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BD3572FP 데이터시트 PDF




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부품번호 BD3572FP 기능
기능 (BD3570FP - BD3575HFP) High Voltage LDO Regulators
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BD3572FP 데이터시트, 핀배열, 회로
Power Management IC Series for Automotive Body Control
High Voltage
LDO Regulators
BD3570FP, BD3570HFP, BD3571FP, BD3571HFP, BD3572FP, BD3572HFP
BD3573FP, BD3573HFP, BD3574FP, BD3574HFP, BD3575FP, BD3575HFP
No.11036EBT02
Description
BD357XFP/HFP SERIES regulators feature a high 50 V withstand-voltage and are suitable for use with onboard vehicle
microcontrollers. They offer the output current of 500 mA while limiting the quiescent current to 30μA (TYP).With these
devices, a ceramic capacitor can be selected at the output for stable operation, the output tolerance is within ±2% over the
wide ambient temperature range (-40 to 125), and the short circuit protection is folded-type to minimize generation of
heat during malfunction. These devices are developed to offer most robust power-supply design under the harsh
automotive environment. The BD357XFP/HFP Series provide ideal solutions to lower the current consumption as well as to
simplify the use with battery direct-coupled systems.
Features
1) Ultra-low quiescent current: 30μA (TYP.)
2) Low-saturation voltage type P-channel DMOS output transistors
3) High output voltage precision: 2%Iomax = 500 mA
4) Low-ESR ceramic capacitors can be used as output capacitors.
5) Vcc power supply voltage = 50 V
6) Built-in overcurrent protection circuit and thermal shutdown circuit
7) TO252-3, TO252-5, HRP5 Package
Applications
Onboard vehicle devices (body-control, car stereos, satellite navigation systems, etc.)
Line up matrix
BD3570FP/HFP BD3571FP/HFP BD3572FP/HFP BD3573FP/HFP BD3574FP/HFP BD3575FP/HFP
Output voltage
SW function
3.3V
5.0 V
Variable
3.3V
5.0 V
Variable
Package
FP:TO252-3,TO252-5
HFP:HRP5
Absolute maximum ratings (Ta=25)
Parameter
Symbol
Limit
Unit
Supply voltage
VCC 50 1 V
Switch Supply voltage
VSW
50 2 V
Output current
IO 500 mA
1.2 (TO252-3) 3
Power dissipation
Pd
1.3 (TO252-5) 4
W
1.6 (HRP5) 5
Operating temperature range
Topr
-40 to +125
Storage temperature range
Tstg
-55 to +150
Maximum junction
temperature
Tjmax
150
1 Not to exceed Pd and ASO.
2 for ON/OFF SW Regulator only
3 TO252-3: Reduced by 9.6 mW/over 25 , when mounted on a glass epoxy board (70 mm 70 mm 1.6 mm).
4 TO252-5: Reduced by 10.4 mW/over 25 , when mounted on a glass epoxy board (70 mm 70 mm 1.6 mm).
5 HRP5: Reduced by 12.8 mW/over 25 , when mounted on a glass epoxy board (70 mm 70 mm 1.6 mm).
www.rohm.com
© 2011 ROHM Co., Ltd. All rights reserved.
1/9
2011.03 - Rev.B
Free Datasheet http://www.datasheet4u.com/




