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PDF LV8747T Data sheet ( Hoja de datos )
| Número de pieza | LV8747T | |
| Descripción | PWM Constant-Current Control Stepping Motor Driver and Switching Regulator Controller | |
| Fabricantes | Sanyo Semicon Device | |
| Logotipo |  |
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Hay una vista previa y un enlace de descarga de LV8747T (archivo pdf) en la parte inferior de esta página. Total 21 Páginas | ||
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Ordering number : ENA0967
LV8747T
Bi-CMOS LSI
PWM Constant-Current Control Stepping Motor
Driver and Switching Regulator Controller
Overview
The LV8747T is a PWM constant-current control stepping motor driver and switching regulator controller IC.
Features
• Two circuits of PWM constant-current control stepping motor driver incorporated
• Two circuits of switching regulator controller incorporated
• Motor driver control power incorporated
• Control of the stepping motor to W1-2 phase excitation possible
• Chopping frequency selectable
• Output short-circuit protection circuit incorporated
• High-precision reference voltage circuit incorporated
• Output-stage push-pull composition enabling high-speed operation
• Timer latch type short-circuit protection circuit incorporated
• Upper and lower regenerative diodes incorporated
• Thermal shutdown circuit incorporated
Specifications
Absolute Maximum Ratings at Ta = 25°C
Parameter
Supply voltage
Driver output peak current 1
Driver output continuous current 1
Driver output peak current 2
Driver output continuous current 2
Regulator output current
Symbol
VM max
MDIO peak1
MDIO max1
MDIO peak2
MDIO max2
SWIO max
Conditions
OUT1/OUT2 tw ≤ 10ms, duty 20%
OUT1/OUT2
OUT3/OUT4 tw ≤ 10ms, duty 20%
OUT3/OUT4
OUT5/OUT6 tw ≤ 1µs
Ratings
Unit
38 V
1.75 A
1.5 A
0.8 A
0.5 A
500 mA
Continued on next page.
Any and all SANYO Semiconductor Co.,Ltd. products described or contained herein are, with regard to
"standard application", intended for the use as general electronics equipment (home appliances, AV equipment,
communication device, office equipment, industrial equipment etc.). The products mentioned herein shall not be
intended for use for any "special application" (medical equipment whose purpose is to sustain life, aerospace
instrument, nuclear control device, burning appliances, transportation machine, traffic signal system, safety
equipment etc.) that shall require extremely high level of reliability and can directly threaten human lives in case
of failure or malfunction of the product or may cause harm to human bodies, nor shall they grant any guarantee
thereof. If you should intend to use our products for applications outside the standard applications of our
customer who is considering such use and/or outside the scope of our intended standard applications, please
consult with us prior to the intended use. If there is no consultation or inquiry before the intended use, our
customer shall be solely responsible for the use.
Specifications of any and all SANYO Semiconductor Co.,Ltd. products described or contained herein stipulate
the performance, characteristics, and functions of the described products in the independent state, and are not
guarantees of the performance, characteristics, and functions of the described products as mounted in the
customer's products or equipment. To verify symptoms and states that cannot be evaluated in an independent
device, the customer should always evaluate and test devices mounted in the customer's products or
equipment.
O1007 MS PC 20071001-S00003 No.A0967-1/21
Datasheet pdf - http://www.DataSheet4U.net/
1 page  
www.DataSheet.co.kr
LV8747T
Pd max – Ta
6.0
*1 With Exposed Die-Pad substrate
*2 Without Exposed Die-Pad
Four-layer substrate *1
4.85
4.0
Four-layer substrate *2
2.40
2.0
2.52
1.25
0
– 20 0
20 40 60 80 100
Ambient temperature, Ta – °C
Substrate Specifications (Substrate recommended for operation of LV8747T)
Size : 100mm × 100mm × 1.6mm (four-layer substrate [2S2P])
Material
: Glass epoxy
Copper wiring density : L1 = 85% / L4 = 90%
L1 : Copper wiring pattern diagram
L4 : Copper wiring pattern diagram
Cautions
1) The data for the case with the Exposed Die-Pad substrate mounted shows the values when 80% or more of the
Exposed Die-Pad is wet.
2) For the set design, employ the derating design with sufficient margin.
Stresses to be derated include the voltage, current, junction temperature, power loss, and mechanical stresses such as
vibration, impact, and tension.
Accordingly, the design must ensure these stresses to be as low or small as possible.
The guideline for ordinary derating is shown below :
(1)Maximum value 80% or less for the voltage rating
(2)Maximum value 80% or less for the current rating
(3)Maximum value 80% or less for the temperature rating
3) After the set design, be sure to verify the design with the actual product.
Confirm the solder joint state and verify also the reliability of solder joint for the Exposed Die-Pad, etc.
Any void or deterioration, if observed in the solder joint of these parts, causes deteriorated thermal conduction,
possibly resulting in thermal destruction of IC.
No.A0695-5/21
Datasheet pdf - http://www.DataSheet4U.net/
5 Page 
www.DataSheet.co.kr
Continued from preceding page.
Pin No.
Pin Name
40 VREF12
61 VREF34
39 CHOP
60 OCP
44 REG5
45 REG25
LV8747T
REG5
Equivalent Circuit
500Ω
GND
REG5
GND
REG5
1kΩ
GND
500Ω
VMSW
2kΩ
GND
REG5
26kΩ
VMSW
5kΩ
GND
Continued on next page.
No.A0695-11/21
Datasheet pdf - http://www.DataSheet4U.net/
11 Page | ||
| Páginas | Total 21 Páginas | |
| PDF Descargar | [ Datasheet LV8747T.PDF ] | |
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