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PDF MCIMX351AVM4B Data sheet ( Hoja de datos )
| Número de pieza | MCIMX351AVM4B | |
| Descripción | Multimedia Applications Processor | |
| Fabricantes | Freescale Semiconductor | |
| Logotipo |  |
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Freescale Semiconductor
Data Sheet: Advance Information
Document Number: MCIMX35SR2AEC
Rev. 1, 12/2008
MCIMX35
MCIMX35 (i.MX35)
Multimedia
Applications
Processor for
Automotive Products
1 Introduction
The i.MX35 Auto Application Processor family is
designed for automotive infotainment and
navigation applications. They are AECQ100
Grade 3 qualified and rated for ambient operating
temperatures up to 85°C.
The i.MX35 multimedia applications processor
www.DaretapSrheeseet4nUt.scotmhe next step in low-power,
high-performance application processors.
Based on an ARM11 microprocessor core running
at up to 532 Mhz, the device offers specific features
and optimized system cost for the target
applications.
• Audio connectivity and telematics
— Compressed Audio playback from
storage devices (CD, USB, HDD or SD
card)
— PlayFromDevice (1-wire and 2-wire
support) for portable media players
— iPod/iPhone control and playback
Package Information
Plastic package
Case 5284 17 x 17 mm, 0.8 mm Pitch
Ordering Information
See Table 1 on page 3 for ordering information.
1 Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
1.1 Features. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
1.2 Ordering Information . . . . . . . . . . . . . . . . . . . . . . . . 3
1.3 Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
2 Functional Description and Application Information . . . . . 5
2.1 Application Processor Domain Overview. . . . . . . . . 5
2.2 Shared Domain Overview . . . . . . . . . . . . . . . . . . . . 6
2.3 Advanced Power Management Overview . . . . . . . . 6
2.4 ARM11 Microprocessor Core . . . . . . . . . . . . . . . . . 6
2.5 Module Inventory . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
3 Signal Descriptions: Special Function Related Pins . . . . 12
4 Electrical Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . 12
4.1 i.MX35 Chip-Level Conditions . . . . . . . . . . . . . . . . 12
4.2 Power Modes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
4.3 Supply Power-Up/Power-Down Requirements and
Restrictions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
4.4 Thermal Characteristics. . . . . . . . . . . . . . . . . . . . . 17
4.5 I/O Pad DC Electrical Characteristics . . . . . . . . . . 17
4.6 I/O Pad AC Electrical Characteristics . . . . . . . . . . 22
4.7 Module-Level AC Electrical Specifications. . . . . . . 28
5 Package Information and Pinout . . . . . . . . . . . . . . . . . . 128
5.1 MAPBGA Production Package 1568-01, 17 x 17 mm,
0.8 Pitch. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 128
5.2 Production Package Outline Drawing . . . . . . . . . 129
6 Product Documentation. . . . . . . . . . . . . . . . . . . . . . . . . 136
7 Revision History . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 136
This document contains information on a product under development. Freescale reserves the
right to change or discontinue this product without notice.
© Freescale Semiconductor, Inc., 2008. All rights reserved.
Preliminary—Subject to Change Without Notice
1 page  
1.3 Block Diagram
Figure 1 shows the i.MX35 simplified interface block diagram.
