PDF W989D2CB Data sheet ( Hoja de datos )

Número de pieza	W989D2CB
Descripción	(W989D2CB / W989D6CB) 512Mb Mobile LPSDR
Fabricantes	Winbond
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No Preview Available ! www.DataSheet.co.kr W989D6CB / W989D2CB 512Mb Mobile LPSDR TABLE OF CONTENTS 1. GENERAL DESCRIPTION .......................................................................................................... 3 2. FEATURES.................................................................................................................................. 3 3. PIN CONFIGURATION................................................................................................................ 4 3.1 Ball Assignment: LPSDR X 16 ............................................................................................................4 3.2 Ball Assignment: LPSDR X 32 ............................................................................................................4 4. PIN DESCRIPTION...................................................................................................................... 5 4.1 Signal Description ...............................................................................................................................5 4.2 Addressing Table ................................................................................................................................5 5. BLOCK DIAGRAM ...................................................................................................................... 6 6. ELECTRICAL CHARACTERISTICS ........................................................................................... 7 6.1 Absolute Maximum Ratings ................................................................................................................7 6.2 Operating Conditions ..........................................................................................................................7 6.3 Capacitance ........................................................................................................................................7 6.4 DC Characteristics ..............................................................................................................................8 6.5 Automatic Temperature Compensated Self Refresh Current Feature ..............................................10 6.6 AC Characteristics And AC Operating Conditions ............................................................................11 6.6.1 AC Characteristics.................................................................................................................................... 11 6.6.2 AC Test Condition .................................................................................................................................... 12 6.6.3 AC Latency Characteristics...................................................................................................................... 13 7. FUNCTION DESCRIPTION ....................................................................................................... 14 7.1 Command Function...........................................................................................................................14 7.1.1Table 1. Truth Table .................................................................................................................................. 14 7.1.2 Functional Truth Table ............................................................................................................................. 15 7.1.3 Function Truth Table for CKE .................................................................................................................. 18 7.1.4 Bank Activate Command.......................................................................................................................... 19 7.1.5 Bank Precharge Command...................................................................................................................... 19 7.1.6 Precharge All Command .......................................................................................................................... 19 7.1.7 Write Command ....................................................................................................................................... 19 7.1.8 Write with Auto Precharge Command...................................................................................................... 19 7.1.9 Read Command ....................................................................................................................................... 19 7.1.10 Read with Auto Precharge Command.................................................................................................... 19 7.1.11 Extended Mode Register Set Command ............................................................................................... 19 7.1.12 Mode Register Set Command................................................................................................................ 20 7.1.13 No-Operation Command ........................................................................................................................ 20 7.1.14 Burst Stop Command............................................................................................................................. 20 7.1.15 Device Deselect Command.................................................................................................................... 