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TQP4M3019 데이터시트 PDF




TriQuint Semiconductor에서 제조한 전자 부품 TQP4M3019은 전자 산업 및 응용 분야에서
광범위하게 사용되는 반도체 소자입니다.


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부품번호 TQP4M3019 기능
기능 CDMA SP3T Switch
제조업체 TriQuint Semiconductor
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TQP4M3019 데이터시트, 핀배열, 회로
TQP4M3019
Data Sheet
SP3T High Power 2.6V 2x2 mm CDMA Antenna Switch
Functional Block Diagram
Product Description
TriQuint’s TQP4M3019 is a high power antenna switch in a single pole
three throw (SP3T) configuration. The die utilizes TriQuint’s PHEMT MMIC
switch process to provide optimized cross-modulation performance for use
in CDMA applications. PHEMT Switches are a very low DC currentwww.DataSheet.net/
replacement for classic PIN diode based switches. This product is ideally
suited to applications where the antenna of a CDMA handset is to be
routed to the Cellular duplexer, the PCS duplexer, AWS duplexer and the
GPS receiver input. The design is symmetric and broadband allowing the
user to assign cellular, PCS, AWS and GPS to ports RF1, RF2 or RF3 as
desired.
Electrical Specifications
Parameter
Typ Units
Cellular Insertion Loss
0.50 dB
GPS Insertion Loss
0.52 dB
AWS Insertion Loss
0.58 dB
PCS Insertion Loss
0.60 dB
Cellular Isolation
27 dB
GPS Isolation
24 dB
AWS Isolation
23 dB
PCS Isolation
Cellular Cross Modulation2
22 dB
-108 dBm
AWS Cross Modulation
-106
dBm
PCS Cross Modulation
-105 dBm
Note 1: Test Conditions Zo=50ohms: Vcontrol = 0V/2 6V, Tc=25°C
Note 2: Cross-Modulation Test Conditions:
Cellular: PTx1 = 23 dBm@ 836 MHz, PTx2= 23dBm @837 MHz, P =-23 dBm @ 881.5 MHz
nt
AWS:PTx1 = 23 dBM @ 1710 MHz, PTx2 = 23dBm @ 1755 MHz, P =-23 dBm @ 1759.5 MHz
nt
Features
pHEMT GaAs MMIC Die
Excellent Cross-Modulation Performance
108 dBm Typ @Cellular
106 dBm @AWS
105 dBm @ PCS
Excellent ESD Rating
300V HBM, 2000V CDM
Low Control Voltage Operation to =2.6V
High Isolation: 23dB typ at AWS and 22dB
typ at PCS
Very Low Control Current: 10µA typical
Low Insertion Loss: 0.58 dB typ at AWS and
0.6dB typ at PCS Band
Small Footprint 2.0 x 2.0 mm 12 lead STSLP
Package
Applications
CDMA Handset Antenna Switch for Cellular,
PCS, AWS and GPS Operation
Package Style
12ld STSLP
Data Sheet: For additional information and the latest specifications, see our website: www.triquint.com
Revision J, Jan 20, 2011
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TQP4M3019 pdf, 반도체, 판매, 대치품
TQP4M3019
Data Sheet
SP3T High Power 2.6V 2x2 mm CDMA Antenna Switch
Typical Example
www.DataSheet.net/
Data Sheet: For additional information and the latest specifications, see our website: www.triquint.com
Revision J, Jan 20, 2011
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Datasheet pdf - http://www.DataSheet4U.co.kr/

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TQP4M3019 전자부품, 판매, 대치품
TQP4M3019
Data Sheet
SP3T High Power 2.6V 2x2 mm CDMA Antenna Switch
Recommended PCB Footprint for 12ld STSLP 2x2x0.57mm Package
www.DataSheet.net/
Procedure:
PCB Layout:
Leads are to extend away from the pads – these should be the same shape and size to ensure equal solder coverage.
Solder Mask:
The solder mask opening should be offset from the package edges by 250µm.
Solder Stencil:
Center pad opening is about 30% of PCB pad size.
Data Sheet: For additional information and the latest specifications, see our website: www.triquint.com
Revision J, Jan 20, 2011
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