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PDF SIS406DN Data sheet ( Hoja de datos )
| Número de pieza | SIS406DN | |
| Descripción | N-Channel MOSFET | |
| Fabricantes | Vishay | |
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New Product
N-Channel 30-V (D-S) MOSFET
SiS406DN
Vishay Siliconix
PRODUCT SUMMARY
VDS (V)
RDS(on) (Ω)
0.011 at VGS = 10 V
30
0.0145 at VGS = 4.5 V
ID (A)
14
12.2
PowerPAK 1212-8
3.30 mm
D
8D
7
D
6
D
5
S
1S
3.30 mm
2
S
3G
4
Bottom View
Ordering Information: SiS406DN-T1-GE3 (Lead (Pb)-free and Halogen-free)
FEATURES
• Halogen-free
• TrenchFET® Power MOSFET
• PWM Optimized
• New Low Thermal Resistance PowerPAK®
Package with Low 1.07 mm Profile
• 100 % Rg Tested
• 100 % UIS Tested
APPLICATIONS
• Adaptor Switch
• Load Switch
D
RoHS
COMPLIANT
G
S
N-Channel MOSFET
ABSOLUTE MAXIMUM RATINGS TA = 25 °C, unless otherwise noted
Parameter
Symbol
10 s
Steady State
Drain-Source Voltage
VDS 30
Gate-Source Voltage
VGS
± 25
Continuous Drain Current (TJ = 150 °C)a
TA = 25 °C
TA = 70 °C
ID
14 9
12.2 7.3
Pulsed Drain Current
IDM 50
Continuous Source Current (Diode Conduction)a
IS 3.3 1.4
Single Pulse Avalanche Current
Avalanche Energy
L = 0.1 mH
IAS
EAS
20
20
Maximum Power Dissipationa
TA = 25 °C
TA = 70 °C
PD
3.7
2.3
1.5
1.0
Operating Junction and Storage Temperature Range
TJ, Tstg
- 55 to 150
Soldering Recommendations (Peak Temperature)b, c
260
Unit
V
A
mJ
W
°C
THERMAL RESISTANCE RATINGS
Parameter
Symbol
Typical
Maximum
Unit
Maximum Junction-to-Ambienta
Maximum Junction-to-Case (Drain)
t ≤ 10 s
Steady State
Steady State
RthJA
RthJC
28
66
2.0
34
81 °C/W
2.4
Notes:
a. Surface Mounted on 1" x 1" FR4 board.
b. See Solder Profile (http://www.vishay.com/ppg?73257). The PowerPAK 1212-8 is a leadless package. The end of the lead terminal is exposed
copper (not plated) as a result of the singulation process in manufacturing. A solder fillet at the exposed copper tip cannot be guaranteed and
is not required to ensure adequate bottom side solder interconnection.
c. Rework Conditions: manual soldering with a soldering iron is not recommended for leadless components.
Document Number: 68805
S-82301-Rev. A, 22-Sep-08
www.vishay.com
1
Free Datasheet http://www.datasheet4u.com/
1 page  
New Product
SiS406DN
Vishay Siliconix
TYPICAL CHARACTERISTICS 25 °C, unless otherwise noted
60
50
40
30
20 Package Limited
10
0
0 25 50 75 100 125 150
TC - Case Temperature (°C)
Current Derating*
70
60
50
40
30
20
10
0
0 25 50 75 100 125 150
TC - Case Temperature (°C)
Power, Junction-to-Case
2.20
1.76
1.32
0.88
0.44
0.00
0
25 50 75 100 125
TA - Ambient Temperature (°C)
Power, Junction-to-Ambient
150
* The power dissipation PD is based on TJ(max) = 150 °C, using junction-to-case thermal resistance, and is more useful in settling the upper
dissipation limit for cases where additional heatsinking is used. It is used to determine the current rating, when this rating falls below the package
limit.
Document Number: 68805
S-82301-Rev. A, 22-Sep-08
www.vishay.com
5
5 Page 
AN822
Vishay Siliconix
105
Spreading Copper (sq. in.)
95
85
75
65
55
0%
45
100 %
50 %
0.00 0.25 0.50 0.75 1.00 1.25 1.50 1.75 2.00
Figure 5. Spreading Copper - Si7401DN
130
120 Spreading Copper (sq. in.)
110
100
90
80
50 %
100 %
70
60 0 %
50
0.00 0.25 0.50 0.75 1.00 1.25 1.50 1.75 2.00
Figure 6. Spreading Copper - Junction-to-Ambient Performance
CONCLUSIONS
As a derivative of the PowerPAK SO-8, the PowerPAK
1212-8 uses the same packaging technology and has
been shown to have the same level of thermal perfor-
mance while having a footprint that is more than 40 %
smaller than the standard TSSOP-8.
Recommended PowerPAK 1212-8 land patterns are
provided to aid in PC board layout for designs using this
new package.
The PowerPAK 1212-8 combines small size with attrac-
tive thermal characteristics. By minimizing the thermal
rise above the board temperature, PowerPAK simplifies
thermal design considerations, allows the device to run
cooler, keeps rDS(ON) low, and permits the device to
handle more current than a same- or larger-size MOS-
FET die in the standard TSSOP-8 or SO-8 packages.
www.vishay.com
4
Document Number 71681
03-Mar-06
11 Page | ||
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| PDF Descargar | [ Datasheet SIS406DN.PDF ] | |
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