XQR2V1000 Datasheet PDF - Xilinx
| Part Number | XQR2V1000 | |
| Description | QPro Virtex-II 1.5V Radiation Hardened QML Platform FPGAs | |
| Manufacturers | Xilinx | |
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0
R QPro Virtex-II 1.5V Radiation
Hardened QML Platform FPGAs
DS124 (v1.1) January 8, 2004
0 0 Product Specification
Summary of Radiation Hardened QPro™ Virtex™-II Features
• Industry First Radiation Hardened Platform FPGA
Solution
• Guaranteed total ionizing dose to 200K Rad(si)
• Latch-up immune to LET > 160 MeV-cm2/mg
• SEU in GEO upsets < 1.5E-6 per device day
achievable with recommended redundancy
implementation
• Certified to MIL-PRF-38535 (Qualified Manufacturer
Listing)
• Guaranteed over the full military temperature range
(–55° C to +125° C)
• Ceramic and Plastic Wire-Bond and Flip-Chip Grid
Array Packages
• IP-Immersion Architecture
- Densities from 1M to 6M system gates
- 300+ MHz internal clock speed (Advance Data)
- 622+ Mb/s I/O (Advance Data)
• SelectRAM™ Memory Hierarchy
- 2.5 Mb of dual-port RAM in 18 Kbit block
SelectRAM resources
- Up to 1 Mb of distributed SelectRAM resources
• High-Performance Interfaces to External Memory
- DRAM interfaces
· SDR/DDR SDRAM
· Network FCRAM
· Reduced Latency DRAM
- SRAM interfaces
· SDR/DDR SRAM
· QDR SRAM
- CAM interfaces
• Arithmetic Functions
- Dedicated 18-bit x 18-bit multiplier blocks
- Fast look-ahead carry logic chains
• Flexible Logic Resources
- Up to 67,584 internal registers/latches with Clock
Enable
- Up to 67,584 look-up tables (LUTs) or cascadable
16-bit shift registers
- Wide multiplexers and wide-input function support
- Horizontal cascade chain and sum-of-products
support
- Internal 3-state busing
• High-Performance Clock Management Circuitry
- Up to 12 DCM (Digital Clock Manager) modules
· Precise clock de-skew
· Flexible frequency synthesis
· High-resolution phase shifting
- 16 global clock multiplexer buffers
• Active Interconnect Technology
- Fourth generation segmented routing structure
- Predictable, fast routing delay, independent of
fanout
• SelectIO™-Ultra Technology
- Up to 824 user I/Os
- 19 single-ended and six differential standards
- Programmable sink current (2 mA to 24 mA) per
I/O
- Digitally Controlled Impedance (DCI) I/O: on-chip
termination resistors for single-ended I/O standards
- Differential Signaling
· 622 Mb/s Low-Voltage Differential Signaling I/O
(LVDS) with current mode drivers
· Bus LVDS I/O
· Lightning Data Transport (LDT) I/O with current
driver buffers
· Low-Voltage Positive Emitter-Coupled Logic
(LVPECL) I/O
· Built-in DDR input and output registers
- Proprietary high-performance SelectLink
Technology
· High-bandwidth data path
· Double Data Rate (DDR) link
· Web-based HDL generation methodology
• Supported by Xilinx Foundation Series™ and Alliance
Series™ Development Systems
- Integrated VHDL and Verilog design flows
- Compilation of 10M system gates designs
- Internet Team Design (ITD) tool
• SRAM-Based In-System Configuration
- Fast SelectMAP configuration
- IEEE 1532 support
- Partial reconfiguration
- Unlimited reprogrammability
- Readback capability
• 0.15 µm 8-Layer Metal Process with 0.12 µm
High-Speed Transistors
• 1.5V (VCCINT) Core Power Supply, Dedicated 3.3V
VCCAUX Auxiliary and VCCO I/O Power Supplies
• IEEE 1149.1 Compatible Boundary-Scan Logic Support
© 2004 Xilinx, Inc. All rights reserved. All Xilinx trademarks, registered trademarks, patents, and disclaimers are as listed at http://www.xilinx.com/legal.htm.
