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PDF ADMP421 Data sheet ( Hoja de datos )

Número de pieza ADMP421
Descripción Omnidirectional Microphone
Fabricantes Analog Devices 
Logotipo Analog Devices Logotipo



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No Preview Available ! ADMP421 Hoja de datos, Descripción, Manual

Omnidirectional Microphone with
Bottom Port and Digital Output
ADMP421
FEATURES
Small and thin 3 mm × 4 mm × 1 mm surface-mount package
High SNR of 61 dBA
High sensitivity of −26 dBFS
Flat frequency response from 100 Hz to 15 kHz
Low current consumption: <650 μA
High PSRR of 80 dBFS
Fourth-order Σ-Δ modulator
Digital PDM output
Compatible with Sn/Pb and Pb-free solder processes
RoHS/WEEE compliant
APPLICATIONS
Smartphones and feature phones
Digital video cameras
Bluetooth headsets
Video phones
Teleconferencing systems
GENERAL DESCRIPTION
The ADMP421 is a low cost, low power, digital output bottom-
ported omnidirectional MEMS microphone. The ADMP421
consists of a MEMS microphone element, an impedance converter
amplifier, and a fourth-order Σ-Δ modulator. The digital inter-
face allows for the pulse density modulated (PDM) output of
two microphones to be time multiplexed on a single data line
using a single clock.
The ADMP421 has a high SNR and high sensitivity, making it
an excellent choice for far field applications. The ADMP421 has
a flat wideband frequency response resulting in natural sound
with high intelligibility. Low current consumption and a sleep
mode enable long battery life for portable applications. A built-
in particle filter provides high reliability. The ADMP421 complies
with the TIA-920 Telecommunications Telephone Terminal
Equipment Transmission Requirements for Wideband Digital
Wireline Telephones standard.
The ADMP421 is available in a thin 3 mm × 4 mm × 1 mm
surface-mount package. It is reflow solder compatible with no
sensitivity degradation. The ADMP421 is halide free.
http://www.DataSheet4U.net/
FUNCTIONAL BLOCK DIAGRAM
MEMS
MEMBRANE
BACKPLATE
ASIC
ADMP421
IMPEDANCE
CONVERTER
ADC
DATA
L/R SELECT
CLK
VDD
GND
Figure 1.
Rev. 0
Information furnished by Analog Devices is believed to be accurate and reliable. However, no
responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other
rights of third parties that may result from its use. Specifications subject to change without notice. No
license is granted by implication or otherwise under any patent or patent rights of Analog Devices.
Trademarksandregisteredtrademarksarethepropertyoftheirrespectiveowners.
One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106, U.S.A.
Tel: 781.329.4700
www.analog.com
Fax: 781.461.3113
©2010 Analog Devices, Inc. All rights reserved.
datasheet pdf - http://www.DataSheet4U.net/

1 page




ADMP421 pdf
ABSOLUTE MAXIMUM RATINGS
Table 3.
Parameter
Supply Voltage
Sound Pressure Level (SPL)
Mechanical Shock
Vibration
Temperature Range
Rating
3.6 V
160 dB
10,000 g
Per MIL-STD-883 Method 2007,
Test Condition B
−40°C to +70°C
ADMP421
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
ESD CAUTION
TP
TL TSMAX
TSMIN
RAMP-UP
tP
CRITICAL ZONE
TL TO TP
tL
tS
PREHEAT
RAMP-DOWN
t25°C TO PEAK
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TIME
Figure 3. Recommended Soldering Profile Limits
Table 4. Recommended Soldering Profile Limits
Profile Feature
Average Ramp Rate (TL to TP)
Preheat
Minimum Temperature (TSMIN)
Maximum Temperature (TSMAX)
Time (TSMIN to TSMAX), tS
Ramp-Up Rate (TSMAX to TL)
Time Maintained Above Liquidous (tL)
Liquidous Temperature (TL)
Peak Temperature (TP)
Time Within 5°C of Actual Peak Temperature (tP)
Ramp-Down Rate
Time 25°C (t25°C) to Peak Temperature
Sn63/Pb37
3°C/sec max
100°C
150°C
60 sec to 120 sec
3°C/sec
60 sec to 150 sec
183°C
240°C + 0°C/−5°C
10 sec to 30 sec
6°C/sec max
6 minute max
Pb-Free
3°C/sec max
150°C
200°C
60 sec to 120 sec
3°C/sec
60 sec to 150 sec
217°C
260°C + 0°C/−5°C
20 sec to 40 sec
6°C/sec max
8 minute max
Rev. 0 | Page 5 of 16
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5 Page





ADMP421 arduino
HANDLING INSTRUCTIONS
PICK AND PLACE EQUIPMENT
The MEMS microphone can be handled using standard pick-
and-place and chip shooting equipment. Care should be taken
to avoid damage to the MEMS microphone structure as follows:
Use a standard pickup tool to handle the microphone.
Because the microphone hole is on the bottom of the
package, the pickup tool can make contact with any part
of the lid surface.
Use care during pick-and-place to ensure that no high
shock events above 20 kg are experienced because such
events may cause damage to the microphone.
Do not pick up the microphone with a vacuum tool that
makes contact with the bottom side of the microphone.
Do not pull air out of or blow air into the microphone port.
Do not use excessive force to place the microphone on
the PCB.
ADMP421
REFLOW SOLDER
For best results, the soldering profile should be in accordance
with the recommendations of the manufacturer of the solder
paste used to attach the MEMS microphone to the PCB. It is
recommended that the solder reflow profile not exceed the limit
conditions specified in Figure 3 and Table 4.
BOARD WASH
When washing the PCB, ensure that water does not make
contact with the microphone port. Blow-off procedures and
ultrasonic cleaning must not be used.
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Rev. 0 | Page 11 of 16
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