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PDF TQP3M6005 Data sheet ( Hoja de datos )
| Número de pieza | TQP3M6005 | |
| Descripción | 1700 - 2000 MHz High IP3 Dual PHEMT Low Noise Amplifier | |
| Fabricantes | TriQuint Semiconductor | |
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TQP3M6005
Mid Band Dual LNA (1700-2000 MHz)
Applications
Base Station receivers
Tower-mounted amplifiers
Product Features
0.36 dB Noise Figure (single channel)
1700-2000 MHz
17.9 dB Gain (single channel)
+13.4 dBm IIP3 (single channel)
Compact 4 x 4 mm package
RoHS compliant, Pb-free
16-pin 4x4mm leadless SMT package
Functional Block Diagram
General Description
The TQP3M6005 is a low noise dual pHEMT discrete
device operating from 1700 - 2000 MHz. Noise figure is
typically 0.36 dB per channel and 0.54 dB when used in a
balanced configuration with a balun.
The TQP3M6005 consists of a single monolithic GaAs die
mounted in a compact 4 x 4 QFN package. This device is a
dual discrete LNA intended to be used as a balanced pair in
wireless networks applications. The TQP3M6005 is
packaged in a Pb-free / RoHS-compliant, compact 4x4 mm
surface-mount leadless package.
The TQP3M6005 is useful in a number of different
applications, and is particularly well suited for cellular or
WiMAX base station or tower-mounted amplifier products.
Pin Configuration
Pin #www.DataSheet.net/
1, 2, 3, 4, 9, 10, 11, 12
6, 7, 14, 15
5
8
13
16
Backside Paddle
Symbol
NC (No Connect)
GND (Ground)
VGA
VGB
VDB
VDA
RF/DC Ground
Datasheet: Rev C 04-29-11
© 2011 TriQuint Semiconductor, Inc.
Ordering Information
Part No.
Description
TQP3M6005
Mid Band Dual LNA
Standard T/R size = 2500 pieces on a 7” reel.
- 1 of 7 -
Disclaimer: Subject to change without notice
Connecting the Digital World to the Global Network®
Datasheet pdf - http://www.DataSheet4U.co.kr/
1 page  
TQP3M6005
Mid Band Dual LNA (1700-2000 MHz)
Pin Description
Pin #
Symbol
1, 2, 3, 4, 9, 10, 11, 12 NC (No Connect)
6, 7, 14, 15
5
8
13
16
Backside Paddle
GND (Ground)
VGA
VGB
VDB
VDA
RF/DC Ground
Description
No electrical connection. Land pads should be provided for PCB mounting
integrity.
Grounding recommended for optimal isolation between amp A and B
RF Input – Channel A
RF Input – Channel B
RF Output – Channel B
RF Output – Channel A
www.DataSheet.net/
RF/DC ground. Provide recommended via pattern and ensure good solder
attach for best thermal and electrical performance.
Applications Information
PC Board Layout
PCB Material (stackup)
Single-layer, 20 mil thick Rogers RO4350B
2.8 mil copper top and bottom
The pad pattern shown has been developed and tested
for optimized assembly at TriQuint Semiconductor. The
PCB land pattern has been developed to accommodate
lead and package tolerances. Since surface mount
processes vary from company to company, careful
process development is recommended.
Datasheet: Rev C 04-29-11
© 2011 TriQuint Semiconductor, Inc.
- 5 of 7 -
Disclaimer: Subject to change without notice
Connecting the Digital World to the Global Network®
Datasheet pdf - http://www.DataSheet4U.co.kr/
5 Page | ||
| Páginas | Total 7 Páginas | |
| PDF Descargar | [ Datasheet TQP3M6005.PDF ] | |
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