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PDF 35XS3500 Data sheet ( Hoja de datos )
| Número de pieza | 35XS3500 | |
| Descripción | Smart Rear Corner Light Switch | |
| Fabricantes | Freescale Semiconductor | |
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Freescale Semiconductor
Advance Information
Document Number: MC35XS3500
Rev. 4.0, 5/2011
Smart Rear Corner Light Switch
(Penta 35 mΩ)
35XS3500
The 35XS3500 is designed for low-voltage automotive and
industrial lighting applications. Its five low RDS(ON) MOSFETs (five
35 mΩ) can control the high sides of five separate resistive loads
(bulbs and LEDs).
Programming, control, and diagnostics are accomplished using a
16-bit SPI interface (3.3 V or 5.0 V). Each output has its own PWM
control via the SPI. The 35XS3500 has highly sophisticated failure
mode handling to provide high availability of the outputs. Its
multiphase control and output edge shaping improves
electromagnetic compatibility (EMC) behavior.
The 35XS3500 is packaged in a power-enhanced 12 x 12
nonleaded Power QFN package with exposed tabs.
HIGH SIDE SWITCH
Features
ww•w.PDaetnaStahe3et54Um.nΩet high side switches
• 16-bit SPI communication interface with daisy chain capability
• Current sense output with SPI-programmable multiplex switch
and Board Temperature Feedback
• Digital diagnosis feature
• PWM module with multiphase feature including prescaler
• LEDs control including accurate current sensing and low duty-
cycle capability
• Fully protected switches
• Over-current shutdown detection
• Power net and reverse polarity protection
• Low-power mode
• Fail mode functions including auto restart feature
• External smart power switch control including current recopy
• Lead-free packaging designated by suffix code PNA
Bottom View
PNA SUFFIX
98ART10511D
24-PIN PQFN
PB FREE
ORDERING INFORMATION
Device
MC35XS3500PNA
Temperature
Range (TA)
-40 to 125 °C
Package
24 PQFN
12V 5.0V
Watchdog
MCU
12V
35XS3500
VCC
VBAT
LIMP
FLASHER
STOP
IGN
RST
CLOCK
CS
CP
OUT1
OUT2
OUT3
OUT4
OUT5
S0
SI FETIN
SCLK
FETOUT
CSNS GND
Smart
Switch
Figure 1. 35XS3500 Simplified Application Diagram
* This document contains certain information on a new product.
Specifications and information herein are subject to change without notice.
© Freescale Semiconductor, Inc., 2010-2011. All rights reserved.
1 page  
ELECTRICAL CHARACTERISTICS
MAXIMUM RATINGS
ELECTRICAL CHARACTERISTICS
MAXIMUM RATINGS
Table 2. Maximum Ratings
All voltages are with respect to ground unless otherwise noted. Exceeding these ratings may cause a malfunction or
permanent damage to the device.
Rating
Symbol
Value
Unit
ELECTRICAL RATINGS
Over-voltage Test Range
Maximum Operation Voltage
Load Dump (400 ms) @ 25 °C
VBAT
V
28
40
Reverse Polarity Voltage Range
2.0 Min @ 25 °C
VBAT
V
- 18
VCC Supply Voltage
Output Voltage
Positive
Negative (ground disconnected)
VCC
VOUT
-0.3 to 5.5
40
-16
V
V
Digital Input Current in Clamping Mode (SI, SCLK, CS, IGN, FLASHER,
STOP, LIMP)
IIN
±1.0 mA
FETIN Input Current
IFETIN
+10 mA
-1.0
SO and FETOUT Output Voltage
Outputs clamp energy using single pulse method (L = 2.0 mH; R = 0 Ω;
VBAT = 14 V @ 150 °C initial)
ESD Voltage(2)
Human Body Model (HBM) OUT[1:5], VPWR, and GND
Charge Device Model (CDM)
Corner Pins (1,13,19,21)
All Other Pins (2-12, 14-18, 20, 22-24)
VSO
E
VESD
-0.3 to VCC+0.3
30
± 2000
± 8000
± 750
± 500
V
mJ
V
THERMAL RATINGS
Operating Temperature
Ambient
Junction
Peak Pin Reflow Temperature During Solder Mounting(3)
TA
TJ
TSOLDER
-40 to 125
-40 to 150
260
°C
°C
Storage Temperature
TSTG
-55 to 150
°C
THERMAL RESISTANCE
Thermal Resistance, Junction to Case(4)
RθJC
1.0 °C/W
Notes
2. ESD testing is performed in accordance with the Human Body Model (HBM) (CZAP = 100 pF, RZAP = 1500 Ω) and the Charge Device
Model.
