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PDF WT-Z224V-AU4 Data sheet ( Hoja de datos )
| Número de pieza | WT-Z224V-AU4 | |
| Descripción | Zener Diode Chips(Dual Pad) | |
| Fabricantes | Weitron Technology | |
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WT-Z224V-AU4
Zener Diode Chips (Dual Pad) for ESD Bidrectional Protection
1. Feature:
1-1 This specification applies to N/P/N silicon zener double diodes chips,
Device NO. WT-Z224V-AU4
2. Structure:
2-1. Planar type : N/P/N Diode.
2-2. Electrodes :
Top side : Gold pad.
Back side : Gold Layer.
3. Size:
3-1. Chip size : 24 mils x 24 mils (609.6 μm x 609.6 μm).
3-2. Chip thickness :7.87 ± 1.0 mils (200 ± 2.54 μm).
3-3. Bonding pad : 19.3 mils x 19.3 mils (490 μm x 490 μm) .
3-4. Pattern drawing : Refer to the attached drawing.
* Including scribing line. The chip size is about 23mil(585μm) after dicing.
4. Electrical Characteristics (TA=25˚C)
Parameter
Symbol
Leakage Current
Idf
Idr
Condition
V=4V
H=0mW/cm2
V=5V
H=0mW/cm2
V=4V
H=0mW/cm2
V=5V
H=0mW/cm2
Min. Typ. Max. Unit
- - 100 nA
- - 0.5 µA
- - 100 nA
- - 0.5 µA
Zener Voltage
Maximum
Zener Current
Vz(forward)
Vz(reverse)
IZM
Izf=5mA
H=0mW/cm2
Izf=5mA
H=0mW/cm2
5.5
5.3
-
- 7.0
V
- 6.8
- 750 mA
Electrostatic
Discharge
ESD
HBM
MIL-STD883
8.0
-
- KV
5. Annotation :
5-1. Parallel with one LED
5-2. Single pad (one wire bonding applied only)
5-3. Double direction Zener diode protection
6. Drawing:
7. Protection Circuit:
Bonding pad
Top side
(Top View)
N
P
N
www.DataSheet4U.com
Back Side
LED
PROTECTION
ZENER
Bonding pad
WEITRON TECHNOLOGY CO., LTD.
TEL:886-2-29148158
FAX:886-2-29106796
Http://www.weitron.com.tw
Rev.A 08-Mar-07
1 page | ||
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