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PDF NLX2G16 Data sheet ( Hoja de datos )
| Número de pieza | NLX2G16 | |
| Descripción | Dual Buffer | |
| Fabricantes | ON Semiconductor | |
| Logotipo |  |
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NLX2G16
Dual Buffer
The NLX2G16 MiniGatet is an advanced high−speed CMOS dual
non−inverting buffer in ultra−small footprint.
The NLX2G16 input and output structures provide protection when
voltages up to 7.0 V are applied, regardless of the supply voltage.
Features
• High Speed: tPD = 1.8 ns (Typ) @ VCC = 5.0 V
• Designed for 1.65 V to 5.5 V VCC Operation
• Low Power Dissipation: ICC = 1 mA (Max) at TA = 25°C
• 24 mA Balanced Output Source and Sink Capability
• Balanced Propagation Delays
• Overvoltage Tolerant (OVT) Input and Output Pins
• Ultra−Small Packages
• NLV Prefix for Automotive and Other Applications Requiring
Unique Site and Control Change Requirements; AEC−Q100
Qualified and PPAP Capable
• These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS
Compliant
IN A1 1
6 OUT Y1
www.onsemi.com
MARKING
DIAGRAMS
UDFN6
1.0 x 1.0
CASE 517BX
M
1
UDFN6
1.2 x 1.0
CASE 517AA
M
1
UDFN6
1.45 x 1.0
CASE 517AQ
M
1
M = Date Code
GND 2
5 VCC
IN A2 3
4 OUT Y2
Figure 1. Pinout (Top View)
IN A1 1 OUT Y1
IN A2 1 OUT Y2
Figure 2. Logic Symbol
FUNCTION TABLE
AY
LL
HH
PIN ASSIGNMENT
1 IN A1
2 GND
3 IN A2
4 OUT Y2
5 VCC
6 OUT Y1
ORDERING INFORMATION
See detailed ordering and shipping information on page 4 of
this data sheet.
© Semiconductor Components Industries, LLC, 2016
June, 2016 − Rev. 7
1
Publication Order Number:
NLX2G16/D
1 page  
NLX2G16
PACKAGE DIMENSIONS
UDFN6, 1.2x1.0, 0.4P
CASE 517AA
ISSUE D
D
PIN ONE
REFERENCE
2X
0.10 C
ÉÉÉÉ
TOP VIEW
2X
0.10 C
0.10 C
10X 0.08 C
SIDE VIEW
A
B
E
(A3)
A
EDGE OF PACKAGE
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSION b APPLIES TO PLATED TERMINAL
L1 AND IS MEASURED BETWEEN 0.25 AND
0.30 mm FROM TERMINAL.
4. COPLANARITY APPLIES TO THE EXPOSED
DETAIL A
PAD AS WELL AS THE TERMINALS.
Bottom View
MILLIMETERS
(Optional)
DIM MIN MAX
A 0.45 0.55
EXPOSED Cu
MOLD CMPD
A1 0.00 0.05
A3 0.127 REF
ÉÉÉÉÉÉ
A1 DETAIL B
b 0.15 0.25
D 1.20 BSC
A3 E 1.00 BSC
e 0.40 BSC
L 0.30 0.40
L1 0.00 0.15
L2 0.40 0.50
Side View
(Optional) MOUNTING FOOTPRINT*
SEATING
PLANE
A1 C
6X
0.42
6X
0.22
5X L
13
L2
6X b
0.10 C A B
0.05 C NOTE 3
6
4
e
BOTTOM VIEW
0.40
PITCH
1.07
DIMENSIONS: MILLIMETERS
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
www.onsemi.com
5
5 Page | ||
| Páginas | Total 7 Páginas | |
| PDF Descargar | [ Datasheet NLX2G16.PDF ] | |
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