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PDF NUP2114 Data sheet ( Hoja de datos )
| Número de pieza | NUP2114 | |
| Descripción | TVS Diode ( Rectifier ) | |
| Fabricantes | ON Semiconductor | |
| Logotipo |  |
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NUP2114 Series,
SNUP2114UCMR6T1G
Transient Voltage
Suppressors
Low Capacitance ESD Protection for
High Speed Data
The NUP2114 transient voltage suppressor is designed to protect
high speed data lines from ESD. Ultra−low capacitance and high level
of ESD protection makes this device well suited for use in USB 2.0
applications.
Features
Low Capacitance 0.8 pF
S Prefix for Automotive and Other Applications Requiring Unique
Site and Control Change Requirements
AEC−Q101 Qualified and PPAP Capable − SNUP2114
Low Clamping Voltage
Stand Off Voltage: 5 V
Low Leakage
ESD Rating of Class 3B (Exceeding 8 kV) per Human Body model
and Class C (Exceeding 400 V) per Machine Model
Protection for the Following IEC Standards:
IEC 61000−4−2 Level 4 ESD Protection
UL Flammability Rating of 94 V−0
These are Pb−Free Devices
Typical Applications
High Speed Communication Line Protection
USB 2.0 High Speed Data Line and Power Line Protection
Monitors and Flat Panel Displays
MP3
Gigabit Ethernet
Notebook Computers
Digital Video Interface (DVI) and HDMI
MAXIMUM RATINGS (TJ = 25C unless otherwise noted)
Rating
Symbol
Value
Unit
Operating Junction Temperature Range TJ −40 to +125 C
Storage Temperature Range
Tstg − 55 to +150 C
Lead Solder Temperature −
Maximum (10 Seconds)
TL 260 C
Human Body Model (HBM)
Machine Model (MM)
IEC 61000−4−2 Contact
IEC61000−4−2 Air
ESD
16000
400
8000
15000
V
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
See Application Note AND8308/D for further description of
survivability specs.
Semiconductor Components Industries, LLC, 2012
March, 2012 − Rev. 1
1
http://onsemi.com
SOT−553
CASE 463B
TSOP−6
CASE 318G
VP
I/O I/O
VN
MARKING DIAGRAMS
P2MG
1G
SOT−553
P2M MG
G
1
TSOP−6
P2, P2M = Specific Device Code
M = Date Code
G = Pb−Free Package
(*Note: Microdot may be in either location)
PIN CONNECTIONS
VP 1
VN 2
NC 3
5 I/O
4 I/O
SOT−553
I/O 1
6 I/O
VN 2
NC 3
5 VP
4 NC
TSOP−6
ORDERING INFORMATION
See detailed ordering and shipping information in the package
dimensions section on page 4 of this data sheet.
Publication Order Number:
NUP2114/D
Free Datasheet http://www.datasheet4u.com/
1 page  
NUP2114 Series, SNUP2114UCMR6T1G
PACKAGE DIMENSIONS
D
65 4
E1
ÉÉÉÉÉÉ1 2 3
NOTE 5
e
E
b
0.05
A1
A
TSOP−6
CASE 318G−02
ISSUE U
H
L2
GAUGE
PLANE
L
M
DETAIL Z
C
SEATING
PLANE
c
DETAIL Z
NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. MAXIMUM LEAD THICKNESS INCLUDES LEAD FINISH. MINIMUM
LEAD THICKNESS IS THE MINIMUM THICKNESS OF BASE MATERIAL.
4. DIMENSIONS D AND E1 DO NOT INCLUDE MOLD FLASH,
PROTRUSIONS, OR GATE BURRS. MOLD FLASH, PROTRUSIONS, OR
GATE BURRS SHALL NOT EXCEED 0.15 PER SIDE. DIMENSIONS D
AND E1 ARE DETERMINED AT DATUM H.
5. PIN ONE INDICATOR MUST BE LOCATED IN THE INDICATED ZONE.
MILLIMETERS
DIM MIN
NOM MAX
A 0.90
1.00
1.10
A1 0.01
0.06
0.10
b 0.25 0.38 0.50
c 0.10 0.18 0.26
D 2.90
3.00
3.10
E 2.50
2.75
3.00
E1 1.30
1.50
1.70
e 0.85 0.95 1.05
L 0.20 0.40 0.60
L2 0.25 BSC
M 0
− 10
RECOMMENDED
SOLDERING FOOTPRINT*
6X
0.60
3.20
6X
0.95
0.95
PITCH
DIMENSIONS: MILLIMETERS
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
http://onsemi.com
5
Free Datasheet http://www.datasheet4u.com/
5 Page | ||
| Páginas | Total 6 Páginas | |
| PDF Descargar | [ Datasheet NUP2114.PDF ] | |
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