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06XSD200 데이터시트 PDF




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부품번호 06XSD200 기능
기능 Dual 6.0 mOhm High Side Switch
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06XSD200 데이터시트, 핀배열, 회로
Freescale Semiconductor
Advance Information
Document Number: MC06XSD200
Rev. 2.0, 9/2013
Dual 6.0 mOhm High Side Switch
The 06XSD200 device is part of a 36 V dual high side switch product
family with integrated control and a high number of protective and
diagnostic functions. It has been designed for industrial applications.
The low RDS(ON) channels (<6.0 m) can control different load types;
bulbs, solenoids, or DC motors. Control, device configuration, and
diagnostics are performed through a 16-bit serial peripheral interface
(SPI), allowing easy integration into existing applications.
Both channels can be controlled individually by external/internal
clock-signals or by direct inputs. Using the internal clock allows fully
autonomous device operation. Programmable output voltage slew
rates (individually programmable) help improve EMC performance. To
avoid shutting off the device during inrush current, while still being able
to closely track the load current, a dynamic overcurrent threshold
profile is featured. Switching current of each channel can be sensed
with a programmable sensing ratio. Whenever communication with the
external microcontroller is lost, the device enters a fail-safe operation
mode, but remains operational, controllable, and protected.
This device is powered by SMARTMOS technology.
Features
• Normal operating range: 8.0 - 36 V, extended range: 6.0 - 58 V,
3.3 V and 5.0 V compatible 16-bit SPI port for device control,
configuration, and diagnostics at rates up to 8.0 MHz
• Two fully-protected 6.0 m(@ 25 °C) high side switches
• Up to 9.0 A steady-state current per channel
• Separate bulb and DC motor latched overcurrent handling
• Parallel output operating mode with improved switching
synchronization
• Individually programmable internal/external PWM clock signals
(switching frequency, duty cycle, slew rate, switch-on time-shift)
• Overcurrent, short-circuit, and overtemperature protection with
programmable auto-retry functions
• Accurate temperature and current sensing (high/low sensing
ratios/offset compensation)
• OpenLoad detection (channel in OFF and ON state), also for LED
applications (7.0 mA typ.)
06XSD200
HIGH SIDE SWITCH
FK SUFFIX (PB-FREE)
98ASA00428D
23 PIN PQFN (12 X12 mm)
ORDERING INFORMATION
Device
Temperature
Range (TA)
Package
MC06XSD200FK
-40 to 125 °C
23 PQFN
VDD
I/O
I/O
SCLK
CSB
SI
MCU I/O
SO
I/O
I/O
GND
I/O
A/D
A/D
VDD
VPWR
06XSD200
VDD VPWR
CLOCK
FSB
SCLK
CSB
SO
RSTB
SI
IN0
IN1
HS0
HS1
CONF0
CONF1
FSOB
SYNC
CSNS
GND
LOAD
M LOAD
Figure 1. Simplified Application Diagram
*This document contains certain information on a product under development.
Freescale reserves the right to change or discontinue this product without notice
© Freescale Semiconductor, Inc., 2013. All rights reserved.
Free Datasheet http://www.datasheet4u.com/




06XSD200 pdf, 반도체, 판매, 대치품
PIN CONNECTIONS
Transparent Top View
PIN CONNECTIONS
SO
GND
VPWR
16
17
GND
14
23
22
18 21
06XSD200
VPWR
15
SYNC
GND
VPWR
19 20
HS1 HS0
Figure 3. Device Pin Assignments
Table 1. 06XSD200 Pin Assignments
The function of each pin is described in the section Functional Description
Pin
Number
Pin Name
Function
Formal Name
Definition
1
CSNS
Output
Output Current/
This pin either outputs a current proportional to the channel’s output current or
Temperature
a voltage proportional to the temperature of the GND pin (pin 14). Selection
Monitoring
between current and temperature sensing, as well as setting the current
sensing sensitivity are performed through the SPI interface. An external pull-
down resistor must be connected between CSNS and GND.
2
IN0 Input
Direct Inputs
The IN[0:1] input pins are used to directly control the switching state of both
3 IN1
switches and consequently the voltage on the HS0:HS1 output pins. The pins
are connected to GND by internal pull-down resistors
4
FSOB
Output
Fail-safe Output FSOB is asserted (active-low) upon entering Fail-safe mode (see Functional
(Active Low)
Description) This open-drain output requires an external pull-up resistor to
VPWR
5
CONF0
Input
Configuration Input The CONF[0:1] input pins are used to select the appropriate overcurrent
6 CONF1
detection profile (bulb/DC motor) for each of both channels. CONF requires a
pull-down resistor to GND.
7 FSB Output
8
CLOCK
Input
Fault Status
(Active Low)
PWM Clock
This open-drain output pin (external pull-up resistor to VDD required) is set
when the device enters Fault mode (see Fault Mode)
The clock input gives the time-base when the device is operated in external
clock/internal PWM mode.
This pin has an internal pull-down current source.
9
RSTB
Input
Reset
This input pin is used to initialize the device’s configuration - and fault registers.
Reset puts the device in Sleep mode (low current consumption) provided it is
not stimulated by direct input signals.This pin is connected to GND by an
internal pull-down resistor.
10
CSB
Input
Chip Select
(Active Low)
This input pin is connected to the SPI chip-select output of an external µ-
controller. CSB is internally pulled up to VDD by a current source IUP.
06XSD200
4
Analog Integrated Circuit Device Data
Freescale Semiconductor
Free Datasheet http://www.datasheet4u.com/

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06XSD200 전자부품, 판매, 대치품
ELECTRICAL CHARACTERISTICS
MAXIMUM RATINGS
Table 2. Maximum Ratings (continued)
All voltages are relative to ground unless mentioned otherwise. Exceeding these ratings may cause permanent damage.
Parameter
Symbol
Maximum ratings
Unit
THERMAL RATINGS
Operating Temperature (8)
C
Ambient
Junction
TA -40 to 125
TJ -40 to 150
Storage Temperature
TSTG
-55 to 150
C
Thermal Resistance / Junction to Case
Reflow Peak Temperature on device pins during soldering(9), (10)
RJC
TSOLDER
<1.0
260
C/ W
C
Notes:
8. To achieve high reliability over 10 years of continuous operation, the device's continuous operating junction temperature should not
exceed 125 C.
9. 10 seconds maximum duration. Not designed for immersion soldering. Exceeding these limits may cause malfunction or permanent
damage to the device. MSL level is specified later.
10. Freescale’s Package Reflow capability meets Pb-free requirements for JEDEC standard J-STD-020. For Peak Package Reflow
Temperature and Moisture Sensitivity Levels (MSL), Go to www.freescale.com, search by part number [e.g. remove prefixes/suffixes
and enter the core ID to view all orderable parts. (i.e. MC33xxxD enter 33xxx), and review parametrics.
Analog Integrated Circuit Device Data
Freescale Semiconductor
06XSD200
7
Free Datasheet http://www.datasheet4u.com/

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06XSD200

Dual 6.0 mOhm High Side Switch

Freescale Semiconductor
Freescale Semiconductor

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