BD3572FP pdf, 반도체, 판매, 대치품
BD3570FP/HFP, BD3571FP/HFP, BD3572FP/HFP, BD3573FP/HFP
BD3574FP/HFP, BD3575FP/HFP
Technical Note
Block Diagram
Vcc
1
Cin
Vref
OCP
Vcc
1
Cin
Vo
3
SW
2
Co
Vref
OCP
1
GND
TSD
Fin
2
N.C.
Fig.13 TO252-3
GND
TSD
2
Fin
34
N.C.
ADJ (N.C. 1))
Fig.14 TO252-5
Cin0.33μF1000μF
Co0.1μF1000μF
I/O Circuit diagram (All resistance values are typical.)
Vcc
Vcc
1
Cin
Vo
5
SW
2
Co
Vref
OCP
1
Vo
5
Co
GND
3
Fin
TSD
2
4
Fig.15 HRP5 ADJ (N.C. 1))
1For Fixed Voltage Regulator only
2For adjustable Voltage Regulator only
Vcc
SW
210K
1K
200K
Vo Vo
1992K: BD3570, BD3573
3706K: BD3571, BD3574
1250K
150
Fig.16 2PIN[SW]
Pin Assignments
FIN
TO252-3
1 23
Fig. 19
FIN
TO252-5
12345
Fig.20
Fig.17 5PIN[VO]
BD3570,3571,3573,3574
Fig.18 4.5PIN[ADJ,VO]
BD3572,BD3575
Pin No.
1
2
3
Fin
Pin name
VCC
N.C.
VO
GND
Function
Power supply pin
N.C. pin
Voltage output pin
GND pin
Pin No.
1
2
3
4
5
Fin
Pin name
VCC
SW
N.C.
N.C.
N.C.
ADJ
VO
GND
Function
Power supply pin
VO ON/OFF function pin
N.C. pin(BD3572FP only)
N.C. pin
N.C. pin
Output voltage setting pin(BD3572,3575FP only)
Voltage output pin
GND pin
HRP5
FIN
123 45
Fig. 21
Pin No.
1
2
3
4
5
Fin
Pin name
VCC
SW
N.C.
GND
N.C.
ADJ
VO
GND
Function
Power supply pin
VO ON/OFF function pin (BD3573,3574,3575HFP only)
N.C. pin
GND pin
N.C. pin
Output voltage setting pin(BD3572,3575HFP only)
Voltage output pin
GND pin
www.rohm.com
© 2011 ROHM Co., Ltd. All rights reserved.
4/9
2011.03 - Rev.B
Free Datasheet http://www.datasheet4u.com/

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BD3572FP 전자부품, 판매, 대치품
BD3570FP/HFP, BD3571FP/HFP, BD3572FP/HFP, BD3573FP/HFP
BD3574FP/HFP, BD3575FP/HFP
Technical Note
The formation of parasitic elements as a result of the relationships of the potentials of different pins is an inevitable result of
the IC's architecture. The operation of parasitic elements can cause interference with circuit operation as well as IC
malfunction and damage. For these reasons, it is necessary to use caution so that the IC is not used in a way that will
trigger the operation of parasitic elements, such as by the application of voltages lower than the GND (P substrate) voltage
to input pins.
Resistor
Transistor (NPN)
(Pin A)
(Pin B) C
B
E
(Pin B)
BC
P+
N
P
P
N
P+
N
Parasitic element
GND
P+
N
Parasitic element
or transistor
P
N
P
substr
t GND
P+
N
(Pin A)
E
GND
Parasitic element or
transistor
Parasitic elements
Fig. 26 Example of a Simple Monolithic IC Architecture
8) Ground wiring patterns
When using both small signal and large current GND patterns, it is recommended to isolate the two ground patterns,
placing a single ground point at the application's reference point so that the pattern wiring resistance and voltage
variations caused by large currents do not cause variations in the small signal ground voltage. Be careful not to change
the GND wiring pattern of any external parts, either.
9) SW Pin
Do not apply the voltage to SW pin when the VCC is not applied.
And when the VCC is applied, the voltage of SW pin must not exceed VCC.
10) Thermal shutdown circuit (TSD)
This IC incorporates a built-in thermal shutdown circuit for the protection from thermal destruction. The IC should be used
within the specified power dissipation range. However, in the event that the IC continues to be operated in excess of its
power dissipation limits, the attendant rise in the chip's temperature Tj will trigger the thermal shutdown circuit to turn off
all output power elements. The circuit automatically resets once the chip's temperature Tj drops.
The thermal shutdown circuit operates if the IC is under conditions in express of the absolute maximum ratings. Never
design sets on the premise of using the thermal shutdown circuit. (See Fig. 8)
11) Overcurrent protection circuit (OCP)
The IC incorporates a built-in overcurrent protection circuit that operates according to the output current capacity. This
circuit serves to protect the IC from damage when the load is shorted. The protection circuit is designed to limit current
flow by not latching in the event of a large and instantaneous current flow originating from a large capacitor or other
component. These protection circuits are effective in preventing damage due to sudden and unexpected accidents.
However, the IC should not be used in applications characterized by the continuous operation or transitioning of the
protection circuits. At the time of thermal designing, keep in mind that the current capability has negative characteristics to
temperatures. (See Fig. 3)
www.rohm.com
© 2011 ROHM Co., Ltd. All rights reserved.
7/9
2011.03 - Rev.B
Free Datasheet http://www.datasheet4u.com/

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BD3572FP

(BD3570FP - BD3575HFP) High Voltage LDO Regulators

ROHM Semiconductor
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