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TLP2404 PDF 데이터시트 : 부품 기능 및 핀배열

부품번호 TLP2404
기능 PHOTOCOUPLER
제조업체 Toshiba
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TLP2404 데이터시트, 핀배열, 회로
TOSHIBA PHOTOCOUPLER GaAAs LED & PHOTO-IC
TLP2404
TLP2404
IPM (Intelligent Power Module)
Industrial Inverter
Operate at high ambient temperatures up to 125°C
87 65
Unit: mm
The Toshiba TLP2404 consists of GaAAs infrared light emitting diodes
and integrated high gain, high-speed photodetectors. The TLP2404 is
housed in the SO8 package. The output stage is an open collector type.
The photodetector has an internal Faraday shield that provides a
guaranteed common-mode transient immunity of ±15 kV/μs. TLP2404
guarantees minimum and maximum of propagation delay time, switching
speed dispersion, and high common mode transient immunity. Therefore
TLP2404 is suitable for isolation interface between IPM (Intelligent Power
Module) and control IC circuits in motor control application.
1 2 34
5.1 ±0.2
6.0 ±0.2
1.27 ±0.15
0.38
0.305 min
z Inverter logic type (Open collector output)
z Package type: SO8
z Guaranteed performance over temperature: -40 to 125°C
z Power supply voltage: -0.5 to 30 V
z Threshold Input Current: IFHL = 5.0 mA(max)
z Propagation delay time (tpHL/tpLH): tpHL = 400ns (max)
tpLH = 550ns (max)
z Switching Time Dispersion (|tpHL-tpLH|): 400ns (max)
z Common mode transient immunity: ±15kV/μs min
z Isolation voltage: 3750Vrms min
z UL under application : UL1577, File No.E67349
z c-UL under application
:CSA Component Acceptance Service No. 5A, File No.E67349
z Option(V4)
VDE under application : EN 60747-5-2
Truth Table
Input
H
L
LED
ON
OFF
Output
L
H
TOSHIBA
115K1
Weight: 0.11 gTyp.
11-5K1
Pin Configuration (Top View)
1 VCC 8 1:NC
2:ANODE
2 7 3:CATHODE
4:NC
3
6
5:GND
6:VO(Output)
4
GND 5 7:NC
SHIELD
8:VCC
Schematic
IF
2
3
SHIELD
ICC
VCC
IO 8
VO
6
GND
5
1 2009-12-26
Free Datasheet http://www.datasheet4u.com/




TLP2404 pdf, 반도체, 판매, 대치품
TLP2404
Switching Characteristics
(Unless otherwise specified, Ta = −40 to 125°C, VCC = 15V)
Characteristic
Propagation delay time (HL)
Symbol
tpHL
Test
Circuit
Propagation delay time (LH)
tpLH
Switching Time Dispersion
between ON and OFF
|tpLHtpHL|
Propagation Delay Skew (Note 5) tpLHtpHL
6
Test Condition
IF = 10 mA,
RL = 20k
(Note4)
CL=100pF
CL=10pF
CL=100pF
CL=10pF
CL=100pF
Min Typ. Max Unit
30 150 400
90
150 350 550
100
― ― 400
ns
-50 450
Common mode transient immunity
at high output level
Common mode transient Immunity
at low output level
CMH
CML
VCM = 1500 Vpp, IF = 0 mA,
7 RL = 20 kΩ,Ta=25°C
VCM = 1500 Vpp, IF = 10 mA
RL = 20 kΩ, Ta=25°C
15
15
kV/μs
kV/μs
*All typical values are at Ta=25°C
Note 3 : A ceramic capacitor (0.1 μF) should be connected from pin 8 (VCC) to pin 5 (GND) to stabilize the operation
of the high gain linear amplifier. Failure to provide the bypass may impair the switching property.
The total lead length between capacitor and coupler should not exceed 1 cm.
Note 4: f = 10kHz, duty = 10%, input current tr = tf = less than 5ns,
Note 5: Propagation delay skew is defined as the propagation delay time of the largest or smallest tpLH minus
the largest or smallest tpHL of multiple samples. Evaluations of these samples are conducted under identical
test conditions (supply voltage, input current, temperature, etc).
Test Circuit 1: IOH
Test Circuit 2: VOL
VF
SHIELD
0.1μF
VCC
A
VO IOH
IF
SHIELD
0.1μF
V
VOL IO
VCC
Test Circuit 3: ICCL
IF
SHIELD
ICCL
A
0.1 μF
VCC
Test Circuit 4: ICCH
SHIELD
ICCH
A
0.1 μF
VCC
4 2010-01-26
Free Datasheet http://www.datasheet4u.com/

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TLP2404 전자부품, 판매, 대치품
(2) Precautions for General Storage
TLP2404
1) Do not store devices at any place where they will be exposed to moisture or direct sunlight.
2) When transportation or storage of devices, follow the cautions indicated on the carton box.
3) The storage area temperature should be kept within a temperature range of 5 degree C
to 35 degree C, and relative humidity should be maintained at between 45% and 75%.
4) Do not store devices in the presence of harmful (especially corrosive)gases, or in dusty conditions.
5) Use storage areas where there is minimal temperature fluctuation. Because rapid temperature
changes can cause condensation to occur on stored devices, resulting in lead oxidation or corrosion,
as a result, the solderability of the leads will be degraded.
6) When repacking devices, use anti-static containers.
7) Do not apply any external force or load directly to devices while they are in storage.
8) If devices have been stored for more than two years, even though the above conditions have been
followed, it is recommended that solderability of them should be tested before they are used.
7 2010-01-26
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