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PDF SKY77518-21 Data sheet ( Hoja de datos )

Número de pieza SKY77518-21
Descripción FEM FOR DUAL-BAND GSM/GPRS
Fabricantes Skyworks 
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DATA SHEET
SKY77518-21 TX–RX iPACFEM for Dual-Band GSM/GPRS
Applications
Dual-band cellular handsets
encompassing
- Class 4 GSM900
- DCS1800
- Class 12 GPRS multi-slot
operation
Features
High efficiency
- GSM900 48%
- DCS 41%
Low transmit supply current
- GSM900 1.26 A
- DCS1800 0.9 A
Internal ICC sense resistor for iPAC
Closed loop iPAC
50 Ω matched Input/Output
TX–VCO-to-antenna and antenna-
to-RX-SAW filter RF interface
TX harmonics below –33 dBm
PHEMT RF switches afford high
linearity, low insertion loss, and
less than 20 μA supply current in
receive modes
Small outline: 6 mm x 8 mm
Low profile: 1.2 mm
Compatible with multiple logic
families
Low APC current: 25 μA
Description
The SKY77518-21 is a transmit and receive front-end module (FEM) with Integrated Power
Amplifier Control (iPAC) for dual-band cellular handsets comprising GSM900 and DCS1800
operation. Designed in a low profile, compact form factor, the SKY77518-21 offers a complete
Transmit VCO-to-Antenna and Antenna-to-Receive SAW filter solution. The FEM also supports
Class 12 General Packet Radio Service (GPRS) multi-slot operation.
The module consists of a GSM900 PA block and a DCS1800 PA block, impedance-matching
circuitry for 50 Ω input and output impedances, TX harmonics filtering, high linearity and low
insertion loss PHEMT RF switches, diplexer and a Power Amplifier Control (PAC) block with
internal current sense resistor. A custom BiCMOS integrated circuit provides the internal PAC
function and decoder circuitry to control the RF switches. The two Heterojunction Bipolar
Transistor (HBT) PA blocks are fabricated onto a single Gallium Arsenide (GaAs) die. One PA
block supports the GSM900 band and the other PA block supports the DCS1800 band. Both PA
blocks share common power supply pads to distribute current. The output of each PA block
and the outputs to the two receive pads are connected to the antenna pad through PHEMT RF
switches and a diplexer. The GaAs die, PHEMT die, Silicon (Si) die and passive components are
mounted on a multi-layer laminate substrate. The assembly is encapsulated with plastic
overmold.
Band selection and control of transmit and receive modes are performed using two external
control pads. Refer to the functional block diagram in Figure 1 below. The band select pad (BS)
selects between GSM and DCS modes of operation. The transmit enable (TX_EN) pad controls
receive or transmit mode of the respective RF switch (TX = logic 1). Proper timing between
transmit enable (TX_EN) and Analog Power Control (VRAMP) allows for high isolation between
the antenna and TX-VCO while the VCO is being tuned prior to the transmit burst.
The SKY77518-21 is compatible with logic levels from 1.2 V to VCC for BS and TX_EN pads,
depending on the level applied to the VLOGIC pad. This feature provides additional flexibility for
the designer in the selection of FEM interface control logic.
www.DataSheet4U.com
Figure 1. Functional Block Diagram
Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • [email protected] • www.skyworksinc.com
200786A • Skyworks Proprietary and Confidential Information • Products and Product Information are Subject to Change Without Notice. • November 6, 2007
1

