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AGLE3000 데이터시트 PDF




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부품번호 AGLE3000 기능
기능 IGLOOe Low-Power Flash FPGAs
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AGLE3000 데이터시트, 핀배열, 회로
v1.2
IGLOOe Low-Power Flash FPGAs
with Flash*Freeze Technology
®
Features and Benefits
Low Power
• 1.2 V to 1.5 V Core Voltage Support for Low Power
• Supports Single-Voltage System Operation
• Low-Power Active FPGA Operation
• Flash*Freeze Technology Enables Ultra-Low Power
Consumption while Maintaining FPGA Content
• Flash*Freeze Pin Allows Easy Entry to / Exit from Ultra-Low-
Power Flash*Freeze Mode
High Capacity
• 600 k to 3 Million System Gates
• 108 to 504 kbits of True Dual-Port SRAM
• Up to 620 User I/Os
Reprogrammable Flash Technology
• 130-nm, 7-Layer Metal (6 Copper), Flash-Based CMOS Process
• Live-at-Power-Up (LAPU) Level 0 Support
• Single-Chip Solution
• Retains Programmed Design when Powered Off
In-System Programming (ISP) and Security
• Secure ISP Using On-Chip 128-Bit Advanced Encryption
Standard (AES) Decryption via JTAG (IEEE 1532–compliant)
• FlashLock® to Secure FPGA Contents
High-Performance Routing Hierarchy
• Segmented, Hierarchical Routing and Clock Structure
• High-Performance, Low-Skew Global Network
• Architecture Supports Ultra-High Utilization
Pro (Professional) I/O
• 700 Mbps DDR, LVDS-Capable I/Os
• 1.2 V, 1.5 V, 1.8 V, 2.5 V, and 3.3 V Mixed-Voltage Operation
• Bank-Selectable I/O Voltages—Up to 8 Banks per Chip
• Single-Ended I/O Standards: LVTTL, LVCMOS 3.3 V /
2.5 V / 1.8 V / 1.5 V / 1.2 V, 3.3 V PCI / 3.3 V PCI-X, and
LVCMOS 2.5 V / 5.0 V Input
• Differential I/O Standards: LVPECL, LVDS, B-LVDS, and
M-LVDS
• Voltage-Referenced I/O Standards: GTL+ 2.5 V / 3.3 V, GTL
2.5 V / 3.3 V, HSTL Class I and II, SSTL2 Class I and II, SSTL3
Class I and II
• I/O Registers on Input, Output, and Enable Paths
• Programmable Output Slew Rate and Drive Strength
• Programmable Input Delay
• Schmitt Trigger Option on Single-Ended Inputs
• Weak Pull-Up/-Down
• IEEE 1149.1 (JTAG) Boundary Scan Test
• Pin-Compatible Packages across the IGLOO®e Family
Clock Conditioning Circuit (CCC) and PLL
• Six CCC Blocks, Each with an Integrated PLL
• Configurable Phase Shift, Multiply/Divide, Delay
Capabilities, and External Feedback
• Wide Input Frequency Range (1.5 MHz up to 250 MHz)
Embedded Memory
• 1 kbit of FlashROM User Nonvolatile Memory
• SRAMs and FIFOs with Variable-Aspect-Ratio 4,608-Bit RAM
Blocks (×1, ×2, ×4, ×9, and ×18 organizations available)
• True Dual-Port SRAM (except ×18)
ARM Processor Support in IGLOOe FPGAs
• M1 IGLOOe Devices—Cortex™-M1 Soft Processor Available
with or without Debug
IGLOOe Product Family
IGLOOe Devices
AGLE600
AGLE3000
ARM-Enabled IGLOOe Devices
M1AGLE3000
System Gates
600 k
3M
VersaTiles (D-flip-flops)
13,824
75,264
Quiescent Current (typical) in Flash*Freeze Mode (µW)
49
137
RAM kbits (1,024 bits)
108 504
4,608-Bit Blocks
24 112
FlashROM Bits
1k 1k
Secure (AES) ISP
Yes Yes
CCCs with Integrated PLLs
VersaNet Globals1
66
18 18
I/O Banks
88
Maximum User I/Os
270 620
Package Pins
FBGA
FG256, FG484
FG484, FG896
Notes:
1. Refer to the Cortex-M1 Handbook for more information.
2. Six chip (main) and twelve quadrant global networks are available.
3. For devices supporting lower densities, refer to the IGLOO Low-Power Flash FPGAs with Flash*Freeze Technology handbook.
October 2008
© 2008 Actel Corporation
www.DataSheet.in
I




