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BD645CT PDF 데이터시트 : 부품 기능 및 핀배열

부품번호 BD645CT
기능 (BD640CT - BD6200CT) SURFACE MOUNT SCHOTTKY BARRIER RECTIFIERS
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BD645CT 데이터시트, 핀배열, 회로
www.DataSheet.co.kr
BD640CT~BD6200CT
SURFACE MOUNT SCHOTTKY BARRIER RECTIFIERS
VOLTAGE 40 to 200 Volts CURRENT 6.0 Amperes
FEATURES
• Plastic package has Underwriters Laboratory
Flammability Classification 94V-O
• For surface mounted applications
• Low profile package
• Built-in strain relief
• Low power loss, High efficiency
• High surge capacity
• For use in low voltage high frequency inverters, free wheeling, and
polarity protection applications
• High temperature soldering guaranteed:260oC/10 seconds at terminals
• In compliance with EU RoHS 2002/95/EC directives
MECHANICALDATA
• Case: TO-251AB molded plastic
• Terminals: Solder plated, solderable per MIL-STD-750,Method 2026
• Polarity: As marking
• Standard packaging: 16mm tape (EIA-481)
• Weight: 0.0104 ounces, 0.297grams.
TO-251AB
.264(6.7)
.248(6.3)
.216(5.5)
.200(5.1)
.032(0.8)
.012(0.3)
.09 .09
(2.3) (2.3)
Unit : inch (mm)
.098(2.5)
.082(2.1)
.024(0.6)
.016(0.4)
.071(1.8)
.051(1.3)
.02(0.5)
MAXIMUM RATINGS
Ratings at 25°C ambient temperature unless otherwise specified. Single phase, half wave, 60 Hz, resistive or inductive load.
For capacitive load, derate current by 20%
PARAMETER
S YMB OL BD640CT BD645CT BD650CT BD660CT BD680CT BD690CT BD6100CT BD6150CT BD6200CT UNITS
Maximum Recurrent Peak Reverse Voltage
V RRM
40
45
50
60 80 90 100 150 200 V
Maximum RMS Voltage
V RMS 28 31.5 35 42 56 6 3 7 0 1 0 5 1 4 0 V
Maximum DC Blocking Voltage
V DC 40 45 50 60 80 9 0 1 0 0 1 5 0 2 0 0 V
Maximum Average Forward Current (See Figure 1)
Peak Forward Surge Current :8.3ms single half sine-wave
superimposed on rated load(JEDEC method)
IF(AV)
IFSM
Maximum Forward Voltage at 3.0A per leg
Maximum DC Reverse Current TJ=25OC
at Rated DC Blocking Voltage TJ=100OC
VF
I
R
Typi cal Thermal Resi stance
R θJ C
0.70
0.75
6.0
75
0.80
0.05
20
5
0.90
A
A
V
mA
OC / W
Op e ra ti ng J unc ti o n a nd S to ra g e Te mp e ra ture Ra ng e
TJ,TSTG -55 to +150
-65 to +175
OC
Note: Both Bonding and Chip structure are available.
STAD-APR.30.2009
PAGE . 1
Datasheet pdf - http://www.DataSheet4U.net/






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