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PDF X7R1210 Data sheet ( Hoja de datos )
| Número de pieza | X7R1210 | |
| Descripción | Surface Mount Multilayer Ceramic Chip Capacitors | |
| Fabricantes | Kemet | |
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Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
X7R Dielectric, 6.3 – 250 VDC (Commercial Grade)
Overview
KEMET’s X7R dielectric features a 125°C maximum operating
temperature and is considered “temperature stable.” The
Electronics Components, Assemblies & Materials Association
(EIA) characterizes X7R dielectric as a Class II material.
Components of this classification are fixed, ceramic dielectric
capacitors suited for bypass and decoupling applications
or for frequency discriminating circuits where Q and stability
of capacitance characteristics are not critical. X7R exhibits a
predictable change in capacitance with respect to time and voltage
and boasts a minimal change in capacitance with reference to
ambient temperature. Capacitance change is limited to ±15% from
-55°C to +125°C.
Benefits
• -55°C to +125°C operating temperature range
• Pb-Free and RoHS Compliant
• Temperature stable dielectric
• EIA 0402, 0603, 0805, 1206, 1210, 1808, 1812, 1825, 2220,
and 2225 case sizes
• DC voltage ratings of 6.3 V, 10 V, 16 V, 25 V, 50 V, 100 V,
200 V, and 250 V
• Capacitance offerings ranging from 10 pF to 47 μF
• Available capacitance tolerances of ±5%, ±10%, and ±20%
• Non-polar device, minimizing installation concerns
• 100% pure matte tin-plated termination finish allowing for
excellent solderability
• SnPb termination finish option available upon request
(5% minimum)
Applications
Typical applications include decoupling, bypass, filtering and
transient voltage suppression.
Ordering Information
C 1206
Ceramic
Case Size
(L" x W")
0402
0603
0805
1206
1210
1808
1812
1825
2220
2225
C
Specification/
Series1
C = Standard
106
Capacitance
Code (pF)
