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MMZ0603 데이터시트 PDF




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MMZ0603 데이터시트, 핀배열, 회로
(1/3)
Chip Beads(SMD)
For Signal Line
Conformity to RoHS Directive
MMZ Series MMZ0603 Type
FEATURES
• This is a multilayered chip bead product with dimensions of
L0.6× W0.3× T0.3mm.
• The product is magnetically shielded, allowing high density
mounting.
• We refined the rules for internal conductor design to reduce
floating capacity between conductors, which in turn has
contributed to a dramatic improvement in high frequency
characteristics. We have also been able to expand and reinforce
the EMI suppression in the GHz range.
• It is a product conforming to RoHS directive.
APPLICATIONS
The removal of EMI components from signal lines in various
modules, cellular phones and other sets that use very small
components.
PRODUCT IDENTIFICATION
MMZ 0603 S 121 C T
(1) (2) (3) (4) (5) (6)
(1) Series name
(2) Dimensions L× W
(3) Material code
(4) Nominal impedance
121:120at 100MHz
(5) Characteristic type
(6) Packaging style
T:Taping
HANDLING AND PRECAUTIONS
• Before soldering, be sure to preheat components. The preheat-
ing temperature should be set so that the temperature difference
between the solder temperature and product temperature does
not exceed 150°C.
• After mounting components onto the printed circuit board, do not
apply stress through board bending or mishandling.
• Do not expose the inductors to stray magnetic fields.
• Avoid static electricity discharge during handling.
• When hand soldering, apply the soldering iron to the printed cir-
cuit board only. Temperature of the iron tip should not exceed
350°C. Soldering time should not exceed 3 seconds.
MATERIAL CHARACTERISTICS
S material: Standard type that features impedance characteristics
similar to those of a typical ferrite core.
For signal line applications in which the blocking region
is near 100MHz. Impedance values selected for effec-
tiveness at 40 to 300MHz.
Y material: High frequency range type intended for the 100MHz
region and above.
For signal line applications in which the signal fre-
quency is far from the cutoff frequency. Impedance val-
ues selected for effectiveness at 80 to 400MHz.
D material: For applications calling for low insertion loss at low fre-
quencies and sharply increasing impedance at high
frequencies. Designed for high impedance at high fre-
quencies (300MHz to 1GHz) for signal line applica-
tions.
F material: This new product inherits the characteristic of our D-
material, namely its sharp impedance rise time, and its
impedance peak frequency has been shifted higher
into range. The product offers excellent noise suppres-
sion from 600MHz to as high as in the GHz range.
TYPICAL MATERIAL CHARACTERISTICS
2000http://www.DataSheet4U.net/
1800
1600
1400
1200
1000
800
600
400
200
0
10
Y
S
D
F
100
Frequency(MHz)
1000
• Conformity to RoHS Directive: This means that, in conformity with EU Directive 2002/95/EC, lead, cadmium, mercury, hexavalent chromium, and specific
bromine-based flame retardants, PBB and PBDE, have not been used, except for exempted applications.
• Please contact our Sales office when your application are considered the following:
The device’s failure or malfunction may directly endanger human life (e.g. application for automobile/aircraft/medical/nuclear power devices, etc.)
• All specifications are subject to change without notice.
008-01 / 20080409 / e9412_mmz0603.fmdatasheetpdf-http://www.DataSheet4U.net/





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