3. Pin soldering temperature limit is for 40 seconds maximum duration. Not designed for immersion soldering. Exceeding these limits may
cause malfunction or permanent damage to the device. If the qualification fails, TSOLDER will be changed for 240 °C.
4. Typical value is guaranteed per design.
Analog Integrated Circuit Device Data
Freescale Semiconductor
35XS3500
5
5 Page 
ELECTRICAL CHARACTERISTICS
STATIC ELECTRICAL CHARACTERISTICS
Table 3. Static Electrical Characteristics (continued)
Characteristics noted under conditions 3.0 V ≤ VCC ≤ 5.5 V, 7.0 V ≤ VBAT ≤ 20 V, -40 °C ≤ TA ≤ 125 °C, unless otherwise noted.
Typical values noted reflect the approximate parameter mean at TA = 25 °C under nominal conditions, unless otherwise noted.
Characteristic
Symbol
Min Typ Max Unit
STOP LIGHT (OUT4)
Output Drain-to-Source ON Resistance (IOUT = 2.8 A, TA = 25 °C)
VBAT = 13.5 V
VBAT = 7.0 V
Output Drain-to-Source ON Resistance (IOUT = 2.8 A, VBAT = 13.5 V,
TA = 150 °C)(28)
RDS(ON)25
mΩ
– – 35
– – 55
RDS(ON)150
mΩ
– – 59.5
Output Drain-to-Source ON Resistance (IOUT = 1.5 A, TA = 25 °C) for LED
Control = 1
VBAT = 13.5 V
VBAT = 7.0 V
RDS(ON)25_LED
–
–
mΩ
– 70
– 110
Output Drain-to-Source ON Resistance (IOUT =1.5 A, VBAT = 13.5 V,
TA = 150 °C) for LED Control = 1
RDS(ON)150_LED
–
mΩ
– 119
Reverse Source-to-Drain ON Resistance (IOUT = -2.8 A, VBAT = -12 V,
TA = 25 °C)(29)
High Over-current Shutdown Threshold 1
VBAT = 16 V, TA = -40 °C
VBAT = 16 V, TA = 25 °C
VBAT = 16 V, TA = 125 °C
High Over-current Shutdown Threshold 2
Low Over-current Shutdown Threshold
Open Load Current Threshold in ON State(30)
Open Load Current Threshold in ON State with LED(31)
VOL = VBAT - 0.5 V
Current Sense Full-scale Range(32)
Current Sense Full-scale Range(22) depending on LED Control = 1
Severe short-circuit impedance range(28)
RDS(ON)25
IOCHI1
IOCHI2
IOCLO
IOL
IOLLED
ICS FSR
ICS FSR_LED
RSC1(OUT4)
– – 70 mΩ
28.0
30.2
35.0
36.0
43.5 A
41.8
29.4 35.0 40.6
28.3 33.8 39.3
12.3 15.4 18.5 A
5.7 7.2 8.9 A
0.05 0.2
0.5 A
4.0 10
mA
20
– 6.0 – A
– 1.6
350
–A
mΩ
FLASHER (OUT5)
Output Drain-to-Source ON Resistance (IOUT = 2.8 A, TA = 25 °C)
VBAT = 13.5 V
VBAT = 7.0 V
Output Drain-to-Source ON Resistance (IOUT = 2.8 A, VBAT = 13.5 V,
TA = 150 °C)(28)
RDS(ON)25
mΩ
– – 35
– – 55
RDS(ON)150
mΩ
– – 59.5
Reverse Source-to-Drain ON Resistance (IOUT = -2.8 A, VBAT = -12 V,
TA = 25 °C)(29)
RSD(ON)25 – – 70
Notes
28. Parameter guaranteed by design; however, it is not production tested.
29. Source-to-Drain ON Resistance (Reverse Drain-to-Source ON Resistance) with negative polarity VBAT.
30. OLLED3, bit D2 in SI data is set to [0]
31. OLLED3, bit D2 in SI data is set to [1]
32. For a typical value of ICS FSR, ICSNS = 5.0 mA. If the range is exceeded, no current clamp and the precision is not guaranteed.
mΩ
Analog Integrated Circuit Device Data
Freescale Semiconductor
35XS3500
11
11 Page | ||
| Páginas | Total 30 Páginas | |
| PDF Descargar | [ Datasheet 35XS3500.PDF ] | |
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