20 7.1.16 Auto Refresh Command......................................................................................................................... 20 7.1.17 Self Refresh Entry Command ................................................................................................................ 20 7.1.18 Self Refresh Exit Command................................................................................................................... 20 7.1.19 Clock Suspend Mode Entry/Power Down Mode Entry Command......................................................... 20 7.1.20 Clock Suspend Mode Exit / Power Down Mode Exit Command............................................................ 20 7.1.21 Data Write/Output Enable, Data Mask/Output Disable Command ........................................................ 21 8.OPERATION............................................................................................................................... 21 8.1 Read Operation.................................................................................................................................21 8.2 Write Operation .................................................................................................................................21 8.3 Precharge .........................................................................................................................................22 8.3.1 Auto Precharge ........................................................................................................................................ 22 8.3.2 READ with auto precharge interrupted by a READ (with or without auto precharge) ............................. 22 8.3.3 READ with auto precharge interrupted by a WRITE (with or without auto precharge)............................ 23 8.3.4 WRITE with auto precharge interrupted by a READ (with or without auto precharge)............................ 24 8.3.5 WRITE with auto precharge interrupted by a WRITE (with or without auto precharge) .......................... 25 -1- Publication Release Date: Sep, 22, 2011 Revision A01-005 Datasheet pdf - http://www.DataSheet4U.net/ 1 page www.DataSheet.co.kr W989D6CB / W989D2CB 4. PIN DESCRIPTION 4.1 Signal Description BALL NAME A [n : 0] BA0, BA1 DQ0~DQ15 (×16) DQ0~DQ31 (×32) CS RAS CAS WE 512Mb Mobile LPSDR FUNCTION Address Bank Select DESCRIPTION Multiplexed pins for row and column address. A10 is Auto Precharge Select Select bank to activate during row address latch time, or bank to read/write during address latch time. Data Input/ Output Multiplexed pins for data output and input. Chip Select Row Address Strobe Column Address Strobe Write Enable Disable or enable the command decoder. When command decoder is disabled, new command is ignored and previous operation continues. Command input. When sampled at the rising edge of the clock, RAS , CAS and WE define the operation to be executed. Referred to RAS Referred to WE UDQM / LDQM(x16) DQM0 ~ DQM3 (x32) I/O Mask The output buffer is placed at Hi-Z (with latency of 2 in CL=2, 3;) when DQM is sampled high in read cycle. In write cycle, sampling DQM high will block the write operation with zero latency. CLK CKE VDD VSS VDDQ VSSQ NC Clock Inputs Clock Enable Power Ground Power for I/O Buffer Ground for I/O Buffer No Connection System clock used to sample inputs on the rising edge of clock. CKE controls the clock activation and deactivation. When CKE is low, Power Down mode, Suspend mode or Self Refresh mode is entered. Power supply for input buffers and logic circuit inside DRAM. Ground for input buffers and logic circuit inside DRAM. Power supply separated from VDD, used for output buffers to improve noise. Separated ground from VSS, used for output buffers to improve noise. No connection 4.2 Addressing Table ITEM Number of banks Bank address pins Auto precharge pin Row addresses X16 Column addresses Refresh count Row addresses x32 Column addresses Refresh count 512 Mb 4 BA0,BA1 A10/AP A0-A12 A0-A9 8K A0-A12 A0-A8 8K -5- Publication Release Date: Sep, 22, 2011 Revision A01-005 Datasheet pdf - http://www.DataSheet4U.net/ 5 Page www.DataSheet.co.kr W989D6CB / W989D2CB 6.6 AC Characteristics And AC Operating Conditions 6.6.1 AC Characteristics CL= CAS Latency; (Notes: 5,6,7) PARAMETER SYM Ref/Active to Ref/Active Command Period Active to precharge Command Period Active to Read/Write Command Delay Time Read/Write(a) to Read/Write(b)Command Period Precharge to Active Command Period Active(a) to Active(b) Command Period Write Recovery Time Write-Recovery Time (Last data to Read) CLK Cycle Time CL = 3 CL * = 2 CLK High Level width CLK Low Level width Access Time from CLK CL * = 3 CL * = 2 Output Data Hold Time Output Data High Impedance Time CL * = 3 CL * = 2 Output Data Low Impedance Time Power Down Mode Entry Time Transition Time of CLK (Rise and Fall) Data-in Set-up Time Data-in Hold Time Address Set-up Time Address Hold Time tRC tRAS tRCD tCCD tRP tRRD tWR tLDR tCK tCH tCL tAC tOH tHZ tLZ tSB tT tDS tDH tAS tAH -6 MIN. MAX. 60 42 100000 18 1 18 12 15 1 6 1000 12 1000 2 2 5.4 6 2.5 5.4 6 1 06 0.3 1.2 1.5 1 1.5 1 512Mb Mobile LPSDR -75 MIN. MAX. 72.5 - UNIT ns NOTE 8 50 100000 ns 8 18 - ns 8 1 - CLK 8 18 - ns 15 - ns 15 - ns 1 CLK 7.5 1000 ns 12 1000 ns 2.5 - ns 2.5 - ns - 5.4 ns - 8 ns 2.5 - ns - 5.4 ns - 6 ns 1 - ns 0 7.5 ns 0.3 1.2 ns 1.5 - ns 1 - ns 1.5 - ns 1 - ns 8 8 7 7 - 11 - Publication Release Date: Sep, 22, 2011 Revision A01-005 Datasheet pdf - http://www.DataSheet4U.net/ 11 Page

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