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TLP152 PDF 데이터시트 : 부품 기능 및 핀배열

부품번호 TLP152
기능 PHOTOCOUPLER
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TLP152 데이터시트, 핀배열, 회로
Photocouplers GaAℓAs Infrared LED & Photo IC
TLP152
TLP152
1. Applications
• Plasma Display Panels (PDPs)
• Transistor Inverters
• MOSFET Gate Drivers
• IGBT Gate Drivers
2. General
The TLP152 is a photocoupler in a SO6 package that consists of a GaAℓAs infrared light-emitting diode(LED)
optically coupled to an integrated high-gain, high-speed photodetector IC chip.
3. Features
(1) Buffer logic type (Totem pole output)
(2) Output peak current: ±2.5 A (max)
(3) Operating temperature: -40 to 100
(4) Supply current: 3 mA (max)
(5) Supply voltage: 10 to 30 V
(6) Threshold input current: 7.5 mA(max)
(7) Propagation delay time: tpHL = 190 ns (max), tpLH = 170 ns (max)
(8) Common-mode transient immunity: ±20 kV/µs (min)
(9) Isolation voltage: 3750 Vrms (min)
4. Packaging and Pin Assignment
11-4L1S
1: Anode
3: Cathode
4: GND
5: VO(Output)
6: VCC
1 2012-09-14
Rev.3.0
Free Datasheet http://www.datasheet4u.com/




TLP152 pdf, 반도체, 판매, 대치품
TLP152
9. Electrical Characteristics (Note)
(Unless otherwise specified, Ta = -40 to 100)
Characteristics
Symbol Note
Test
Circuit
Test Condition
Min Typ. Max Unit
Input forward voltage
Input forward voltage
temperature coefficient
VF
VF/Ta
IF = 10 mA, Ta = 25
IF = 10 mA
1.40 1.57 1.80
V
-1.8 mV/
Input reverse current
IR
VR = 5 V, Ta = 25
  10 µA
Input capacitance
Ct
V = 0 V, f = 1 MHz, Ta = 25  45 pF
Peak high-level output current IOPH
(Note 1) Fig. IF = 10 mA, VCC = 15 V,
12.1.1 V6-5 = 4 V
-2.2 -1.0 A
IF = 10 mA, VCC = 15 V,
V6-5 = 10 V
-3.4 -2.0
Peak low-level output current IOPL (Note 1) Fig. IF = 0 mA, VCC = 15 V,
12.1.2 V5-4 = 2 V
1.0 2.4
IF = 0 mA, VCC = 15 V,
V5-4 = 10 V
2.0 3.5
High-level output voltage
VOH
Fig. IF = 10 mA, VCC = 10 V,
12.1.3 IO = -100 mA
6.0 8.5
V
Low-level output voltage
VOL
Fig. VF = 0.8 V, VCC = 10 V,
12.1.4 IO = 100 mA
0.1 1.0
High-level supply current
ICCH
Fig. IF = 10 mA, VCC = 10 to 30 V, 1.9 3.0 mA
12.1.5 VO = Open
Low-level supply current
ICCL
Fig. IF = 0 mA, VCC = 10 to 30 V,
1.8
3.0
12.1.6 VO = Open
Threshold input current (L/H) IFLH
VCC = 15 V, VO > 1 V
1.5 7.5
Threshold input voltage (H/L)
Supply voltage
VFHL
VCC
VCC = 15 V, VO < 1 V

0.8 1.47
10 30
V
UVLO threshold voltage
VUVLO+
IF = 5 mA , VO > 2.5 V
7.5 8.7 9.5
VUVLO-
IF = 5 mA, VO < 2.5 V
7.5 8.4 9.5
UVLO hysteresis
UVLOHYS
IF = 5 mA , VO > 2.5 V
0.3
Note: All typical values are at Ta = 25.
Note: This device is designed for low power consumption, making it more sensitive to ESD than its predecessors.
Extra care should be taken in the design of circuitry and pc board implementation to avoid ESD problems.
Note 1: IO application time 50 µs, single pulse.
10. Isolation Characteristics (Unless otherwise specified, Ta = 25)
Characteristics
Symbol Note
Test Conditions
Min Typ. Max Unit
Total capacitance (input to output)
Isolation resistance
Isolation voltage
CS (Note 1) VS = 0 V, f = 1 MHz
RS (Note 1) VS = 500 V, R.H. 60%
BVS (Note 1) AC, 1 min
AC, 1 s, in oil
DC, 1 min, in oil
1×1012
3750
0.35
1014
10000
10000
pF
Vrms
Vdc
Note 1: This device is considered as a two-terminal device: Pins 1 and 3 are shorted together, and pins 4, 5 and 6 are
shorted together.
4 2012-09-14
Rev.3.0
Free Datasheet http://www.datasheet4u.com/

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TLP152 전자부품, 판매, 대치품
TLP152
13. Soldering and Storage
13.1. Precautions for Soldering
The soldering temperature should be controlled as closely as possible to the conditions shown below, irrespective
of whether a soldering iron or a reflow soldering method is used.
• When using soldering reflow (See Fig. 13.1.1 and 13.1.2)
Reflow soldering must be performed once or twice.
The mounting should be completed with the interval from the first to the last mountings being 2 weeks.
Fig. 13.1.1 An Example of a Temperature Profile Fig. 13.1.2 An Example of a Temperature Profile
When Sn-Pb Eutectic Solder Is Used
When Lead(Pb)-Free Solder Is Used
• When using soldering flow (Applicable to both eutectic solder and Lead(Pb)-Free solder)
Apply preheating of 150for 60 to 120 seconds.
Mounting condition of 260within 10 seconds is recommended.
Flow soldering must be performed once.
• When using soldering Iron (Applicable to both eutectic solder and Lead(Pb)-Free solder)
Complete soldering within 10 seconds for lead temperature not exceeding 260or within 3 seconds not
exceeding 350
Heating by soldering iron must be done only once per lead.
13.2. Precautions for General Storage
• Avoid storage locations where devices may be exposed to moisture or direct sunlight.
• Follow the precautions printed on the packing label of the device for transportation and storage.
• Keep the storage location temperature and humidity within a range of 5to 35and 45% to 75%,
respectively.
• Do not store the products in locations with poisonous gases (especially corrosive gases) or in dusty
conditions.
• Store the products in locations with minimal temperature fluctuations. Rapid temperature changes during
storage can cause condensation, resulting in lead oxidation or corrosion, which will deteriorate the
solderability of the leads.
• When restoring devices after removal from their packing, use anti-static containers.
• Do not allow loads to be applied directly to devices while they are in storage.
• If devices have been stored for more than two years under normal storage conditions, it is recommended
that you check the leads for ease of soldering prior to use.
7 2012-09-14
Rev.3.0
Free Datasheet http://www.datasheet4u.com/

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