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ADP1190 데이터시트 PDF




Analog Devices에서 제조한 전자 부품 ADP1190은 전자 산업 및 응용 분야에서
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부품번호 ADP1190 기능
기능 Integrated 500 mA Load Switch
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ADP1190 데이터시트, 핀배열, 회로
Data Sheet
FEATURES
Low input voltage range: 1.4 V to 3.6 V
Power switch: low RDSON of 60 mΩ at 3.6 V, with active
discharge
4 normally open SPST signal switches: RDSON of 2 Ω at 1.8 V
with active pull-down on one side
500 mA continuous operating current
Built-in level shift for control logic that can be operated
by 1.2 V logic
Ultralow shutdown current: <0.7 μA
Ultrasmall 1.2 mm × 1.6 mm × 0.5 mm, 12-ball, 0.4 mm
pitch WLCSP
APPLICATIONS
Mobile phones
SIM card disconnect switches
Digital cameras and audio devices
Portable and battery-powered equipment
Integrated 500 mA Load Switch
with Quad Signal Switch
ADP1190
FUNCTIONAL BLOCK DIAGRAM
P
S1 T1
N
P
S2 T2
N
P
S3 T3
N
P
S4
N
http://www.DataSheet4U.com/
OFF
EN
ON
IN
5ms
DEBOUNCE
4MΩ
LOAD SWITCH
Figure 1.
T4
GND
OUT
GENERAL DESCRIPTION
The ADP1190 is an integrated high-side load switch with four
signal switches, designed for operation from 1.4 V to 3.6 V.
This load switch provides power domain isolation for extended
power battery life. The load switch is a low on-resistance
P-channel MOSFET that supports up to 500 mA of continuous
load current and minimizes power loss. Integrated with the load
switch are four normally open 2 Ω SPST signal switches.
Aside from its excellent operating performance, the ADP1190
occupies minimal printed circuit board (PCB) space with an
area less than 1.92 mm2 and a height of 0.50 mm. The ADP1190
is available in an ultrasmall 1.2 mm × 1.6 mm, 12-ball, 0.4 mm
pitch WLCSP.
Rev. 0
Document Feedback
Information furnished by Analog Devices is believed to be accurate and reliable. However, no
responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other
rights of third parties that may result from its use. Specifications subject to change without notice. No
license is granted by implication or otherwise under any patent or patent rights of Analog Devices.
Trademarksandregisteredtrademarksarethepropertyoftheirrespectiveowners.
One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106, U.S.A.
Tel: 781.329.4700
©2013 Analog Devices, Inc. All rights reserved.
Technical Support
www.analog.com