2 Significant
Digits + Number
of Zeros
M
Capacitance
Tolerance
J = ±5%
K = ±10%
M = ±20%
4
Voltage
9 = 6.3 V
8 = 10 V
4 = 16 V
3 = 25 V
6 = 35 V
5 = 50 V
1 = 100 V
2 = 200 V
A = 250 V
R
Dielectric
R = X7R
AC
TU
Failure Rate/
Design
Termination Finish2
Packaging/Grade
(C-Spec)3
A = N/A
C = 100% Matte Sn
Blank = Bulk
TU = 7" Reel
Unmarked
TM = 7" Reel
Marked
1 Flexible termination option is available. Please see FT-CAP product bulletin C1013_X7R_FT-CAP_SMD.
2 Additional termination finish options may be available. Contact KEMET for details.
3 Additional reeling or packaging options may be available. Contact KEMET for details.
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com
One world. One KEMET
C1002_X7R_SMD • 9/20/2013 1
Free Datasheet http://www.datasheet-pdf.com/
1 page  
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) – X7R Dielectric, 6.3 – 250 VDC (Commercial Grade)
Post Environmental Limits
Dielectric
X7R
High Temperature Life, Biased Humidity, Moisture Resistance
Case Size
Rated DC
Voltage
Capacitance
Value
Dissipation
Factor
(Maximum %)
Capacitance
Shift
< 16 7.5
0402 16/25
All
5.0
> 25 3.0
< 16 7.5
16/25
< 1.0 uF
5.0
0603 > 25
3.0
< 16
16/25
≥ 1.0 uF
20.0
< 16
16/25
≤ 2.2 µF
7.5
5.0
> 25 < 1.0 µF
3.0
0805
< 16
> 2.2 µF
16/25
20.0
> 25 ≥ 1.0 µF
±20%
< 16 7.5
16/25
< 10 µF
5.0
1206 > 25
3.0
< 16
16/25
≥ 10 µF
20.0
< 16 7.5
16/25
< 22 µF
5.0
1210 > 25
3.0
< 16
16/25
≥ 22 µF
20.0
< 16 7.5
1808 – 2225
16/25
All
5.0
> 25 3.0
Insulation
Resistance
10% of Initial
Limit
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com
C1002_X7R_SMD • 9/20/2013 5
Free Datasheet http://www.datasheet-pdf.com/
5 Page 
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) – X7R Dielectric, 6.3 – 250 VDC (Commercial Grade)
Table 4 – Performance & Reliability: Test Methods and Conditions
Stress
Terminal Strength
Board Flex
Solderability
Temperature Cycling
Biased Humidity
Moisture Resistance
Thermal Shock
High Temperature Life
Storage Life
Vibration
Mechanical Shock
Resistance to Solvents
Reference
JIS–C–6429
JIS–C–6429
J–STD–002
JESD22 Method JA–104
MIL–STD–202 Method 103
MIL–STD–202 Method 106
MIL–STD–202 Method 107
MIL–STD–202 Method 108
/EIA–198
MIL–STD–202 Method 108
MIL–STD–202 Method 204
MIL–STD–202 Method 213
MIL–STD–202 Method 215
Test or Inspection Method
Appendix 1, Note: Force of 1.8 kg for 60 seconds.
Appendix 2, Note: Standard termination system – 2.0 mm (minimum) for all except 3 mm for C0G.
Flexible termination system – 3.0 mm (minimum).
Magnification 50 X. Conditions:
a) Method B, 4 hours @ 155°C, dry heat @ 235°C
b) Method B @ 215°C category 3
c) Method D, category 3 @ 260°C
1,000 Cycles (-55°C to +125°C). Measurement at 24 hours +/- 2 hours after test conclusion.
Load Humidity: 1,000 hours 85°C/85% RH and rated voltage. Add 100 K ohm resistor. Measurement
at 24 hours +/- 2 hours after test conclusion.
Low Volt Humidity: 1,000 hours 85°C/85% RH and 1.5 V. Add 100 K ohm resistor.
Measurement at 24 hours +/- 2 hours after test conclusion.
t = 24 hours/cycle. Steps 7a and 7b not required. Unpowered.
Measurement at 24 hours +/- 2 hours after test conclusion.
-55°C/+125°C. Note: Number of cycles required – 300, maximum transfer time – 20 seconds, dwell
time – 15 minutes. Air – Air.
1,000 hours at 125°C (85°C for X5R, Z5U and Y5V) with 2 X rated voltage applied.
150°C, 0 VDC for 1,000 hours.
5 g's for 20 min., 12 cycles each of 3 orientations. Note: Use 8" X 5" PCB 0.031" thick 7 secure
points on one long side and 2 secure points at corners of opposite sides. Parts mounted within 2"
from any secure point. Test from 10 – 2,000 Hz
Figure 1 of Method 213, Condition F.
Add aqueous wash chemical, OKEM Clean or equivalent.
Storage & Handling
Ceramic chip capacitors should be stored in normal working environments. While the chips themselves are quite robust in other
environments, solderability will be degraded by exposure to high temperatures, high humidity, corrosive atmospheres, and long term
storage. In addition, packaging materials will be degraded by high temperature– reels may soften or warp and tape peel force may
increase. KEMET recommends that maximum storage temperature not exceed 40ºC and maximum storage humidity not exceed 70%
relative humidity. Temperature fluctuations should be minimized to avoid condensation on the parts and atmospheres should be free of
chlorine and sulfur bearing compounds. For optimized solderability chip stock should be used promptly, preferably within 1.5 years of
receipt.
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com
C1002_X7R_SMD • 9/20/2013 11
Free Datasheet http://www.datasheet-pdf.com/
11 Page | ||
| Páginas | Total 22 Páginas | |
| PDF Descargar | [ Datasheet X7R1210.PDF ] | |
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