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PDF MKP385 Data sheet ( Hoja de datos )

Número de pieza MKP385
Descripción AC and Pulse Metallized Polypropylene
Fabricantes Vishay Siliconix 
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MKP 385
Vishay BCcomponents
AC and Pulse Metallized Polypropylene Film Capacitors
MKP Radial Potted Type
l
P
h
lt
W
Ø dt
10
l
h h'
F'
(1)
FH
W
Ø dt
FEATURES
7.5 mm bent back pitch, 10 mm and 15 mm lead pitch. Low
contact resistance. Low loss dielectric. Small dimensions for
high density packaging. Supplied loose in box and taped on
reel.
RoHS compliant product.
Dimensions in mm
(1) |F - F’| < 0.3 mm
F = 7.5 + 0.6/- 0.1 mm
15
ENCAPSULATION
Flame retardant plastic case and epoxy resin
UL-class 94 V-0
APPLICATIONS
Where steep pulses occur e.g. SMPS (switch mode power
supplies). Electronic lighting e.g. ballast. Motor control
circuits.
REFERENCE SPECIFICATIONS
IEC 60384-17
MARKING
C-value; tolerance; rated voltage; code for dielectric material;
manufacturer location; manufacturer's type; manufacturer’s
logo; year and week
DIELECTRIC
Polypropylene film
ELECTRODES
Metallized
CONSTRUCTION
Internal serial construction
RATED (DC) VOLTAGE
1600 V, 2000 V
RATED (AC) VOLTAGE
550 V, 700 V
RATED PEAK-TO-PEAK VOLTAGE
1600 V, 2000 V
CLIMATIC TESTING CLASS ACC. TO IEC 60068-1
55/110/56
CAPACITANCE RANGE (E24 SERIES)
0.00047 to 0.033 µF
CAPACITANCE TOLERANCE
±5%
LEADS
Tinned wire
RATED (DC) TEMPERATURE
85 °C
RATED (AC) TEMPERATURE
85 °C
MAXIMUM APPLICATION TEMPERATURE
110 °C
MAXIMUM OPERATING TEMPERATURE FOR
LIMITED TIME
125 °C
PERFORMANCE GRADE
Grade 1 (long life)
STABILITY GRADE
Grade 2
DETAIL SPECIFICATION
For more detailed data and test requirements contact:
Document Number: 28152
Revision: 13-Oct-08
For technical questions, contact: [email protected]
www.vishay.com
159
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MKP385 pdf
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MKP 385
AC and Pulse Metallized Polypropylene Film Capacitors Vishay BCcomponents
MKP Radial Potted Type
C
Dimensions
Mass
(µF)
w x h (h’) x l (mm)
(g) (1)
Pitch = 15 ± 0.4 mm; dt = 0.60 ± 0.06 mm
0.00047
0.00051
0.00056
0.00062
0.00068
0.00075
0.00082
0.00091
0.0010
0.0011
0.0012
0.0013
0.0015
0.0016
0.0018
5.0 x 11.0 (13.0) x 17.5
1.1
Pitch = 15 ± 0.4 mm; dt = 0.60 ± 0.06 mm
0.0020
0.0022
0.0024
0.0027
0.0030
0.0033
0.0036
0.0039
0.0043
0.0047
0.0051
0.0056
0.0062
0.0068
5.0 x 11.0 (13.0) x 17.5
6.0 x 12.0 (14.0) x 17.5
1.1
1.4
Pitch = 15 ± 0.4 mm; dt = 0.80 ± 0.08 mm
0.0075
0.0082
0.0091
7.0 x 13.5 (15.5) x 17.5
0.010
0.011
0.012
8.5 x 15.0 (17.0) x 17.5
0.013
0.015
0.016
0.018
10.0 x 16.5 (18.5) x 17.5
0.020
Notes
(1) Net weight for short lead component
(2) lt = 3.5 ± 0.3 mm for pitch = 15 mm
• SPQ = Standard Packing Quantity
2
2.5
3.3
CATALOG NUMBER BFC2 385 XXYYY AND PACKAGING
LOOSE IN BOX
REEL
AMMOPACK
Leads
3.5 + 1/
- 0.5 mm
(2)
XX
(SPQ)
Leads
25.0 ±
2.0 mm
XX
(SPQ)
Original
pitch
Pitch = 7.5 mm
(bent back)
Ø 500 mm
Ø 365
mm
XX
(SPQ)
Pitch =
15.0
XX
(SPQ)
XX
(SPQ)
Pitch = 7.5 mm
(bent back)
Original
pitch
Pitch =
7.5 mm
(bent back)
XX
(SPQ)
XX
(SPQ)
80...