ADP1190 pdf, 반도체, 판매, 대치품
ADP1190
ABSOLUTE MAXIMUM RATINGS
Table 2.
Parameter
IN to GND
OUT to GND
Sx to GND
Tx to GND
EN to GND
Continuous Load Switch Current
TA = 25°C
TA = 85°C
Continuous Diode Current
Storage Temperature Range
Junction Temperature
Operating Junction Temperature Range
Operating Ambient Temperature Range
Soldering Conditions
Rating
−0.3 V to +4.0 V
−0.3 V to VIN
−0.3 V to +4.0 V
−0.3 V to +4.0 V
−0.3 V to +4.0 V
±1 A
±500 mA
−50 mA
−65°C to +150°C
+150°C
−40°C to +125°C
−40°C to +85°C
JEDEC J-STD-020
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
THERMAL DATA
Absolute maximum ratings apply individually only, not in
combination. The ADP1190 can be damaged when the junction
temperature limits are exceeded. Monitoring ambient tempera-
ture does not guarantee that TJ is within the specified temperature
limits. In applications with high power dissipation and poor
thermal resistance, the maximum ambient temperature may
need to be derated.
In applications with moderate power dissipation and low PCB
thermal resistance, the maximum ambient temperature can
exceed the maximum limit as long as the junction temperature
is within specification limits. The junction temperature (TJ) of
the device is dependent on the ambient temperature (TA), the
power dissipation of the device (PD), and the junction-to-ambient
thermal resistance of the package (θJA).
Maximum junction temperature (TJ) is calculated from the
ambient temperature (TA) and power dissipation (PD) using the
formula
TJ = TA + (PD × θJA)
Data Sheet
The junction-to-ambient thermal resistance (θJA) of the package
is based on modeling and calculation using a 4-layer board. The
junction-to-ambient thermal resistance is highly dependent on
the application and board layout. In applications where high maxi-
mum power dissipation exists, close attention to thermal board
design is required. The value of θJA may vary, depending on
PCB material, layout, and environmental conditions. The speci-
fied value of θJA is based on a 4-layer, 4 in. × 3 in. circuit board. See
JESD51-7 and JESD51-9 for detailed information on the board
construction. For additional information, see the AN-617
Application Note, Wafer Level Chip Scale Package, available at
www.analog.com.
ΨJB is the junction-to-board thermal characterization parameter
with units of °C/W. ΨJB of the package is based on modeling and
calculation using a 4-layer board. JESD51-12, Guidelines for
Reporting and Using Electronic Package Thermal Information,
states that thermal characterization parameters are not the same
as thermal resistances. ΨJB measures the component power
flowing through multiple thermal paths rather than through a
single path as in thermal resistance, θJB. Therefore, ΨJB thermal
paths include convection from the top of the package as well as
radiation from the package, factors that make ΨJB more useful
in real-world applications. Maximum junction temperature (TJ)
is calculated from the board temperature (TB) and power
dissipation (PD) using the formula
http://www.DataSheet4U.com/
TJ = TB + (PD × ΨJB)
See JESD51-8 and JESD51-12 for more detailed information
about ΨJB.
THERMAL RESISTANCE
θJA and ΨJB are specified for the worst-case conditions, that is, a
device soldered in a circuit board for surface-mount packages.
Table 3. Thermal Resistance
Package Type
θJA ΨJB
Unit
12-Ball WLCSP
130 29.2 °C/W
ESD CAUTION
Rev. 0 | Page 4 of 12

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ADP1190 전자부품, 판매, 대치품
Data Sheet
ADP1190
1.2
1.0
0.8
0.6
0.4
0.2
0
–40
–5 25 55
TEMPERATURE (°C)
10mA
50mA
100mA
250mA
500mA
85
Figure 10. Ground Current vs. Temperature, Different Load Currents,
VIN = 3.6 V
0.6
1.4V
1.6V
1.8V
0.5 2.4V
2.8V
3.3V
3.6V
0.4
0.3
0.2
0.1
0
–50 –30 –10
10
30
50
70
90
TEMPERATURE (°C)
Figure 11. Shutdown Current vs. Temperature, Different Input Voltages
2.0
–40°C
1.8 –5°C
+25°C
1.6
+55°C
+85°C
1.4
1.2
1.0
0.8
0.6
0.4
0.2
0
1.2 1.6 2.0 2.4 2.8 3.2 3.6
VIN (V)
Figure 12. No Load Ground Current vs. Input Voltage and Temperature
4.0
3.6V
3.5
2.2V
1.8V
1.6V
3.0 1.4V
2.5
2.0
1.5
1.0
0.5
0
0 0.4 0.8 1.2 1.6 2.0 2.4 2.8 3.2 3.6
ANALOG SWITCH VOLTAGE (V)
Figure 13. Signal Switch RDSON vs. Analog Switch Voltage
10
–40°C
9
–5°C
+25°C
+55°C
8 +85°C
7
6
5
4
3
http://www.DataSheet4U.com/
2
1
0
0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8
ANALOG SWITCH VOLTAGE (V)
Figure 14. Signal Switch RDSON vs. Analog Switch Voltage and Temperature,
VIN = 1.4 V
3.0
–40°C
–5°C
+25°C
2.5 +55°C
+85°C
2.0
1.5
1.0
0.5
0
0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8
ANALOG SWITCH VOLTAGE (V)
Figure 15. Signal Switch RDSON vs. Analog Switch Voltage and Temperature,
VIN = 1.8 V
Rev. 0 | Page 7 of 12

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