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PDF NUP2114UCMR6 Data sheet ( Hoja de datos )
| Número de pieza | NUP2114UCMR6 | |
| Descripción | TVS Diode ( Rectifier ) | |
| Fabricantes | ON Semiconductor | |
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NUP2114UCMR6
Transient Voltage
Suppressors
Low Capacitance ESD Protection for
High Speed Data
The NUP2114UCMR6 transient voltage suppressor is designed to
protect high speed data lines from ESD. Ultra−low capacitance and
high level of ESD protection makes this device well suited for use in
USB 2.0 high speed applications.
Features
• Low Capacitance 0.8 pF
• Low Clamping Voltage
• Stand Off Voltage: 5 V
• Low Leakage
• ESD Rating of Class 3B (Exceeding 8 kV) per Human Body model
and Class C (Exceeding 400 V) per Machine Model
• IEC61000−4−2 Level 4
• UL Flammability Rating of 94 V−0
• This is a Pb−Free Device
Typical Applications
• High Speed Communication Line Protection
• USB 2.0 High Speed Data Line and Power Line Protection
• Gigabit Ethernet
• Notebook Computers
MAXIMUM RATINGS (TJ = 25°C unless otherwise noted)
Rating
Symbol
Value
Unit
Operating Junction Temperature Range TJ −40 to +125 °C
Storage Temperature Range
Tstg − 55 to +150 °C
Lead Solder Temperature −
Maximum (10 Seconds)
TL 260 °C
Human Body Model (HBM)
Machine Model (MM)
IEC61000−4−2 Contact
IEC61000−4−2 Air
ESD
16000
400
13000
15000
V
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
See Application Note AND8308/D for further description of
survivability specs.
http://onsemi.com
I/O VP
I/O
MARKING
DIAGRAM
1
TSOP−6
CASE 318G
P2M MG
G
1
P2M = Specific Device Code
M = Date Code
G = Pb−Free Package
(Note: Microdot may be in either location)
PIN CONNECTIONS
I/O 1
6 I/O
VN 2
NC 3
5 VP
4 NC
ORDERING INFORMATION
Device
Package
Shipping
NUP2114UCMR6T1G TSOP−6 3000 / Tape &
(Pb−Free)
Reel
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specification
Brochure, BRD8011/D.
© Semiconductor Components Industries, LLC, 2010
January, 2010 − Rev. 4
1
Publication Order Number:
NUP2114UCMR6/D
Free Datasheet http://www.datasheet4u.com/
1 page  
NUP2114UCMR6
PACKAGE DIMENSIONS
D
65 4
E1
ÉÉÉÉÉÉ1 2 3
NOTE 5
e
E
b
0.05
A1
A
TSOP−6
CASE 318G−02
ISSUE U
H
L2
GAUGE
PLANE
L
M
DETAIL Z
C
SEATING
PLANE
c
DETAIL Z
NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. MAXIMUM LEAD THICKNESS INCLUDES LEAD FINISH. MINIMUM
LEAD THICKNESS IS THE MINIMUM THICKNESS OF BASE MATERIAL.
4. DIMENSIONS D AND E1 DO NOT INCLUDE MOLD FLASH,
PROTRUSIONS, OR GATE BURRS. MOLD FLASH, PROTRUSIONS, OR
GATE BURRS SHALL NOT EXCEED 0.15 PER SIDE. DIMENSIONS D
AND E1 ARE DETERMINED AT DATUM H.
5. PIN ONE INDICATOR MUST BE LOCATED IN THE INDICATED ZONE.
MILLIMETERS
DIM MIN
NOM MAX
A 0.90
1.00
1.10
A1 0.01
0.06
0.10
b 0.25 0.38 0.50
c 0.10 0.18 0.26
D 2.90
3.00
3.10
E 2.50
2.75
3.00
E1 1.30
1.50
1.70
e 0.85 0.95 1.05
L 0.20 0.40 0.60
L2 0.25 BSC
M 0°
− 10°
RECOMMENDED
SOLDERING FOOTPRINT*
6X
0.60
3.20
6X
0.95
0.95
PITCH
DIMENSIONS: MILLIMETERS
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
ON Semiconductor and
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice
to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.
“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All
operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights
nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications
intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should
Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates,
and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death
associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal
Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.
PUBLICATION ORDERING INFORMATION
LITERATURE FULFILLMENT:
Literature Distribution Center for ON Semiconductor
P.O. Box 5163, Denver, Colorado 80217 USA
Phone: 303−675−2175 or 800−344−3860 Toll Free USA/Canada
Fax: 303−675−2176 or 800−344−3867 Toll Free USA/Canada
Email: [email protected]
N. American Technical Support: 800−282−9855 Toll Free
USA/Canada
Europe, Middle East and Africa Technical Support:
Phone: 421 33 790 2910
Japan Customer Focus Center
Phone: 81−3−5773−3850
http://onsemi.com
5
ON Semiconductor Website: www.onsemi.com
Order Literature: http://www.onsemi.com/orderlit
For additional information, please contact your local
Sales Representative
NUP2114UCMR6/D
Free Datasheet http://www.datasheet4u.com/
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