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PDF PS21963-ST Data sheet ( Hoja de datos )

Número de pieza PS21963-ST
Descripción Dual-In-Line Package Intelligent Power Module
Fabricantes Mitsubishi Electric Semiconductor 
Logotipo Mitsubishi Electric Semiconductor Logotipo



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No Preview Available ! PS21963-ST Hoja de datos, Descripción, Manual

PS21963-ST
MITSUBISHI SEMICONDUCTOR <Dual-In-Line Package Intelligent Power Module>
PS21963-ST
TRANSFER-MOLD TYPE
INSULATED TYPE
INTEGRATED POWER FUNCTIONS
600V/10A low-loss 5th generation IGBT inverter bridge for
three phase DC-to-AC power conversion.
Open emitter type.
INTEGRATED DRIVE, PROTECTION AND SYSTEM CONTROL FUNCTIONS
• For upper-leg IGBTS : Drive circuit, High voltage high-speed level shifting, Control supply under-voltage (UV) protection.
• For lower-leg IGBTS : Drive circuit, Control supply under-voltage protection (UV), Short circuit protection (SC), Over temperature protection (OT).
• Fault signaling : Corresponding to an SC fault (Lower-leg IGBT), a UV fault (Lower-side supply) or an OT fault (LVIC temperature).
• Input interface : 3V, 5V line (High Active).
• UL Approved : Yellow Card No. E80276
APPLICATION
AC100V~200V inverter drive for small power motor control.
Fig. 1 PACKAGE OUTLINES
0.28
1.778 ±0.2
17
38 ±0.5
20×1.778(=35.56 )
35 ±0.3
A
16-0.5
1
www.DataSheet.net/
B
2-R1.6
QR
Type name
Code Lot No.
3 MIN
18 25
0.28
2.54 ±0.2
0.5
14×2.54 (=35.56)
8-0.6
0.5 0.5
0.5
4-C1.2
(2.656)
Dimensions in mm
3.5
1.5 ±0.05
0.8
HEAT SINK SIDE
2.5 MIN
TERMINAL CODE
1. (VNC)
2. VUFB
3. VVFB
4. VWFB
5. UP
6. VP
7. WP
8. VP1
9. VNC *
10. UN
11. VN
12. WN
13. VN1
14. FO
15. CIN
16. VNC *
17. NC
18. NW
19. NV
20. NU
21. W
22. V
23. U
24. P
25. NC
1.5min
HEAT SINK SIDE
(1.2)
(2.756)
DETAIL A
DETAIL B
*) Two VNC terminals (9 & 16 pin) are connected inside DIP-IPM, please connect either one to the 15V power supply GND outside and
leave another one open.
Mar. 2007
Datasheet pdf - http://www.DataSheet4U.co.kr/

1 page




PS21963-ST pdf
MITSUBISHI SEMICONDUCTOR <Dual-In-Line Package Intelligent Power Module>
PS21963-ST
TRANSFER-MOLD TYPE
INSULATED TYPE
Fig. 2 THE DIP-IPM INTERNAL CIRCUIT
VUFB
VP1
UP
VNC
VVFB
VP
HVIC
VCC
VUB
UP UOUT
COM
VUS
VVB
VP
VOUT
VVS
VWFB
WP
VN1
UN
VN
WN
Fo
VNC
VWB
WP
WOUT
VWS
LVIC
UOUT
VCC
UN
VN
WN
Fo
GND
VOUT
WOUT
CIN
VNO
IGBT1
Di1
DIP-IPM
P
U
IGBT2
Di2
V
IGBT3
Di3
IGBT4
www.DataSheet.net/
Di4
IGBT5
Di5
IGBT6
Di6
W
NU
NV
NW
CIN
Mar. 2007
5
Datasheet pdf - http://www.DataSheet4U.co.kr/

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