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부품번호 | VEMT3700F 기능 |
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기능 | Silicon NPN Phototransisto | ||
제조업체 | Vishay | ||
로고 | |||
전체 6 페이지수
www.DataSheet.co.kr
VEMT3700F
Vishay Semiconductors
Silicon NPN Phototransistor
19032
DESCRIPTION
VEMT3700F is a high speed silicon NPN epitaxial planar
phototransistor in a miniature PLCC-2 package. The
integrated daylight blocking filter is matched to 950 nm
IR emitters.
PRODUCT SUMMARY
COMPONENT
VEMT3700F
Ica (mA)
0.5
Note
• Test conditions see table “Basic Characteristics”
FEATURES
• Package type: surface mount
• Package form: PLCC-2
• Dimensions (L x W x H in mm): 3.5 x 2.8 x 1.75
• High radiant sensitivity
• Fast response times
• Daylight blocking filter matched with 870 nm to
950 nm emitters
• Angle of half sensitivity: ϕ = ± 60°
• Package notch indicates collector
• Package matched with IR emitter series VSML3710
• Floor life: 168 h, MSL 3, acc. J-STD-020
• Lead (Pb)-free reflow soldering
• Compliant to RoHS directive 2002/95/EC and in
accordance to WEEE 2002/96/EC
APPLICATIONS
• Photo interrupters
• Miniature switches
• Counters
• Encoders
• Position sensors
ϕ (deg)
± 60
λ0.5 (nm)
870 to 1050
ORDERING INFORMATION
ORDERING CODE
VEMT3700F-GS08
VEMT3700F-GS18
Note
• MOQ: minimum order quantity
PACKAGING
Tape and reel
Tape and reel
REMARKS
MOQ: 7500 pcs, 1500 pcs/reel
MOQ: 8000 pcs, 8000 pcs/reel
PACKAGE FORM
PLCC-2
PLCC-2
ABSOLUTE MAXIMUM RATINGS (Tamb = 25 °C, unless otherwise specified)
PARAMETER
TEST CONDITION
SYMBOL
Collector emitter voltage
Emitter collector voltage
Collector current
Collector peak current
Power dissipation
tp/T ≤ 0.1, tp ≤ 10 μs
Junction temperature
Operating temperature range
Storage temperature range
Soldering temperature
Acc. reflow solder profile fig. 10
Thermal resistance junction/ambient Soldered on PCB with pad dimensions: 4 mm x 4 mm
VCEO
VECO
IC
ICM
PV
Tj
Tamb
Tstg
Tsd
RthJA
VALUE
70
5
50
100
100
100
- 40 to + 100
- 40 to + 100
260
400
UNIT
V
V
mA
mA
mW
°C
°C
°C
°C
K/W
** Please see document “Vishay Material Category Policy”: www.vishay.com/doc?99902
Document Number: 81584
Rev. 1.6, 14-Jul-10
For technical questions, contact: [email protected]
www.vishay.com
1
Datasheet pdf - http://www.DataSheet4U.net/
www.DataSheet.co.kr
VEMT3700F
Vishay Semiconductors
Silicon NPN Phototransistor
PACKAGE DIMENSIONS in millimeters
Mounting Pad Layout
1.2 area covered with
solder resist
1.6 (1.9)
4
20873
SOLDER PROFILE
300
250
255 °C
240 °C
217 °C
200
150
max. 120 s
100
max. 260 °C
245 °C
max. 30 s
max. 100 s
50 max. ramp up 3 °C/s max. ramp down 6 °C/s
0
0 50 100 150 200 250 300
19841
Time (s)
Fig. 10 - Lead (Pb)-free Reflow Solder Profile acc. J-STD-020
DRYPACK
Devices are packed in moisture barrier bags (MBB) to
prevent the products from moisture absorption during
transportation and storage. Each bag contains a desiccant.
FLOOR LIFE
Floor life (time between soldering and removing from MBB)
must not exceed the time indicated on MBB label:
Floor life: 168 h
Conditions: Tamb < 30 °C, RH < 60 %
Moisture sensitivity level 3, acc. to J-STD-020.
DRYING
In case of moisture absorption devices should be baked
before soldering. Conditions see J-STD-020 or label.
Devices taped on reel dry using recommended conditions
192 h at 40 °C (+ 5 °C), RH < 5 %.
TAPE AND REEL
PLCC-2 components are packed in antistatic blister tape
(DIN IEC (CO) 564) for automatic component insertion.
Cavities of blister tape are covered with adhesive tape.
www.vishay.com
4
For technical questions, contact: [email protected]
Document Number: 81584
Rev. 1.6, 14-Jul-10
Datasheet pdf - http://www.DataSheet4U.net/
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부품번호 | 상세설명 및 기능 | 제조사 |
VEMT3700 | Silicon NPN Phototransisto | Vishay |
VEMT3700F | Silicon NPN Phototransisto | Vishay |
DataSheet.kr | 2020 | 연락처 | 링크모음 | 검색 | 사이트맵 |