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PDF TLP781 Data sheet ( Hoja de datos )
| Número de pieza | TLP781 | |
| Descripción | GaAs IRED & Photo-Transistor | |
| Fabricantes | Toshiba Semiconductor | |
| Logotipo |  |
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Hay una vista previa y un enlace de descarga de TLP781 (archivo pdf) en la parte inferior de esta página. Total 15 Páginas | ||
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TLP781/TLP781F
TOSHIBA Photocoupler GaAs IRED & Photo−Transistor
TLP781, TLP781F
Office Equipment
Household Appliances
Solid State Relays
Switching Power Supplies
Various Controllers
Signal Transmission Between Different Voltage
Circuits
TLP781
Unit in mm
The TOSHIBA TLP781 consists of a silicone photo−transistor
optically coupled to a gallium arsenide infrared emitting diode in a
four lead plastic DIP (DIP4) with having high isolation voltage
(AC: 5kVRMS (min)).
• TLP781 : 7.62mm pitch type DIP4
• TLP781F : 10.16mm pitch type DIP4
• Collector-emitter voltage: 80V (min.)
• Current transfer ratio: 50% (min.)
Rank GB: 100% (min.)
• Isolation voltage: 5000Vrms (min.)
• UL recognized: UL1577, file No. E67349
• BSI approved: BS EN60065:2002
Approved no.8961
BS EN60950-1:2006
Approved no.8962
• SEMKO approval: EN60950-1,EN60065 under plan
• Option(D4)type
VDE approved : DIN EN60747-5-2
Certificate No. 40021173
(Note): When an EN60747-5-2 approved type is needed,
Please designate “Option (D4)”
• Construction mechanical rating
7.62mm Pitch
Standard Type
Creepage distance
6.5mm(min)
Clearance
6.5mm(min)
Insulation thickness
0.4mm(min)
10.16mm Pitch
TLPxxxF Type
8.0mm(min)
8.0mm(min)
0.4mm(min)
1
TOSHIBA
Weight: 0.25g (typ.)
TLP781F
Unit in mm
TOSHIBA
Weight: 0.25g (typ.)
Pin Configurations
(top view)
14
23
1 : Anode
2 : Cathode
3 : Emitter
4 : Collector
2007-12-05
Datasheet pdf - http://www.DataSheet4U.net/
1 page  
www.DataSheet.co.kr
TLP781/TLP781F
Specifications for Embossed-Tape Packing: (TP6), (TP7)
1. Applicable Package
Package Name
DIP4LF6
DIP4LF7
Product Type
TLP781
TLP781F
2. Product Naming System
Type of package used for shipment is denoted by a symbol suffix after a product number. The method of
classification is as below.
(Example 1)
ＴＬＰ７８１（ＢＬ－ＴＰ６）
(Example 2)
ＴＬＰ７８１F（ＢＬ－ＴＰ７）
Tape type
CTR rank
Device name
Tape type
CTR rank
Device name
3. Tape Dimensions
3.1 Orientation of Device in Relation to Direction of Tape Movement
Device orientation in the recesses is as shown in Figure 1.
Tape feed
Figure1 Device Orientation
3.2 Tape Packing Quantity:2000 devices per reel
3.3 Empty Device Recesses Are as Shown in Table 1.
Table1 Empty Device Recesses
Standard
Remarks
Occurrences of 2 or more
successive empty device
recesses
0
Within any given 40-mm section of
tape, not including leader and trailer
Single empty device
recesses
6 devices (max.) per reel
Not including leader and trailer
3.4 Start and End of Tape
The start of the tape has 30 or more empty holes. The end of the tape has 50 or more empty holes.
5 2007-12-05
Datasheet pdf - http://www.DataSheet4U.net/
5 Page 
www.DataSheet.co.kr
Insulation Related Specifications
TLP781/TLP781F
7.62mm pitch
TLPxxx type
10.16mm pitch
TLPxxxF type
Minimum creepage distance
Minimum clearance
Minimum insulation thickness
Comparative tracking index
Cr 6.5mm
8.0mm
Cl 6.5mm
8.0mm
ti 0.4 mm
CTI 175
(1) If a printed circuit is incorporated, the creepage distance and clearance may be reduced below this
value. (e.g.at a standard distance between soldering eye centres of 7.5mm). If this is not permissible,
the user shall take suitable measures.
(2) This photocoupler is suitable for ‘safe electrical isolation’ only within the safety limit data.
Maintenance of the safety data shall be ensured by means of protective circuits.
VDE test sign: Marking on product
for EN60747
4
Marking on packing
for EN60747
Marking Example: TLP781, TLP781F
Lot No.
P Device Name
CTR Rank Marking
4: Mark for option (D4)
1pin indication
11
2007-12-05
Datasheet pdf - http://www.DataSheet4U.net/
11 Page | ||
| Páginas | Total 15 Páginas | |
| PDF Descargar | [ Datasheet TLP781.PDF ] | |
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