(1250)
84...
(1000)
82...
(1100)
83...
(950)
85...
(550)
-
Pitch = Pitch = 7.5 mm
15.0 (bent back)
80…
(1250)
84…
(1000)
82…
(1100)
83…
(950)
85…
(550)
60…
(1250)
64…
(1000)
62…
(1100)
63…
(950)
65…
(550)
60…
(1000)
60…
(1000)
64…
(1000)
62…
(900)
63…
(800)
65…
(450)
Pitch =
15.0
Pitch = 7.5 mm
(bent back)
64…
(500)
62…
(800)
63…
(700)
65…
(400)
60…
(1000)
64…
(500)
62…
(650)
63…
(550)
65…
(300)
60…
(500)
64…
(500)
62…
(600)
63…
(500)
65…
(250)
-
-
C
VALUE
..YYY
471
511
561
621
681
751
821
911
102
112
122
132
152
162
182
202
222
242
272
302
332
362
392
432
472
512
562
622
682
752
822
912
103
113
123
133
153
163
183
203
Document Number: 28152
Revision: 13-Oct-08
For technical questions, contact: [email protected]
www.vishay.com
163
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MKP385 arduino
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MKP 385
AC and Pulse Metallized Polypropylene Film Capacitors Vishay BCcomponents
MKP Radial Potted Type
INSPECTION REQUIREMENTS
General Notes:
Sub-clause numbers of tests and performance requirements refer to the “Sectional Specification, Publication IEC 60384-17 and
Specific Reference Data”.
Group C Inspection Requirements
SUB-CLAUSE NUMBER AND TEST
CONDITIONS
PERFORMANCE REQUIREMENTS
SUB-GROUP C1A PART OF SAMPLE
OF SUB-GROUP C1
4.1 Dimensions (detail)
4.3.1 Initial measurements
4.3 Robustness of terminations
4.4 Resistance to soldering heat
4.14 Component solvent resistance
4.4.2 Final measurements
SUB-GROUP C1B PART OF SAMPLE
OF SUB-GROUP C1
4.6.1 Initial measurements
4.15 Solvent resistance of the marking
4.6 Rapid change of temperature
4.6.1 Inspection
4.7 Vibration
Capacitance
Tangent of loss angle at 100 kHz
Tensile: Load 10 N; 10 s
Bending: Load 5 N; 4 x 90°
Method: 1A
Solder bath: 280 °C ± 5 °C
Duration: 10 s
Isopropylalcohol at room temperature
Method: 2
Immersion time: 5 ± 0.5 min
Recovery time: Min. 1 h, max. 2 h
Visual examination
Capacitance
Tangent of loss angle
Capacitance
Tangent of loss angle at 100 kHz
Isopropylalcohol at room temperature
Method: 1
Rubbing material: cotton wool
Immersion time: 5 ± 0.5 min
θA = - 55 °C
θB = + 105 °C
5 cycles
Duration t = 30 min
Visual examination
Mounting:
See section “Mounting” of this specification
Procedure B4
Frequency range: 10 Hz to 55 Hz
Amplitude: 0.75 mm or
Acceleration 98 m/s²
(whichever is less severe)
Total duration 6 h
As specified in chapters “General Data” of
this specification
No visible damage
No visible damage
Legible marking
C/C| 1 % + 5 pF of the value measured
initially
Increase of tan δ: ≤ 0.0005
Compared to values measured in 4.3.1
No visible damage
Legible marking
No visible damage
Document Number: 28152
Revision: 13-Oct-08
For technical questions, contact: [email protected]
www.vishay.com
169
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