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PDF MW8209 Data sheet ( Hoja de datos )
| Número de pieza | MW8209 | |
| Descripción | USB 2.0 FLASH DISK CONTROLLER | |
| Fabricantes | ETC | |
| Logotipo |  |
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MW8209 Datasheet
MW8209
USB 2.0 FLASH DISK CONTROLLER
Data Sheet
Free Datasheet http://www.datasheet-pdf.com/
1 page  
MW8209 Datasheet
1 INTRODUCTION
The MW8209 is a USB 2.0 high-speed Flash Drive controller. The USB 2.0 high-speed interface
including PHY and function supports USB 2.0 Mass Storage Device Class.
The Mass Storage Controller Interface combined with the Reed-Solomon Encoder/Decoder
on-the- fly correction (5-byte on 528-byte data blocks) provides a flexible, high transfer rate
solution for interfacing a wide of range Flash memory device types. The internal 60 MHz PLL
driven by the 12MHz Oscillator is used to generate the 480MHz frequency for the USB 2.0
PHY.
The Integrated 80C51 MCU runs the application program from the internal ROM and RAM.
USB data and patch code are stored in internal RAM.
I/O ports provide functions for EEPROM, LED and write protect switch control. The internal
5.0V to 3.3V and 3.3V to 1.8V voltage regulator provides the 3.3V and 1.8V supply voltage to
the digital part of the circuit.
MW8209 has optimized internal structure and techniques designed special for MLC
process. With dual-channel and up to 5bytes ECC support, make MLC present excellence
performance as SLC NAND Flash.
MW8209 supports all the FLASH on the today’s market. Include normal SLC/MLC
NAND flash, AND/AG-AND and Super-AND flash produced by Renesas, Or-NAND
flash produce by Micron. It supports 8bit/16bit bus spec, with big/small or large page type of
all kinks of FLASH. With advanced I/O pad process, the controller can support wide I/O
voltage range from 1.8V to 3.3V LVCMOS logic.
MW8209 has a very flexible and configurable interface and internal resource for future
FLASH compatible.
MW8209 supports boot from NAND flash, I2C bus or GPIO logic. Which make support
for future flash process be possible. The firmware can be downloaded to NAND flash
or E2PROM via on chip bus logic. The boot-loader resided in the inner ROM will load the
outer codes if necessary.
The code in the NAND or E2PROM can be used for multi-purpose. For example,
implement user-defined functions such as USB finger-scanner, USB-Key and USB-Ad
Disk. In such application, mounting E2PROM via On-Chip I2C bus prefer to a NAND
flash device.
MW8209 has a UID generating unit implemented by especial process. Which can generate
a Unique Identify Code for each die. The UID is 64bits long and can be read out by
private command. The ID can be used for the application that requires high security.
For example, finance market, personal identify, high security data storage, protecting
your Intellectual Property and so on.
MW8209 has consider this impenetrate its design cycle. Now our controller has optimized
hardware unit for fast and efficiency disk scanning. It provides scan patterns like
memory BIST algorithm. And there are several scan pattern can be configured by user.
With our special hardware support, the disk scanning will achieved the fastest speed and
highest efficiency.
Free Datasheet http://www.datasheet-pdf.com/
5 Page 
MW8209 Datasheet
Unless otherwise specified, all voltages are
referred to VSS (Digital Ground).
4.1.1 Minimum and Maximum values
Unless otherwise specified the minimum and
maximum values are guaranteed in the worst
conditions of ambient temperature, supply
voltage and frequencies by tests in
production on 100% of the Devices with an
ambient temperature at TA=25°C
and TA=TAmax (given by the selected
temperature range).
Data based on characterization results,
design simulation and/or technology
characteristics are indicated in the table
footnotes and are not tested in production.
Based on characterization, the minimum and
maximum values refer to sample tests and
represent the mean value plus or minus three
times the standard deviation (mean±3Σ).
4.1.2 Typical values
Unless otherwise specified, typical data are
based on TA=25°C, VCCA5 = 5.0V or
VDD33A=3.3V with internal LDO bypass.
They are given only as design guidelines and
are not tested.
4.1.3 Typical curves
Unless otherwise specified, all typical curves
are given only as design guidelines and are
not tested.
4.1.4 Loading capacitor
The loading conditions used for pin
parameter measurement are shown in
Figure 4.
4.2 ABSOLUTE MAXIMUM RATINGS
Stresses above those listed as “absolute maximum ratings” may cause permanent
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Device under these conditions is not implied. Exposure to maximum rating conditions
for extended periods may affect device reliability.
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11 Page | ||
| Páginas | Total 16 Páginas | |
| PDF Descargar | [ Datasheet MW8209.PDF ] | |
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