STATS ChipPAC
STATS ChipPAC
TSSOP-14PIN

TSSOP Package 14-Pin

International Rectifier
International Rectifier

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