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PDF ADMP521 Data sheet ( Hoja de datos )
| Número de pieza | ADMP521 | |
| Descripción | Ultralow Noise Microphone | |
| Fabricantes | Analog Devices | |
| Logotipo |  |
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Hay una vista previa y un enlace de descarga de ADMP521 (archivo pdf) en la parte inferior de esta página. Total 16 Páginas | ||
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Data Sheet
Ultralow Noise Microphone with
Bottom Port and PDM Digital Output
ADMP521
FEATURES
Small and thin 4 mm × 3 mm × 1 mm surface-mount package
Omnidirectional response
Very high SNR: 65 dBA
Sensitivity of −26 dBFS
Extended frequency response from 100 Hz to 16 kHz
Low current consumption: 900 µA
Sleep mode for extended battery life, <1 µA consumption
120 dB maximum SPL
High PSR of −80 dBFS
Fourth-order Σ-Δ modulator
Digital PDM output
Compatible with Sn/Pb and Pb-free solder processes
RoHS/WEEE compliant
FUNCTIONAL BLOCK DIAGRAM
ADMP521
ADC
PDM
MODULATOR
POWER
MANAGEMENT
CHANNEL
SELECT
CLK
DATA
Figure 1.
APPLICATIONS
Smartphones and feature phones
Tablet computers
Teleconferencing systems
Digital still and video cameras
Bluetooth headsets
Notebook PCs
Security and surveillance
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BOTTOM
TOP
Figure 2. Isometric Views of ADMP521 Microphone Package
GENERAL DESCRIPTION
The ADMP5211 is a high performance, ultralow noise, low
power, digital output, bottom-ported omnidirectional MEMS
microphone. The ADMP521 consists of a MEMS microphone
element and an impedance converter amplifier followed by a
fourth-order sigma-delta (Σ-Δ) modulator. The digital interface
allows for the pulse density modulated (PDM) output of two
microphones to be time-multiplexed on a single data line using
a single clock. The ADMP521 is function and pin compatible with
the ADMP421 microphone, providing an easy upgrade path.
The ADMP521 has a very high signal-to-noise ratio (SNR) and
common sensitivity of −26 dBFS, making it an excellent choice
for far field applications. The ADMP521 has an extended wide-
band frequency response resulting in natural sound with high
intelligibility. Low current consumption and a sleep mode with
less than 1 µA current consumption enables long battery life
for portable applications. The ADMP521 complies with the
TIA-920 Tele-communications Telephone Terminal Equipment
Transmission Requirements for Wideband Digital Wireline
Telephones standard.
The ADMP521 is available in a thin 4 mm × 3 mm × 1 mm
surface-mount package. It is reflow solder compatible with
no sensitivity degradation. The ADMP521 is halide free.
1 Protected by U.S. Patents 7,449,356; 7,825,484; 7,885,423; 7,961,897. Other patents are pending.
Rev. A
Information furnished by Analog Devices is believed to be accurate and reliable. However, no
responsibilityisassumedbyAnalogDevices for itsuse,nor foranyinfringementsofpatentsor other
rights of third parties that may result from its use. Specifications subject to change without notice. No
license is granted by implication or otherwise under any patent or patent rights of Analog Devices.
Trademarksandregisteredtrademarksarethepropertyoftheirrespectiveowners.
One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106, U.S.A.
Tel: 781.329.4700
www.analog.com
Fax: 781.461.3113
©2012 Analog Devices, Inc. All rights reserved.
datasheet pdf - http://www.DataSheet4U.net/
1 page  
Data Sheet
ABSOLUTE MAXIMUM RATINGS
Table 3.
Parameter
Supply Voltage
Digital Pin Input Voltage
Sound Pressure Level
Mechanical Shock
Vibration
Temperature Range
Rating
−0.3 V to +3.6 V
−0.3 V to VDD + 0.3 V or +3.6 V,
whichever is less
160 dB
10,000 g
Per MIL-STD-883 Method 2007,
Test Condition B
−40°C to +85°C
ADMP521
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
ESD CAUTION
TP
TL TSMAX
TSMIN
RAMP-UP
tP
CRITICAL ZONE
TL TO TP
tL
tS
PREHEAT
RAMP-DOWN
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t25°C TO PEAK
TIME
Figure 4. Recommended Soldering Profile Limits
Table 4. Recommended Soldering Profile Limits
Profile Feature
Average Ramp Rate (TL to TP)
Preheat
Minimum Temperature (TSMIN)
Maximum Temperature (TSMAX)
Time (TSMIN to TSMAX), tS
Ramp-Up Rate (TSMAX to TL)
Time Maintained Above Liquidous (tL)
Liquidous Temperature (TL)
Peak Temperature (TP)
Time Within 5°C of Actual Peak Temperature (tP)
Ramp-Down Rate
Time 25°C (t25°C) to Peak Temperature
Sn63/Pb37
1.25°C/sec maximum
100°C
150°C
60 sec to 75 sec
1.25°C/sec
45 sec to 75 sec
183°C
215°C +3°C/−3°C
20 sec to 30 sec
3°C/sec maximum
5 minute maximum
Pb-Free
1.25°C/sec maximum
100°C
200°C
60 sec to 75 sec
1.25°C/sec
~50 sec
217°C
260°C + 0°C/−5°C
20 sec to 30 sec
3°C/sec maximum
5 minute maximum
Rev. A | Page 5 of 16
datasheet pdf - http://www.DataSheet4U.net/
5 Page 
Data Sheet
ADMP521
PCB DESIGN AND LAYOUT
The recommended PCB land pattern for the ADMP521 should
be laid out to a 1:1 ratio to the solder pads on the microphone
package, as shown in Figure 15. Take care to avoid applying solder
paste to the sound hole in the PCB. A suggested solder paste
stencil pattern layout is shown in Figure 16.
The response of the ADMP521 is not affected by the PCB hole
size as long as the hole is not smaller than the sound port of the
microphone (0.25 mm, or 0.010”, in diameter). A 0.5 mm to 1 mm
(0.020 inch to 0.040 inch) diameter for the hole is recommended.
Take care to align the hole in the microphone package with the
hole in the PCB. The exact degree of the alignment does not affect
the microphone performance as long as the holes are not partially
or completely blocked.
4× 0.40 × 0.60
(0.30)
3.80
CENTER LINE
ø1.70
0.35
0.90 (0.30)
(1.000)
2.80
ø1.10
(0.30)
(0.30)
0.70
2× R0.10
(0.550)
2.05 0.35
Figure 15. Suggested PCB Land Pattern Layout
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1.849
1.45
CENTER
LINE
2.45
0.9
0.35
1.498 × 0.248
0.248 × 0.948 (2×)
0.398 × 0.298 (4×)
0.7
1.000
0.248 × 1.148 (2×)
1.525
1.849
0.375
24° 24°
0.248 × 0.498 (2×)
1.17 1.498
0.205 WIDE
0.362 CUT (3×)
Figure 16. Suggested Solder Paste Stencil Pattern Layout
Rev. A | Page 11 of 16
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11 Page | ||
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