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PDF ALE3025T2 Data sheet ( Hoja de datos )
| Número de pieza | ALE3025T2 | |
| Descripción | Internally Matched LNA Module | |
| Fabricantes | ASB | |
| Logotipo |  |
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plerowTM ALE3025T2
Internally Matched LNA Module
Features
· S21 = 19.9 dB@2900 MHz
= 19.1 dB@3150 MHz
· NF of 1.05 dB over Frequency
· Unconditionally Stable
· Single 5 V Supply
· High OIP3@Low Current
Description
The plerowTM ALE-series is the compactly designed surface-mount
module for the use of the LNA with or without the following gain blocks in
the infrastructure equipment of the mobile wireless (CDMA, GSM, PCS,
PHS, WCDMA, DMB, WLAN, WiBro, WiMAX), GPS, satellite communi-
cation terminals, CATV and so on. It has an exceptional performance of
low noise figure, high gain, high OIP3, and low bias current. The stability
factor is always kept more than unity over the application band in order
to ensure its unconditionally stable implementation to the application
system environment. The surface-mount module package including the
completed matching circuit and other components necessary just in case
allows very simple and convenient implementation onto the system
board in mass production level.
Specifications (in Production)
Typ.@T = 25 °C, Vs = 5 V, Freq. = 3025 MHz, Zo.sys = 50 ohms
Parameter
Specifications
Unit
Min Typ Max
Frequency Range
MHz
2900
3150
Gain
dB
18.5
19.5
Gain Flatness
dB
±0.4
±0.5
Noise Figure
Output IP3 (1)
S11/S22 (2)
dB
dBm
dB
1.05
1.1
39 42
-17/-13
Output P1dB
Switching Time (3)
dBm 22 23
msec
-
Supply Current
mA
200 220
Supply Voltage
V
5www.DataSheet.net/
Impedance
W
50
Max. RF Input Power
dBm
C.W 29~31 (before fail)
Package Type & Size
mm Surface Mount Type, 10Wx10Lx3.8H
Operating temperature is -40 °C to +85 °C.
1) OIP3 is measured with two tones at an output power of 7 dBm/tone separated by 1 MHz.
2) S11, S22 (max) is the worst value within the frequency band.
3) Switching time means the time that takes for output power to get stabilized to its final level after switching DC voltage from 0 V to VS.
2-stage Single Type
More Information
Website: www.asb.co.kr
E-mail: [email protected]
Tel: (82) 42-528-7223
Fax: (82) 42-528-7222
Outline Drawing (Unit: mm)
plerow
ALE3025T2
ASB Inc.
(Top View)
Solder Stencil Area
(Bottom View)
Pin Number
2
5
6
Others
Function
RF In
RF Out
Vs
Ground
Note: 1. The number and size of ground via holes in
a circuit board is critical for thermal RF
grounding considerations.
2. We recommend that the ground via holes be
placed on the bottom of all ground pins for
better RF and thermal performance, as
shown in the drawing at the left side.
(Side View)
Ø0.4 plated thru holes to ground plane
1/3
(Recommended Footprint)
www.asb.co.kr
April 2010
Datasheet pdf - http://www.DataSheet4U.co.kr/
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