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PDF ADP194 Data sheet ( Hoja de datos )
| Número de pieza | ADP194 | |
| Descripción | High-Side Power Switch | |
| Fabricantes | Analog Devices | |
| Logotipo |  |
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FEATURES
Low RDSON of 80 mΩ at 1.8 V
Low input voltage range: 1.1 V to 3.6 V
500 mA continuous operating current
Built-in level shift for control logic that can be operated
by 1.2 V logic
Low 2 μA (maximum) ground current
Ultralow shutdown current <0.7 μA
Reverse current blocking
Ultrasmall 0.8 mm × 0.8 mm × 0.5mm, 4-ball, 0.4 mm
pitch WLCSP
APPLICATIONS
Mobile phones
Digital cameras and audio devices
Portable and battery-powered equipment
GENERAL DESCRIPTION
The ADP194 is a high-side load switch designed for operation
from 1.1 V to 3.6 V and is protected against reverse current flow
from output to input. This load switch provides power domain
isolation for extended power battery life. The device contains a
low on-resistance P-channel MOSFET that supports more than
500 mA of continuous load current and minimizes power loss.
The low 2 μA (maximum) ground current and ultralow shut-
down current make the ADP194 ideal for battery-operated
Logic Controlled,
High-Side Power Switch
ADP194
TYPICAL APPLICATIONS CIRCUIT
ADP194
VIN
+
– GND
REVERSE
POLARITY
PROTECTION
VOUT
EN
ON
OFF
LEVEL SHIFT
AND SLEW
RATE CONTROL
LOAD
Figure 1.
portable equipment. The built-in level shifter in the enable logic
input makes the ADP194 compatible with modern processors
and GPIO controllers.
Beyond operating performance, the ADP194 occupies minimal
printed circuit board (PCB) space with an area of less than
0.64 mm2 and a height of 0.50 mm. The ADP194 is available in
an ultrasmall 0.8 mm × 0.8 mm, 4-ball, 0.4 mm pitch WLCSP.
Rev. 0
Information furnished by Analog Devices is believed to be accurate and reliable. However, no
responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other
rights of third parties that may result from its use. Specifications subject to change without notice. No
license is granted by implication or otherwise under any patent or patent rights of Analog Devices.
Trademarksandregisteredtrademarksarethepropertyoftheirrespectiveowners.
One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106, U.S.A.
Tel: 781.329.4700
www.analog.com
Fax: 781.461.3113
©2011 Analog Devices, Inc. All rights reserved.
1 page  
PIN CONFIGURATION AND FUNCTION DESCRIPTIONS
12
A VIN
VOUT
TOP VIEW
(Not to Scale)
B EN
GND
Figure 3. Pin Configuration
ADP194
Table 4. Pin Function Descriptions
Pin No.
Mnemonic
Description
A1 VIN
Input Voltage.
B1 EN
Enable Input. Drive EN high to turn on the switch; drive EN low to turn off the switch.
A2 VOUT
Output Voltage.
B2 GND
Ground.
Rev. 0 | Page 5 of 12
5 Page 
THERMAL CONSIDERATIONS
In most applications, the ADP194 does not dissipate much heat
due to its low on-channel resistance. However, in applications
with high ambient temperature and high load current, the heat
dissipated in the package can cause the junction temperature of
the die to exceed the maximum junction temperature of 125°C.
The junction temperature of the die is the sum of the ambient
temperature of the environment and the temperature rise of the
package due to the power dissipation, as shown in Equation 1.
To guarantee reliable operation, the junction temperature of
the ADP194 must not exceed 125°C. To ensure that the junction
temperature stays below this maximum value, the user must be
aware of the parameters that contribute to junction temperature
changes. These parameters include ambient temperature, power
dissipation in the device, and thermal resistances between the
junction and ambient air (θJA). The θJA value is dependent on
the package assembly compounds that are used and the amount
of copper used to solder the package GND pin to the PCB.
Table 5 shows typical θJA values of the 4-ball WLCSP for various
PCB copper sizes. Table 6 shows the typical ΨJB value of the
4-ball WLCSP.
Table 5. Typical θJA Values for WLCSP
Copper Size (mm2)
θJA (°C/W)
01 260
50 159
100 157
300 153
500 151
1 Device soldered to minimum size pin traces.
Table 6. Typical ΨJB Values
Package
ΨJB
4-Ball WLCSP
58.4
Unit
°C/W
The junction temperature of the ADP194 is calculated from the
following equation:
TJ = TA + (PD × θJA)
(1)
where:
TA is the ambient temperature.
PD is the power dissipation in the die, given by
PD = [(VIN − VOUT) × ILOAD] + (VIN × IGND)
(2)
where:
ILOAD is the load current.
IGND is the ground current.
VIN and VOUT are the input and output voltages, respectively.
ADP194
Power dissipation due to ground current is quite small and
can be ignored. Therefore, the junction temperature equation
simplifies to the following:
TJ = TA + {[(VIN − VOUT) × ILOAD] × θJA}
(3)
In cases where the board temperature is known, use the thermal
characterization parameter, ΨJB, to estimate the junction temper-
ature rise. Maximum junction temperature (TJ) is calculated
from the board temperature (TB) and power dissipation (PD)
using the formula
TJ = TB + (PD × ΨJB)
(4)
PCB LAYOUT CONSIDERATIONS
The heat dissipation capability of the package can be improved
by increasing the amount of copper attached to the pins of the
ADP194. However, as listed in Table 5, a point of diminishing
returns is eventually reached, beyond which an increase in the
copper size does not yield significant heat dissipation benefits.
It is critical to keep the input and output traces as wide and as
short as possible to minimize the circuit board trace resistance.
Figure 25. ADP194 PCB Layout
Rev. 0 | Page 11 of 12
11 Page | ||
| Páginas | Total 12 Páginas | |
| PDF Descargar | [ Datasheet ADP194.PDF ] | |
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