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PDF NLX2G00 Data sheet ( Hoja de datos )
| Número de pieza | NLX2G00 | |
| Descripción | Dual 2-Input NAND Gate | |
| Fabricantes | ON Semiconductor | |
| Logotipo |  |
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NLX2G00
Dual 2-Input NAND Gate
The NLX2G00 is an advanced high-speed dual 2-input CMOS
NAND gate in ultra-small footprint.
The NLX2G00 input structures provide protection when voltages up
to 7.0 volts are applied, regardless of the supply voltage.
Features
• High Speed: tPD 2.4 ns (typical) at VCC = 5.0 V
• Designed for 1.65 V to 5.5 V VCC Operation
• Low Power Dissipation: ICC = 1 mA (Max) at TA = 25°C
• 24 mA Balanced Output Sink and Source Capability
• Balanced Propagation Delays
• Overvoltage Tolerant (OVT) Input Pins
• This is a Pb−Free Device
A1 1
8 VCC
B1 2
7 Y1
Y2 3
6 B2
GND 4
5 A2
Figure 1. Pinout
IEEE/IEC
A1
B1
& Y1
A2
B2
Y2
Figure 2. Logic Symbol
© Semiconductor Components Industries, LLC, 2009
December, 2009 − Rev. 0
www.DataSheet.in
1
http://onsemi.com
MARKING
DIAGRAMS
1
ULLGA8
1.45 x 1.0
CASE 613AA
QM
G
1
ULLGA8
1.6 x 1.0
CASE 613AB
AJM
G
1
XX
M
G
ULLGA8
1.95 x 1.0
CASE 613AC
AHM
G
= Specific Device Code
= Date Code
= Pb−Free Package
PIN ASSIGNMENT
Pin Function
1 A1
2 B1
3 Y2
4 GND
5 A2
6 B2
7 Y1
8 VCC
FUNCTION TABLE
Y = AB
Inputs
Output
A BY
L LH
L HH
H LH
H HL
H = HIGH Logic Level
L = LOW Logic Level
ORDERING INFORMATION
See detailed ordering and shipping information in the package
dimensions section on page 4 of this data sheet.
Publication Order Number:
NLX2G00/D
1 page  
NLX2G00
PACKAGE DIMENSIONS
ULLGA8 1.45x1.0, 0.35P
CASE 613AA−01
ISSUE A
DA
B
ÉÉÉPIN ONE
REFERENCE
ÉÉÉÉÉÉ0.10 C
TOP VIEW
0.10 C
E
0.05 C
8X 0.05 C
SIDE VIEW
A1
A
SEATING
PLANE
C
e/2
1
L1
e
4
7X L NOTE 4
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSION b APPLIES TO PLATED TERMINAL
AND IS MEASURED BETWEEN 0.15 AND
0.30 mm FROM THE TERMINAL TIP.
4. A MAXIMUM OF 0.05 PULL BACK OF THE
PLATED TERMINAL FROM THE EDGE OF THE
PACKAGE IS ALLOWED.
MILLIMETERS
DIM MIN MAX
A −−− 0.40
A1 0.00 0.05
b 0.15 0.25
D 1.45 BSC
E 1.00 BSC
e 0.35 BSC
L 0.25 0.35
L1 0.30 0.40
MOUNTING FOOTPRINT
SOLDERMASK DEFINED*
7X
0.48
8X
0.22
1.18
85
BOTTOM VIEW
8X b
0.10 C A B
0.05 C NOTE 3
0.53 1
PKG
OUTLINE
0.35
PITCH
DIMENSIONS: MILLIMETERS
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
www.DataSheet.in
http://onsemi.com
5
5 Page | ||
| Páginas | Total 7 Páginas | |
| PDF Descargar | [ Datasheet NLX2G00.PDF ] | |
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