DDR2/SDDR
RAM
NOR
Flash/
PSRAM
NAND
Flash
Camera
Sensor
LCD Display 1 External Graphics
LCD Display 2 Accelerator
External Memory
Interface (EMI)
Smart
DMA
SPBA
Peripherals
MSHC
ESAI
SPDIF
SSI
UART
ASRC
CSPI
ATA
FEC
3 FuseBox
ARM11
Platform
ARM1136JF-S
VFP
L1 I/D cache
L2 cache
AVIC
MAX
AIPS (2)
ETM
Internal
Memory
Image
Processing Unit
(IPU)
ARM1136 Platform Peripherals
SSI
AUDMUX
I2C(3)
UART(2)
CSPI
CAN(2)
MLB
IIM
RTICv3
RNGC
SCC
KPP
PWM
OWIRE
HS USBOTG
HS USBOTGPHY
HS USBHost
FS USBPHY
GPU 2D
eSDHC(3)
ECT
IOMUX
GPIO(3)
EPIT
Timers
RTC
WDOG
GPT
www.DataSheet4U.com
Audio/Power
Management JTAG
Bluetooth
MMC/SDIO
or WLAN
Keypad
Connectivity
Access
Figure 1. i.MX35 Simplified Interface Block Diagram
2 Functional Description and Application Information
The MCIMX35 consists of the following major subsystems:
• ARM1136 Platform—AP domain
• SDMA Platform and EMI—Shared domain
2.1 Application Processor Domain Overview
The applications processor (AP) and its domain are responsible for running the operating system and
applications software, providing the user interface, and supplying access to integrated and external
peripherals. The AP domain is built around an ARM1136JF-S core with 16-Kbyte instruction and
16-Kbyte data L1 caches, an MMU, a 128-Kbyte L2 cache, a multiported crossbar switch, and advanced
debug and trace interfaces.
MCIMX35 (i.MX35) Multimedia Applications Processor for Automotive Products Advance Information, Rev. 1
Freescale Semiconductor
Preliminary—Subject to Change Without Notice
5
5 Page 
Table 4. Digital and Analog Modules (continued)
Block
Mnemonic
Block Name
Domain1
Subsystem
Brief Description
SDMA Smart DMA
engine
SDMA
System
controls
SJC
SPBA
Secure JTAG ARM
controller
SDMA
SDMA
peripheral bus
arbiter
Pins
System
controls
The SDMA provides DMA capabilities inside the processor. It is a
shared module that implements 32 DMA channels and has an
interface to connect to the ARM1136 platform subsystem, EMI
interface, and the peripherals.
The secure JTAG controller (SJC) provides debug and test control
with maximum security.
The SPBA controls access to the SDMA peripherals. It supports
shared peripheral ownership and access rights to an owned
peripheral.
S/PDIF
SSI(2)
Serial audio
interface
SDMA
Synchronous SDMA,
serial interface ARM(2)
Connectivity
peripherals
Connectivity
peripherals
UART(3)
Universal
asynchronous
receiver/trans
mitters
ARM(UA
RT1,2)
SDMA(U
ART3)
Connectivity
peripherals
USBOH High-speed SDMA
USB on-the-go
Connectivity
peripherals
www.DataSheet4U.com
Sony/Philips digital transceiver interface
The SSI is a full-duplex serial port that allows the processor
connected to it to communicate with a variety of serial protocols,
including the Freescale Semiconductor SPI standard and the I2C
sound (I2S) bus standard. The SSIs interface to the AUDMUX for
flexible audio routing.
Each UART provides serial communication capability with external
devices through an RS-232 cable using the standard RS-232
non-return-to-zero (NRZ) encoding format. Each module transmits
and receives characters containing either 7 or 8 bits
(program-selectable). Each UART can also provide low-speed IrDA
compatibility through the use of external circuitry that converts
infrared signals to electrical signals (for reception) or transforms
electrical signals to signals that drive an infrared LED (for
transmission).
The USB module provides high performance USB on-the-go (OTG)
functionality (up to 480 Mbps), compliant with the USB 2.0
specification, the OTG supplement, and the ULPI 1.0 low pin count
specification. The module has DMA capabilities handling data
transfer between internal buffers and system memory.
WDOG Watchdog
modules
ARM
Timer
peripherals
1 ARM = ARM1136 platform, SDMA = SDMA platform
Each module protects against system failures by providing a method
of escaping from unexpected events or programming errors. Once
activated, the timer must be serviced by software on a periodic basis.
If servicing does not take place, the watchdog times out and then
either asserts a system reset signal or an interrupt request signal,
depending on the software configuration.
MCIMX35 (i.MX35) Multimedia Applications Processor for Automotive Products Advance Information, Rev. 1
Freescale Semiconductor
Preliminary—Subject to Change Without Notice
11
11 Page | ||
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