AGLE3000 pdf, 반도체, 판매, 대치품
Temperature Grade Offerings
AGLE600
Package
FG256
C, I
FG484
C, I
FG896
Note: C = Commercial temperature range: 0°C to 70°C ambient temperature.
I = Industrial temperature range: –40°C to 85°C ambient temperature.
AGLE3000
M1AGLPE3000
C, I
C, I
Speed Grade and Temperature Grade Matrix
Temperature Grade
C2
I3
–F 1 Std.
✓✓
Notes:
1. The characteristics provided for the –F speed grade are subject to change after establishing FPGA specifications. Some
restrictions might be added and will be reflected in future revisions of this document. The –F speed grade is only
supported in the commercial temperature range.
2. C = Commercial temperature range: 0°C to 70°C ambient temperature.
3. I = Industrial temperature range: –40°C to 85°C ambient temperature.
References made to IGLOOe devices also apply to ARM-enabled IGLOOe devices. The ARM-enabled part numbers start with
M1 (Cortex-M1).
Contact your local Actel representative for device availability: http://www.actel.com/contact/default.aspx.
IV
www.DataSheet.in
v1.2

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AGLE3000 전자부품, 판매, 대치품
IGLOOe Low-Power Flash FPGAs
Reduced Cost of Ownership
Advantages to the designer extend beyond low unit cost, performance, and ease of use. Unlike
SRAM-based FPGAs, Flash-based IGLOOe devices allow all functionality to be live at power-up; no
external boot PROM is required. On-board security mechanisms prevent access to all the
programming information and enable secure remote updates of the FPGA logic. Designers can
perform secure remote in-system reprogramming to support future design iterations and field
upgrades with confidence that valuable intellectual property cannot be compromised or copied.
Secure ISP can be performed using the industry-standard AES algorithm. The IGLOOe family device
architecture mitigates the need for ASIC migration at higher user volumes. This makes the IGLOOe
family a cost-effective ASIC replacement solution, especially for applications in the consumer,
networking/communications, computing, and avionics markets.
Firm-Error Immunity
Firm errors occur most commonly when high-energy neutrons, generated in the upper atmosphere,
strike a configuration cell of an SRAM FPGA. The energy of the collision can change the state of the
configuration cell and thus change the logic, routing, or I/O behavior in an unpredictable way.
These errors are impossible to prevent in SRAM FPGAs. The consequence of this type of error can be
a complete system failure. Firm errors do not exist in the configuration memory of IGLOOe flash-
based FPGAs. Once it is programmed, the flash cell configuration element of IGLOOe FPGAs cannot
be altered by high-energy neutrons and is therefore immune to them. Recoverable (or soft) errors
occur in the user data SRAM of all FPGA devices. These can easily be mitigated by using error
detection and correction (EDAC) circuitry built into the FPGA fabric.
Advanced Flash Technology
The IGLOOe family offers many benefits, including nonvolatility and reprogrammability, through
an advanced flash-based, 130-nm LVCMOS process with seven layers of metal. Standard CMOS
design techniques are used to implement logic and control functions. The combination of fine
granularity, enhanced flexible routing resources, and abundant flash switches allows for very high
logic utilization without compromising device routability or performance. Logic functions within
the device are interconnected through a four-level routing hierarchy.
IGLOOe family FPGAs utilize design and process techniques to minimize power consumption in all
modes of operation.
Advanced Architecture
The proprietary IGLOOe architecture provides granularity comparable to standard-cell ASICs. The
IGLOOe device consists of five distinct and programmable architectural features (Figure 1-1 on
page 4):
• Flash*Freeze technology
• FPGA VersaTiles
• Dedicated FlashROM
• Dedicated SRAM/FIFO memory
• Extensive CCCs and PLLs
• Pro I/O structure
The FPGA core consists of a sea of VersaTiles. Each VersaTile can be configured as a three-input
logic function, a D-flip-flop (with or without enable), or a latch by programming the appropriate
flash switch interconnections. The versatility of the IGLOOe core tile as either a three-input lookup
table (LUT) equivalent or a D-flip-flop/latch with enable allows for efficient use of the FPGA fabric.
The VersaTile capability is unique to the Actel ProASIC® family of third-generation-architecture
flash FPGAs. VersaTiles are connected with any of the four levels of routing hierarchy. Flash
switches are distributed throughout the device to provide nonvolatile, reconfigurable interconnect
programming. Maximum core utilization is possible for virtually any design.
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v1.2
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