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부품번호 ADP2147 기능
기능 Buck Regulator
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ADP2147 데이터시트, 핀배열, 회로
www.DataSheet4U.net
FEATURES
Input voltage: 2.3 V to 5.5 V
Peak efficiency: 95%
3 MHz fixed frequency operation
Low quiescent current: 23 μA
Ultralow shutdown current: 0.2 μA (typical)
VSEL pin for simple dynamic voltage scaling (DVS)
100% duty cycle low dropout mode
Internal synchronous rectifier, compensation, and soft start
Current overload and thermal shutdown protection
Small, 6-ball, 1 mm × 1.5 mm WLCSP package
APPLICATIONS
PDAs and palmtop computers
Wireless handsets
Digital audio portable media players
Digital cameras, GPS navigation units
Low power portable medical equipment
Compact, 800 mA, 3 MHz,
Simple DVS, Buck Regulator
ADP2147
GENERAL DESCRIPTION
The ADP2147 is a high efficiency, low quiescent current, step-
down (buck) dc-to-dc regulator with an output voltage that can
be switched between two different settings under the control of
a select pin. The total solution requires only three tiny external
components.
The buck regulator automatically switches operating modes,
depending on the load current level, to maximize efficiency. At
high output loads, the buck regulator operates in PWM mode.
When the load current falls below a predefined threshold, the
regulator operates in power save mode (PSM), improving the
light-load efficiency.
The ADP2147 runs on input voltages of 2.3 V to 5.5 V, which
allows for single lithium or lithium polymer cells, multiple
alkaline or NiMH cells, PCMCIA, USB, and other standard
power sources. The maximum load current of 800 mA is
achievable across the input voltage range.
The ADP2147 is available with fixed output voltages from 0.8 V
to 3.3 V. All versions include an internal power switch and
synchronous rectifier for minimal external part count and high
efficiency. The ADP2147 has an internal soft start and is
internally compensated. During logic controlled shutdown, the
input is disconnected from the output, and the ADP2147 draws
less than 0.2 μA (typical) from the power source.
Other key features include undervoltage lockout to prevent deep
battery discharge and soft start to prevent input current over-
shoot at startup. The ADP2147 is available in a 6-ball WLCSP.
TYPICAL APPLICATIONS CIRCUIT
2.3V TO 5.5V
4.7µF
VIN SW
ADP2147
1.0µH
VOUT
4.7µF
ON
OFF
EN
VOUT
VOUT_H
VOUT_L
VSEL
GND
Figure 1.
Rev. 0
Information furnished by Analog Devices is believed to be accurate and reliable. However, no
responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other
rights of third parties that may result from its use. Specifications subject to change without notice. No
license is granted by implication or otherwise under any patent or patent rights of Analog Devices.
Trademarksandregisteredtrademarksarethepropertyoftheirrespectiveowners.
One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106, U.S.A.
Tel: 781.329.4700
www.analog.com
Fax: 781.461.3113
©2011 Analog Devices, Inc. All rights reserved.