1 page




SKY77518-21 pdf
SKY77518-21 TX–RX iPACFEM FOR DUAL-BAND GSM/GPRS
DATA SHEET
Table 4. SKY77518-21 Electrical Specifications 1 (3 of 5)
GSM900 Mode (f = 880 to 915 MHz and PIN = 0 to 6 dBm) [continued]
Parameter
Spurious
Symbol
Spur
Load mismatch
Load
RX Band Spurious
RX_SPUR
Power control dynamic range
PCDR
Power control
variation
Control level 5-15
(VCC 3.3 V)
PCV
Control level 16-19
Test Condition
All combinations of the following
parameters:
VRAMP = controlled 2
PIN = min. to max.
VCC = 2.7 V to 4.8 V
Load VSWR = 12:1, all phase angles
All combinations of the following
parameters:
VRAMP = controlled 2
PIN = min. to max.
VCC = 2.7 V to 4.8 V
Load VSWR = 20:1, all phase angles
At f0 + 20 MHz (935 to 960 MHz)
RBW = 100 kHz
VCC = 3.3 V
5 dBm POUT 33 dBm
TCASE = 25 °C
At f0 + 10 MHz (925 to 935 MHz)
RBW = 100 kHz
VCC = 3.3 V
TCASE = 25 °C
5 dBm POUT 33 dBm
At 1805 to 1880 MHz
RBW = 100 kHz
VCC = 3.3 V
TCASE = 25 °C
5 dBm POUT 33 dBm
POUT 13 to 33 dBm
TCASE = 25 °C
POUT 13 to 33 dBm
POUT 5 to 11 dBm
TCASE = 25 °C
POUT 5 to 11 dBm
Minimum Typical Maximum
Units
No parasitic oscillation > –36 dBm
No module damage or permanent degradation
–84 –83
–80 –76 dBm
–101 –84
30 50
–1.0
–1.5
–2.0
–3.5
1.0
1.5
2.0
3.5
dB
dB
Power control slope
PCS 5 to 33 dBm
GSM900 RECEIVE (f = 925 to 960 MHz) Mode = GSM_RX
150 dB/V
Parameter
Frequency range
Insertion Loss, ANT to GSM_RX 4
VSWR ANT, GSM_RX 4
Symbol
F
ILGSM_RX
ΓIN, ΓOUT
Test Condition
Minimum
925
Typical
1.0
1.2:1
Maximum
960
1.3
1.5:1
Units
MHz
dB
www.DataSheet4U.com
Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • [email protected] • www.skyworksinc.com
200786A • Skyworks Proprietary and Confidential Information • Products and Product Information are Subject to Change Without Notice. • November 6, 2007
5

5 Page





SKY77518-21 arduino
SKY77518-21 TX–RX iPACFEM FOR DUAL-BAND GSM/GPRS
DATA SHEET
1 20 19 18 17 16
VLOGIC 2
VRAMP 3
TX_EN 4
BS 5
GROUND PAD
15 GND
14 GND
13 GND
12 GND
6 7 8 9 10 11
Pin layout as seen from top view looking through the package.
200472_005
Figure 5. SKY77518-21 FEM Package Pad Configuration – 20-
Pad Leadless (Top View)
Table 5. SKY77518-21 Pad Names and Signal Descriptions
Pad Name
Description
1 VBATT
2 VLOGIC
3 VRAMP
4 TX_EN
5 BS
6 DCS_RX
7 GSM_RX
8 GND
9 GND
10 GND
11 ANT
12 GND
13 GND
14 GND
15 GND
16 GND
17 GSM_IN
www.Data1S8heetN4CU.com
19 DCS_IN
20 GND
GND PADS GROUND GRID
Battery input voltage
Control logic level selection/Standby control
Analog power control voltage input
TX / RX select (mode control)
Band Select (mode control)
DCS Receive RF Output (1805-1880 MHz)
GSM Receive RF Output (920-960 MHz)
RF and DC Ground
RF and DC Ground
RF and DC Ground
RF_IN / RF_OUT to Antenna
RF and DC Ground
RF and DC Ground
RF and DC Ground
RF and DC Ground
RF and DC Ground
RF input 880–915 MHz
No Connect
RF input 1710–1785 MHz
RF and DC Ground
Ground Pads, module underside
Figure 6. Typical Case Markings
Package and Handling Information
Because of its sensitivity to moisture absorption, this device
package is baked and vacuum-packed prior to shipment.
Instructions on the shipping container label must be followed
regarding exposure to moisture after the container seal is broken,
otherwise, problems related to moisture absorption may occur
when the part is subjected to high temperature during solder
assembly.
The SKY77518-21 is capable of withstanding an MSL3/250 °C
solder reflow. Care must be taken when attaching this product,
whether it is done manually or in a production solder reflow
environment. If the part is attached in a reflow oven, the
temperature ramp rate should not exceed 3 °C per second;
maximum temperature should not exceed 250 °C. If the part is
manually attached, precaution should be taken to insure that the
part is not subjected to temperatures exceeding 250 °C for more
than 10 seconds. For details on attachment techniques,
precautions, and handling procedures recommended by
Skyworks, please refer to Skyworks Application Note: PCB Design
and SMT Assembly/Rework, Document Number 101752.
Additional information on standard SMT reflow profiles can also
be found in the JEDEC Joint Industry Standard J-STD-020.
Production quantities of this product are shipped in the standard
tape-and-reel format (see Figure 7). For additional packaging
details, refer to Skyworks Application Note: Tape and Reel
Information – RF Modules, Document Number 101568.
Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • [email protected] • www.skyworksinc.com
200786A • Skyworks Proprietary and Confidential Information • Products and Product Information are Subject to Change Without Notice. • November 6, 2007
11

11 Page







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