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PDF TQM4M9073 Data sheet ( Hoja de datos )
| Número de pieza | TQM4M9073 | |
| Descripción | Through Line | |
| Fabricantes | TriQuint Semiconductor | |
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TQM4M9073
Through Line
Applications
General Purpose Wireless
RF bypass paths
Microwave Radio
Test & Measurement
Scientific Instruments
Product Features
DC – 6 GHz
50 ohm port impedance
Low insertion loss, <0.1dB at 2.14GHz
1.2:1 VSWR at 2.14 GHz
Surface Mountable
16-pin 3x3mm leadless SMT package
Functional Block Diagram
General Description
The TQM4M9073 is a passive low-loss through line that
operates from 0 to 6.0 GHz. At 2.14 GHz, input and
output return loss is greater than 22 dB and typical
insertion loss is 0.1 dB. The product is housed in an
industry standard Pb-free / RoHS-compliant surface-
mount leadless package.
Pin Configuration
Pin #www.DataSheet.net/
2, 11
1, 3, 4, 5, 6, 7, 8, 9,
10, 12, 13, 14, 15, 16
Backside Paddle
Symbol
RF I/O
No Connect
No Connect
Typical Performance
Parameter
Frequency
Insertion Loss
Input/ Output Return Loss
Units
Typical Value
MHz
960
2140
2500
dB <0.1 0.1 0.13
dB 32 25 23
3000
0.17
20
Datasheet: Rev D 12-14-10
© 2010 TriQuint Semiconductor, Inc.
Ordering Information
Part No.
TQM4M9073
Description
Through Line
Standard T/R size = 2500 pcs. on a 7” reel
- 1 of 7 -
Disclaimer: Subject to change without notice
Connecting the Digital World to the Global Network®
Datasheet pdf - http://www.DataSheet4U.co.kr/
1 page  
TQM4M9073
Through Line
MANUFACTURING ENVIRONMENTS
COMPONENT HANDLING
All necessary special handling techniques shall be adopted in order to avoid contamination of metallization /
terminations. Examples include use of finger cots, plastic tweezers, etc.
PART PLACEMENT
A placement force of up to 500 grams is applied (using a 2.00 mm or a 0.080 inch diameter rod) to the center
of the part while remaining in its tape carrier.
COMPONENT SOLDERABILITY
Convection or Infrared Reflow
Part will comply with convection or infrared reflow soldering processes consistent with IPC/JEDEC J-STD-
020. TriQuint’s actual reflow profile for qualification is provided below:
Reflow Parameters
Average ramp-up rate (217C to Peak)
Preheat Time (150C to 200C)
Time above 217C
Peak Temperature
Time within 5C of actual Peak Temperature
Ramp-down Rate
Time 25C to Peak Temperature
IPC/JEDEC J-STD-020
3C/second max.
60-180 seconds
60-150 seconds
260 +0/-5C
20-40 seconds
6C/second max.
8 minutes max.
TriQuint Actual
0.57C/second
150 seconds
126 seconds
259C
30 seconds
0.875C/second
7 minutes max.
www.DataSheet.net/
MATERIAL PACKAGING AND SHIPMENT
In the absence of customer specific requirements called out in the purchase order, material packaging and shipping
requirements shall be a defined in the paragraph and in TriQuint’s standard procedure for the packaging and shipment of
ICs in tape and reel.
GENERAL TAPE AND REEL REQUIREMENTS
Carrier and cover tape physical dimensions
Datasheet: Rev D 12-14-10
© 2010 TriQuint Semiconductor, Inc.
- 5 of 7 -
Disclaimer: Subject to change without notice
Connecting the Digital World to the Global Network®
Datasheet pdf - http://www.DataSheet4U.co.kr/
5 Page | ||
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