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PDF PRTR5V0U2AX Data sheet ( Hoja de datos )
| Número de pieza | PRTR5V0U2AX | |
| Descripción | Ultra low capacitance double rail-to-rail ESD protection diode | |
| Fabricantes | NXP Semiconductors | |
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PRTR5V0U2AX
Ultra low capacitance double rail-to-rail ESD protection diode
in a SOT143B package
Rev. 02 — 21 December 2006
Product data sheet
www.DataSheet4U.net
1. Product profile
1.1 General description
Ultra low capacitance double rail-to-rail ElectroStatic Discharge (ESD) protection diode in
a small SOT143B Surface-Mounted Device (SMD) plastic package designed to protect
two high-speed data lines or high frequency signal lines from the damage caused by ESD
and other transients.
PRTR5V0U2AX incorporates two pairs of ultra low capacitance rail-to-rail diodes as well
as an additional ESD protection diode to ensure signal line protection even if no supply
voltage is available.
1.2 Features
I ESD protection of two high-speed data lines or high frequency signal lines
I Ultra low input/output to ground capacitance: C(I/O-GND) = 1.8 pF
I ESD protection up to 12 kV
I IEC 61000-4-2, level 4 (ESD)
I Very low clamping voltage due to an integrated additional ESD protection diode
I Very low leakage current
I Small 4 lead SOT143B SMD plastic package
1.3 Applications
I USB 2.0 ports
I Digital Video Interface (DVI) / High Definition Multimedia Interface (HDMI) interfaces
I Mobile and cordless phones
I Personal Digital Assistants (PDA)
I Digital cameras
I Wide Area Network (WAN) / Local Area Network (LAN) systems
I PCs, notebooks, printers and other PC peripherals
1 page  
NXP Semiconductors
PRTR5V0U2AX
Ultra low capacitance double rail-to-rail ESD protection diode
7. Application information
Handling data rates up to 480 Mbit/s, USB 2.0 interfaces require ESD protection devices
with an extremely low line capacitance in order to avoid signal distortion.
With a capacitance of only 1.8 pF, the NXP PRTR5V0U2AX offers IEC 61000-4-2, level 4
compliant ESD protection.
The PRTR5V0U2AX integrates two ultra-low capacitance rail-to-rail ESD protection
diodes and an additional ESD protection diode in a small 4 lead SOT143B package.
The additional ESD protection diode connected between ground and VCC prevents
charging of the supply.
To achieve the maximum ESD protection level, no additional external capacitors are
required.
USB controller
common mode
D+ choke
D−
VBUS
protected IC/device
VBUS
D+
D−
GND
006aaa485
Fig 3. Application diagram: USB 2.0
Circuit board layout and protection device placement
Circuit board layout is critical for the suppression of ESD, Electrical Fast Transient (EFT)
and surge transients. The following guidelines are recommended:
1. Place the PRTR5V0U2AX as close to the input terminal or connector as possible.
2. The path length between the PRTR5V0U2AX and the protected line should be
minimized.
3. Keep parallel signal paths to a minimum.
4. Avoid running protected conductors in parallel with unprotected conductors.
5. Minimize all printed-circuit board conductive loops including power and ground loops.
6. Minimize the length of the transient return path to ground.
7. Avoid using shared transient return paths to a common ground point.
8. Ground planes should be used whenever possible. For multilayer printed-circuit
boards, use ground vias.
PRTR5V0U2AX_2
Product data sheet
Rev. 02 — 21 December 2006
© NXP B.V. 2006. All rights reserved.
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