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BD63821EFV 데이터시트 PDF




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부품번호 BD63821EFV 기능
기능 Silicon monolithic integrated circuits
제조업체 ROHM Semiconductor
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BD63821EFV 데이터시트, 핀배열, 회로
STRUCTURE
PRODUCT SERIES
TYPE
FUNCTION
Silicon monolithic integrated circuits
2ch DC brush motor driver
BD63821EFV
PWM constant current controllable two H bridge driver
Forward, reverse, brake and stop function
Direct PWM control
1/4
Absolute maximum ratings(Ta=25°C)
Item
Symbol
Ratings
Unit
Supply voltage
Power dissipation
VCC1,2
Pd
-0.3+36.0
1.451
4.702
V
W
W
Input voltage for control pin
VIN
-0.3+7.0
V
RNF voltage
Output current
Output current(peak)4
FAULT, LOCK voltage
VRNF
IOUT
IOUTPEAK
VFAULT
0.7
1.03
1.53
-0.3+7.0
V
A/ch
A/ch
V
FAULT, LOCK current
Operating temperature range
Storage temperature range
IFAULT
Topr
Tstg
5
-25+85
-55+150
mA
°C
°C
Junction temperature
Tjmax
+150
°C
1 70mm×70mm×1.6mm glass epoxy board. Derating in done at 11.6mW/°C for operating above Ta=25°C.
2 4-layer recommended board. Derating in done at 37.6mW/°C for operating above Ta=25°C.
www.DataSheet.co.kr
3 Do not, however exceed Pd, ASO and Tjmax=150°C.
4 Pulse width tw20ms.
Operating conditions (Ta=-25+85°C)
Item
Symbol
Min.
Typ.
Max.
Unit
Supply voltage
VCC1,2
19
24
28
V
Input voltage for control pin
VIN 0
- 5.5 V
PWM input frequency
FIN -
- 100 kHz
This product isn’t designed for protection against radioactive rays.
REV. B
Datasheet pdf - http://www.DataSheet4U.net/




BD63821EFV pdf, 반도체, 판매, 대치품
4/4
Operation Notes
(1) Absolute maximum ratings
An excess in the absolute maximum ratings, such as supply voltage, temperature range of operating
conditions, etc., can break down the devices, thus making impossible to identify breaking mode, such as a
short circuit or an open circuit. If any over rated values will expect to exceed the absolute maximum ratings,
consider adding circuit protection devices, such as fuses.
(2) Power supply lines
As return of current regenerated by back EMF of motor happens, take steps such as putting capacitor
between power supply and GND as an electric pathway for the regenerated current. Be sure that there is no
problem with each property such as emptied capacity at lower temperature regarding electrolytic capacitor
to decide capacity value. If the connected power supply does not have sufficient current absorption capacity,
regenerative current will cause the voltage on the power supply line to rise, which combined with the
product and its peripheral circuitry may exceed the absolute maximum ratings. It is recommended to
implement a physical safety measure such as the insertion of a voltage clamp diode between the power
supply and GND pins.
(3) GND potential
The potential of GND pin must be minimum potential in all operating conditions.
(4) Metal on the backside (Define the side where product markings are printed as front)
The metal on the backside is shorted with the backside of IC chip therefore it should be connected to GND.
Be aware that there is a possibility of malfunction or destruction if it is shorted with any potential other than
GND.
(5) Thermal design
Use a thermal design that allows for a sufficient margin in light of the power dissipation (Pd) in actual
operating conditions. This IC exposes the metal on the backside of package. Note that this part is assumed
to use after providing heat dissipation treatment to improve heat dissipation efficiency. Try to occupy as
wide as possible with heat dissipation pattern not only on the board surface but also the backside.
(6) Operation in strong electromagnetic field
Use caution when using the IC in the presencewww.DataSheet.co.kr of a strong electromagnetic field as doing so may cause the
IC to malfunction.
(7) ASO
When using the IC, set the output transistor so that it does not exceed absolute maximum ratings or ASO.
(8) Thermal shutdown circuit
The IC has a built-in thermal shutdown circuit (TSD circuit). If the chip temperature becomes Tjmax=150°C,
and higher, coil output to the motor will be open. The TSD circuit is designed only to shut the IC off to
prevent runaway thermal operation. It is not designed to protect or indemnify peripheral equipment. Do not
use the TSD function to protect peripheral equipment.
(9) Over current protection circuit
The IC has a built-in over current protection circuit (OCP circuit). The OCP circuit is designed only to shut
the IC off to prevent abnormal situations, when absolute maximum output current is exceeded. It is not
designed to protect or indemnify peripheral equipment. Do not use the OCP function to protect peripheral
equipment.
(10) Ground Wiring Pattern
When using both large current and small signal GND patterns, it is recommended to isolate the two ground
patterns, placing a single ground point at the ground potential of application so that the pattern wiring
resistance and voltage variations caused by large currents do not cause variations in the small signal
ground voltage. Be careful not to change the GND wiring pattern of any external components, either.
(11) TEST pin
Be sure to connect TEST pin to GND.
REV. B
Datasheet pdf - http://www.DataSheet4U.net/

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관련 데이터시트

부품번호상세설명 및 기능제조사
BD63821EFV

Silicon monolithic integrated circuits

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