|
|
|
부품번호 | W25Q64CV 기능 |
|
|
기능 | 3V 64M-BIT SERIAL FLASH MEMORY | ||
제조업체 | Winbond | ||
로고 | |||
전체 30 페이지수
W25Q64CV
3V 64M-BIT
SERIAL FLASH MEMORY WITH
DUAL AND QUAD SPI
Publication Release Date: May 22, 2014
- 1 - Revision H
W25Q64CV
7.2.38 Program Security Registers (42h) ......................................................................................59
7.2.39 Read Security Registers (48h) ...........................................................................................60
8. ELECTRICAL CHARACTERISTICS............................................................................................... 61
8.1 Absolute Maximum Ratings (1)(2) ...................................................................................... 61
8.2 Operating Ranges............................................................................................................... 61
8.3 Power-up Timing and Write Inhibit Threshold .................................................................... 62
8.4 DC Electrical Characteristics .............................................................................................. 63
8.5 AC Measurement Conditions.............................................................................................. 64
8.6 AC Electrical Characteristics .............................................................................................. 65
8.7 AC Electrical Characteristics (cont’d) ................................................................................. 66
8.8 Serial Output Timing........................................................................................................... 67
8.9 Serial Input Timing.............................................................................................................. 67
8.10 /HOLD Timing..................................................................................................................... 67
8.11 /WP Timing......................................................................................................................... 67
9. PACKAGE SPECIFICATION .......................................................................................................... 68
9.1 8-Pin SOIC 208-mil (Package Code SS)............................................................................ 68
9.2 8-Pin VSOP 208-mil (Package Code ST)........................................................................... 69
9.3 8-Pin PDIP 300-mil (Package Code DA) ............................................................................ 70
9.4 8-Pad WSON 6x5mm (Package Code ZP) ........................................................................ 71
9.5 8-Pad WSON 8x6mm (Package Code ZE) ........................................................................ 72
9.6 16-Pin SOIC 300-mil (Package Code SF) .......................................................................... 73
9.7 24-Ball TFBGA 8x6-mm (Package Code TB, 5x5-1 ball array).......................................... 74
9.8 24-Ball TFBGA 8x6-mm (Package Code TC, 6x4 ball array)............................................. 75
10. ORDERING INFORMATION .......................................................................................................... 76
10.1 Valid Part Numbers and Top Side Marking ........................................................................ 77
11. REVISION HISTORY...................................................................................................................... 78
-4-
4페이지 W25Q64CV
3.3 Pin Configuration PDIP 300-mil
Top View
/CS 1
8
DO (IO1)
/WP (IO2)
GND
2
3
4
7
6
5
VCC
/HOLD (IO3)
CLK
DI (IO0)
Figure 1c. W25Q64CV Pin Assignments, 8-pin PDIP 300-mil (Package Code DA)
3.4 Pin Description SOIC/VSOP 208-mil, WSON 6x5/8x6-mm and PDIP 300-mil
PIN NO.
1
2
3
4
5
6
7
8
PIN NAME
/CS
DO (IO1)
/WP (IO2)
GND
DI (IO0)
CLK
/HOLD (IO3)
VCC
I/O FUNCTION
I Chip Select Input
I/O Data Output (Data Input Output 1)*1
I/O Write Protect Input ( Data Input Output 2)*2
Ground
I/O Data Input (Data Input Output 0)*1
I Serial Clock Input
I/O Hold Input (Data Input Output 3)*2
Power Supply
*1 IO0 and IO1 are used for Standard and Dual SPI instructions
*2 IO0 – IO3 are used for Quad SPI instructions
Publication Release Date: May 22, 2014
- 7 - Revision H
7페이지 | |||
구 성 | 총 30 페이지수 | ||
다운로드 | [ W25Q64CV.PDF 데이터시트 ] |
당사 플랫폼은 키워드, 제품 이름 또는 부품 번호를 사용하여 검색할 수 있는 |
구매 문의 | 일반 IC 문의 : 샘플 및 소량 구매 ----------------------------------------------------------------------- IGBT, TR 모듈, SCR 및 다이오드 모듈을 포함한 광범위한 전력 반도체를 판매합니다. 전력 반도체 전문업체 상호 : 아이지 인터내셔날 사이트 방문 : [ 홈페이지 ] [ 블로그 1 ] [ 블로그 2 ] |
부품번호 | 상세설명 및 기능 | 제조사 |
W25Q64CV | 3V 64M-BIT SERIAL FLASH MEMORY | Winbond |
DataSheet.kr | 2020 | 연락처 | 링크모음 | 검색 | 사이트맵 |