ADP2147 pdf, 반도체, 판매, 대치품
ADP2147
ABSOLUTE MAXIMUM RATINGS
Table 3.
Parameter
VIN, EN, VSEL
VOUT, SW to GND
Temperature Range
Operating Ambient
Operating Junction
Storage Temperature
Lead Temperature Range
Soldering (10 sec)
Vapor Phase (60 sec)
Infrared (15 sec)
ESD Model
Human Body
Charged Device
Machine
Rating
−0.4 V to +6.5 V
−1.0 V to (VIN + 0.2 V)
−40°C to +85°C
−40°C to +125°C
−65°C to +150°C
−65°C to +150°C
300°C
215°C
220°C
±1500 V
±500 V
±100 V
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. These are stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
THERMAL DATA
Absolute maximum ratings apply individually only, not in
combination.
The ADP2147 can be damaged if the junction temperature limit is
exceeded. Monitoring ambient temperature does not guarantee
that the junction temperature (TJ) is within the specified
temperature limit. In applications with high power dissipation
and poor thermal resistance, the maximum ambient temperature
may need to be derated. In applications with moderate power
dissipation and low printed circuit board (PCB) thermal
resistance, the maximum ambient temperature can exceed the
maximum limit if the junction temperature is within specification
limits. The junction temperature (TJ) of the device is dependent
on the ambient temperature (TA), the power dissipation of the
device (PD), and the junction-to-ambient thermal resistance of the
package (θJA). Maximum junction temperature (TJ) is calculated
from the ambient temperature (TA) and power dissipation (PD)
using the following formula:
TJ = TA + (PD × θJA)
Junction-to-ambient thermal resistance (θJA) of the package is
based on modeling and calculation using a 4-layer board. The
junction-to-ambient thermal resistance is highly dependent on
the application and board layout. In applications where high
maximum power dissipation exists, close attention to thermal
board design is required. The value of θJA may vary, depending on
PCB material, layout, and environmental conditions. The specified
values of θJA are based on a 4-layer, 4 in. × 3 in. circuit board. Refer
to JEDEC JESD 51-9 for detailed information pertaining to board
construction. For additional information, see the AN-617
Application Note, MicroCSP™ Wafer Level Chip Scale Package.
ΨJB is the junction-to-board thermal characterization parameter
measured in units of °C/W. The package ΨJB is based on modeling
and calculation using a 4-layer board. The JESD51-12, Guidelines
for Reporting and Using Package Thermal Information, states that
thermal characterization parameters are not the same as thermal
resistances. ΨJB measures the component power flowing through
multiple thermal paths rather than through a single path, which
is the procedure for measuring thermal resistance, θJB. There-
fore, ΨJB thermal paths include convection from the top of the
package as well as radiation from the package, factors that make
ΨJB more useful in real-world applications than θJB. Maximum
junction temperature (TJ) is calculated from the board temperature
(TB) and power dissipation (PD) using the formula:
TJ = TB + (PD × ΨJB)
Refer to JEDEC JESD51-8 and JESD51-12 for more detailed
information about ΨJB.
THERMAL RESISTANCE
θJA and ΨJB are specified for the worst-case conditions, that is, a
device soldered in a circuit board for surface-mount packages.
Table 4. Thermal Resistance
Package Type
θJA ΨJB Unit
6-Ball WLCSP
170 80
°C/W
ESD CAUTION
Rev. 0 | Page 4 of 16

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ADP2147 전자부품, 판매, 대치품
3.5
+25°C
3.4 +85°C
+125°C
3.3 –40°C
3.2
3.1
3.0
2.9
2.8
2.7
2.6
2.5
0.1 0.2 0.3 0.4 0.5 0.6 0.7
IOUT (A)
Figure 9. Frequency vs. Output Current, Across Temperature,
VOUT = 1.8 V
3.5
VIN = 2.3V
3.4 VIN = 3.6V
3.3
VIN = 4.2V
VIN = 5.5V
3.2
3.1
3.0
2.9
2.8
2.7
2.6
2.5
0.1 0.2 0.3 0.4 0.5 0.6 0.7
IOUT (A)
Figure 10. Frequency vs. Output Current, Across Supply Voltage,
VOUT = 1.8 V
90
IOUT = 100µA
80 IOUT = 25mA
IOUT = 500mA
70
60
50
40
30
20
10
0
2.3 2.8 3.3 3.8 4.3 4.8 5.3
INPUT VOLTAGE (V)
Figure 11. Output Voltage Ripple vs. Input Voltage,
Across Output Current, VOUT = 1.8 V
ADP2147
350
–40°C
+25°C
300 +125°C
250
200
150
100
50
0
2.3 2.8 3.3 3.8 4.3 4.8 5.3
INPUT VOLTAGE (V)
Figure 12. RDSON PFET vs. Input Voltage, Across Temperature
250
–40°C
+25°C
+125°C
200
150
100
50
0
2.3 2.8 3.3 3.8 4.3 4.8 5.3
INPUT VOLTAGE (V)
Figure 13. RDSON NFET vs. Input Voltage, Across Temperature
T
SW
4
VOUT
1
IOUT
2
CH1 100mV
CH2 250mA
CH4 5.00V
M 40.0µs A CH2
T 26.00%
215mA
Figure 14. Response to Load Transient, 150 mA to 500 mA,
VOUT = 1.8 V
Rev. 0 | Page 7 of 16

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