All other trademarks and registered trademarks are the property of their respective owners. All specifications are subject to change without notice.
DS124 (v1.1) January 8, 2004
Product Specification
www.xilinx.com
1-800-255-7778
1
Datasheet pdf - http://www.DataSheet4U.net/
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www.DataSheet.co.kr
R
QPro Virtex-II 1.5V Radiation Hardened QML Platform FPGAs
timing parameters, see QPro Virtex-II Switching Charac-
teristics, page 51.
Virtex-II devices have 16 global clock MUX buffers with up
to eight clock nets per quadrant. Each global clock MUX
buffer can select one of the two clock inputs and switch
glitch-free from one clock to the other. Each DCM block is
able to drive up to four of the 16 global clock MUX buffers.
Routing Resources
The IOB, CLB, block SelectRAM, multiplier, and DCM ele-
ments all use the same interconnect scheme and the same
access to the global routing matrix. Timing models are
shared, greatly improving the predictability of the perfor-
mance of high-speed designs.
There are a total of 16 global clock lines with eight available
per quadrant. In addition, 24 vertical and horizontal long
lines per row or column as well as massive secondary and
local routing resources provide fast interconnect. Virtex-II
buffered interconnects are relatively unaffected by net
fanout, and the interconnect layout is designed to minimize
crosstalk.
Horizontal and vertical routing resources for each row or
column include:
• 24 long lines
• 120 hex lines
• 40 double lines
• 16 direct connect lines (total in all four directions)
Boundary Scan
Boundary-scan instructions and associated data registers
support a standard methodology for accessing and config-
uring Virtex-II devices that complies with IEEE standards
1149.1 — 1993 and 1532. A system mode and a test mode
are implemented. In system mode, a Virtex-II device per-
forms its intended mission even while executing non-test
boundary-scan instructions. In test mode, boundary-scan
test instructions control the I/O pins for testing purposes.
The Virtex-II Test Access Port (TAP) supports BYPASS,
PRELOAD, SAMPLE, IDCODE, and USERCODE non-test
instructions. The EXTEST, INTEST, and HIGHZ test instruc-
tions are also supported.
Virtex-II Device/Package Combinations and Maximum I/O
Wire-bond and flip-chip packages are available. Table 5
shows the maximum possible number of user I/Os in
wire-bond and flip-chip packages. Table 6 shows the num-
ber of available user I/Os for all device/package combina-
tions.
• FG denotes wire-bond fine-pitch Plastic BGA (1.00 mm
pitch).
• BG denotes wire-bond standard Plastic BGA (1.27 mm
pitch).
• CG denotes wire-bond fine-pitch Hermetic Ceramic
Column Grid Array (1.27 mm pitch).
• CF denotes flip-chip fine-pitch non-Hermetic Ceramic
Column Grid Array (1.00 mm pitch).
The number of I/Os per package include all user I/Os except
the 15 control pins (CCLK, DONE, M0, M1, M2, PROG_B,
PWRDWN_B, TCK, TDI, TDO, TMS, HSWAP_EN, DXN,
DXP, and RSVD) and VBATT.
Table 5: Package Information
Package
Pitch (mm)
Size (mm)
FG456
1.00
23 x 23
BG575
1.27
31 x 31
BG728 & CG717
1.27
35 x 35
CF1144
1.00
35 x 35
Table 6: Virtex-II Device/Package Combinations and Maximum Number of Available I/Os
Available I/Os
Package
XQR2V1000
XQR2V3000
FG456
324
-
BG575
328
-
BG728
-
516
CG717
-
516
CF1144
-
-
Notes:
1. The BG728 and CG717 packages are pinout (footprint) compatible.
2. The CF1144 is pinout (footprint) compatible with the FF1152.
XQR2V6000
-
-
-
-
824
DS124 (v1.1) January 8, 2004
Product Specification
www.xilinx.com
1-800-255-7778
5
Datasheet pdf - http://www.DataSheet4U.net/
Preview 5 Page |
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| Download | [ XQR2V1000.PDF Datasheet ] | |
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