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What is BUK9Y3R0-40E?

This electronic component, produced by the manufacturer "NXP Semiconductors", performs the same function as "N-channel logic level MOSFET".


BUK9Y3R0-40E Datasheet PDF - NXP Semiconductors

Part Number BUK9Y3R0-40E
Description N-channel logic level MOSFET
Manufacturers NXP Semiconductors 
Logo NXP Semiconductors Logo 


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BUK9Y3R0-40E
N-channel 40 V 3.0 mΩ logic level MOSFET in LFPAK56
12 February 2013
Product data sheet
1. General description
Logic level N-channel MOSFET in LFPAK56 (Power SO8) package using TrenchMOS
technology. This product has been designed and qualified to AEC Q101 standard for use
in high performance automotive applications.
2. Features and benefits
Q101 compliant
Repetitive avalanche rated
Suitable for thermally demanding environments due to 175 °C rating
True logic level gate with VGS(th) rating of greater than 0.5 V at 175 °C
3. Applications
12 V Automotive systems
Motors, lighting and solenoid control
Start-Stop micro-hybrid applications
Transmission control
Ultra high performance power switching
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4. Quick reference data
Table 1. Quick reference data
Symbol
Parameter
Conditions
VDS drain-source voltage Tj ≥ 25 °C; Tj ≤ 175 °C
ID
drain current
VGS = 5 V; Tmb = 25 °C; Fig. 1
[1]
Ptot total power dissipation Tmb = 25 °C; Fig. 2
Static characteristics
RDSon
drain-source on-state VGS = 5 V; ID = 25 A; Tj = 25 °C; Fig. 11
resistance
Dynamic characteristics
QGD
gate-drain charge
VGS = 5 V; ID = 25 A; VDS = 32 V;
Fig. 13; Fig. 14
[1] Continuous current is limited by package.
Min Typ Max Unit
- - 40 V
- - 100 A
- - 194 W
-
2.47 3
- 10.7 - nC
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BUK9Y3R0-40E equivalent
NXP Semiconductors
BUK9Y3R0-40E
N-channel 40 V 3.0 mΩ logic level MOSFET in LFPAK56
1
Zth(j-mb)
(K/W)
δ = 0.5
0.2
10-1 0.1
0.05
0.02
10-2
single shot
003aaj068
P
tp
δ= T
10-3
10-6
10-5
10-4
10-3
10-2
10-1
tp
T
tp (s)
t
1
Fig. 5. Transient thermal impedance from junction to mounting base as a function of pulse duration
10. Characteristics
Table 7. Characteristics
Symbol
Parameter
Conditions
Static characteristics
V(BR)DSS
drain-source
breakdown voltage
I = 250 µA; V = 0 V; T = 25 °CD
GS
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j
ID = 250 µA; VGS = 0 V; Tj = -55 °C
VGS(th)
gate-source threshold ID = 1 mA; VDS = VGS; Tj = 25 °C;
voltage
Fig. 9; Fig. 10
ID = 1 mA; VDS = VGS; Tj = -55 °C;
Fig. 9
ID = 1 mA; VDS = VGS; Tj = 175 °C;
Fig. 9
IDSS drain leakage current VDS = 40 V; VGS = 0 V; Tj = 25 °C
VDS = 40 V; VGS = 0 V; Tj = 175 °C
IGSS gate leakage current VGS = 10 V; VDS = 0 V; Tj = 25 °C
VGS = -10 V; VDS = 0 V; Tj = 25 °C
RDSon
drain-source on-state
resistance
VGS = 5 V; ID = 25 A; Tj = 25 °C; Fig. 11
VGS = 10 V; ID = 25 A; Tj = 25 °C;
Fig. 11
VGS = 5 V; ID = 25 A; Tj = 175 °C;
Fig. 12; Fig. 11
Dynamic characteristics
QG(tot)
QGS
total gate charge
gate-source charge
ID = 25 A; VDS = 32 V; VGS = 5 V;
Fig. 13; Fig. 14
BUK9Y3R0-40E
Product data sheet
All information provided in this document is subject to legal disclaimers.
12 February 2013
Min Typ Max Unit
40 - - V
36 - - V
1.4 1.7 2.1 V
- - 2.45 V
0.5 - - V
-
0.13 10
µA
- - 500 µA
- 2 100 nA
- 2 100 nA
-
2.47 3
- 1.98 2.5 mΩ
- - 6 mΩ
- 35.5 - nC
- 11.7 - nC
© NXP B.V. 2013. All rights reserved
5 / 13
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