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CNZ1021 데이터시트 PDF




Panasonic Semiconductor에서 제조한 전자 부품 CNZ1021은 전자 산업 및 응용 분야에서
광범위하게 사용되는 반도체 소자입니다.


 

PDF 형식의 CNZ1021 자료 제공

부품번호 CNZ1021 기능
기능 (CNZ1021 / CNZ1023) Photo lnterrupter
제조업체 Panasonic Semiconductor
로고 Panasonic Semiconductor 로고


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CNZ1021 데이터시트, 핀배열, 회로
Transmissive Photosensors (Photo lnterrupters)
CNZ1021 (ON1021), CNZ1023 (ON1023),
CNA1009H (ON1024)
Photo lnterrupter
For contactless SW, object detection
Overview
CNZ1021, CNZ1023 and CNA1009H are a transmis-
sive photosensor in which a high efficiency GaAs infra-
red light emitting diode is used as the light emitting ele-
ment, and a high sensitivity phototransistor is used as
the light detecting element. The two elements are ar-
ranged so as to face each other, and objects passing be-
tween them are detected.
Features
Highly precise position detection: 0.25 mm
Gap width: 3 mm (CNZ1021, CNZ1023)
5 mm (CNA1009H)
The type directly attached to PCB ....... CNZ1021
Screw-fastened type (one side) ............ CNZ1023
The type directly attached to PCB ....... CNA1009H
(with a positioning pins)
CNZ1021
Unit: mm CNZ1023
Unit: mm
Σ
12.0
3.0±0.15
A
5.0
0.4±0.1
(C1.2)
Device
center
CNA1009H
A'
(7.6)
(2-0.45)
23
14
(2-0.45)
(2.54)
SEC. A-A'
1: Anode
2: Cathode
3: Collector
4: Emitter
PISTR104-001 Package
Unit: mm
Σ
Σ
2.0
12.0
3.0±0.15
A
Device
center
0.4±0.1
(4-R2)
18.0
12.0±0.15
5.0
(C1.2)
2-R1.5
A'
(7.6)
(2-0.45)
φ3.0+-00.15
23
14
0.5
3.5
(2-0.45)
(2.54)
SEC. A-A'
1: Anode
2: Cathode
3: Collector
4: Emitter
PISTR104-003 Package
14.0
5.0±0.15
A
0.5±0.1
6.0
5.0
(C1)
Device
center
A'
(10.0)
(2-0.45)
23
1
2.35±0.1
4
6.6±0.1
2-φ0.7±0.1
(2-0.45)
(2.54)
SEC. A-A'
1: Anode
2: Cathode
3: Collector
4: Emitter
PISTR104-004 Package
(Note) 1. Tolerance unless otherwise specified is ±0.3
2. ( ) Dimension is reference
Note) The part numbers in the parenthesis show conventional part number.
Publication date: April 2004
SHG00017BED
1




CNZ1021 pdf, 반도체, 판매, 대치품
Caution for Safety
DANGER
This product contains Gallium Arsenide (GaAs).
GaAs powder and vapor are hazardous to human health if inhaled or
ingested. Do not burn, destroy, cut, cleave off, or chemically dis-
solve the product. Follow related laws and ordinances for disposal.
The product should be excluded form general industrial waste or
household garbage.
Request for your special attention and precautions in using the technical information
and semiconductors described in this material
(1) An export permit needs to be obtained from the competent authorities of the Japanese Government if any of
the products or technical information described in this material and controlled under the "Foreign Exchange
and Foreign Trade Law" is to be exported or taken out of Japan.
(2) The technical information described in this material is limited to showing representative characteristics and
applied circuits examples of the products. It neither warrants non-infringement of intellectual property right
or any other rights owned by our company or a third party, nor grants any license.
(3) We are not liable for the infringement of rights owned by a third party arising out of the use of the technical
information as described in this material.
(4) The products described in this material are intended to be used for standard applications or general elec-
tronic equipment (such as office equipment, communications equipment, measuring instruments and house-
hold appliances).
Consult our sales staff in advance for information on the following applications:
Special applications (such as for airplanes, aerospace, automobiles, traffic control equipment, combus-
tion equipment, life support systems and safety devices) in which exceptional quality and reliability are
required, or if the failure or malfunction of the products may directly jeopardize life or harm the human
body.
Any applications other than the standard applications intended.
(5) The products and product specifications described in this material are subject to change without notice for
modification and/or improvement. At the final stage of your design, purchasing, or use of the products,
therefore, ask for the most up-to-date Product Standards in advance to make sure that the latest specifica-
tions satisfy your requirements.
(6) When designing your equipment, comply with the guaranteed values, in particular those of maximum rat-
ing, the range of operating power supply voltage, and heat radiation characteristics. Otherwise, we will not
be liable for any defect which may arise later in your equipment.
Even when the products are used within the guaranteed values, take into the consideration of incidence of
break down and failure mode, possible to occur to semiconductor products. Measures on the systems such
as redundant design, arresting the spread of fire or preventing glitch are recommended in order to prevent
physical injury, fire, social damages, for example, by using the products.
(7) When using products for which damp-proof packing is required, observe the conditions (including shelf life
and amount of time let standing of unsealed items) agreed upon when specification sheets are individually
exchanged.
(8) This material may be not reprinted or reproduced whether wholly or partially, without the prior written
permission of Matsushita Electric Industrial Co., Ltd.
2003 SEP

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