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PDF CSPRC032A Data sheet ( Hoja de datos )
| Número de pieza | CSPRC032A | |
| Descripción | 4 Channel EMI Filter Network | |
| Fabricantes | California Micro Devices | |
| Logotipo |  |
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CSPRC032A
4 Channel EMI Filter Network
Features
• 4 EMI filter lines per device
• Filters attenuate to –30dB at 3GHz
• CSP package minimizes cross-talk
• 9-bump 2.485mm X 0.985mm Chip Scale
Package (CSP), 0.5mm pitch
• 0.30mm Eutectic solder bumps
• Ultra small footprint suitable for portable devices
• Lead-free version available
Applications
• EMI filtering for RF sections of wireless devices
• Cellular phones
• Cordless phones
• Internet appliances
• PDAs
• Laptop computers
Product Description
The CSPRC032A is a 4-channel low pass EMI filter (R-
C-R configuration) in a Chip Scale Package (CSP).
Many portable applications require the attenuation of
signals in the 800-3000 MHz band. California Micro
Devices’ unique thin film technology provides a mini-
mum of –25dB of attenuation over this frequency band.
The bump size and pitch of these filters are selected
such that the device can be placed directly on an FR4
printed circuit board using conventional assembly tech-
niques. The pin-out for the device features a signal
‘flow through’ design, allowing optimal signal routing.
The solder bump contacts are a 63/37 Sn/Pb alloy (Sn/
Ag/Cu for lead-free finish) and are 0.30 mm in diame-
ter.
The CSPRC032A is available in a space-saving, low-
profile Chip Scale Package with optional lead-free fin-
ishing.
Electrical Schematic
A1 50Ω
R
50Ω
CR
43pF
B1
A2 50Ω GND 50Ω B2
R CR
43pF
GND
B3
www.DataSheet4U.com
GND
A4 50Ω
50Ω B4
R CR
43pF
GND
A5 50Ω
50Ω B5
R CR
43pF
GND
© 2005 California Micro Devices Corp. All rights reserved.
11/09/05
490 N. McCarthy Blvd., Milpitas, CA 95035-5112 ● Tel: 408.263.3214 ● Fax: 408.263.7846 ● www.cmd.com
1
1 page  
CSPRC032A
Mechanical Details
CSP Mechanical Specifications
The CSPRC032A is offered in a custom Chip Scale
Package (CSP). Dimensions are presented below. For
complete information on CMD’s Chip Scale Packaging,
see the California Micro Devices CSP Package Infor-
mation document.
PACKAGE DIMENSIONS
Package
Custom CSP
Bumps
9
Millimeters
Dim
Min Nom Max
Inches
Min Nom Max
A1 0.940 0.985 1.030 0.0370 0.0388 0.0406
A2 2.440 2.485 2.530 0.0961 0.0978 0.0996
B1 0.495 0.500 0.505 0.0195 0.0197 0.0199
B2 0.495 0.500 0.505 0.0195 0.0197 0.0199
C1 0.1925 0.2425 0.2925 0.0076 0.0095 0.0115
C2 0.1925 0.2425 0.2925 0.0076 0.0095 0.0115
D1 0.561 0.605 0.649 0.0221 0.0238 0.0256
D2 0.355 0.380 0.405 0.0140 0.0150 0.0160
# per tape
and reel
3500 pieces
Controlling dimension: millimeters
Mechanical Package Diagrams
BOTTOM VIEW
A1
C1
B1
SIDE
VIEW
5
4
3
2 BA
1
BA
0.30 DIA.
63/37 Sn/Pb (Eutectic) or
D1
D2
96.8/2.6/0.6 Sn/Ag/Cu (Lead-free)
SOLDER BUMPS
DIMENSIONS IN MILLIMETERS
Package Dimensions for
CSPRC032A 9-bump Chip Scale Package
CSP Tape and Reel Specifications
PART NUMBER
CSPRC032A
PKG. SIZE (mm)
2.485 X 0.985 X 0.605
POCKET SIZE (mm)
B0 X A0 X K0
2.62 X 1.12 X 0.762
TAPE WIDTH
W
8mm
REEL
DIA.
178mm (7")
Top
Cover
Tape
Ko
Po
Ao
Bo
10 Pitches Cumulative
±To0l.e2ramnmce On Tape
W
www.DataSheet4U.com
For tape feeder reference
only including draft.
Concentric around B.
Embossment
P1
User Direction of Feed
Center Lines
of Cavity
Figure 4. Tape and Reel Mechanical Data
QTY
PER
REEL
3500
P0 P1
4mm 4mm
© 2005 California Micro Devices Corp. All rights reserved.
11/09/05
490 N. McCarthy Blvd., Milpitas, CA 95035-5112 ● Tel: 408.263.3214 ● Fax: 408.263.7846 ● www.cmd.com
5
5 Page | ||
| Páginas | Total 5 Páginas | |
| PDF Descargar | [ Datasheet CSPRC032A.PDF ] | |
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