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QRF8-0xx-0x.0-L-x-A-x 데이터시트 PDF




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QRF8-0xx-0x.0-L-x-A-x 데이터시트, 핀배열, 회로
F-214
QRF8–078–05.0–L–D–A
QRF8–036–05.0–L–D–DP–A
®
(0,80 mm) .0315"
QRF8–026–05.0–L–D–A
QRF8 SERIES
SLIM BODY GROUND PLANE SOCKET
SPECIFICATIONS
For complete specifications and
recommended PCB layouts see
www.samtec.com?QRF8
Insulator Material:
Black LCP
Contact Material:
BeCu
Ground Plane Material:
Phosphor Bronze
Plating:
Au or Sn over
50µ" (1,27 µm) Ni
Current Rating:
Contact:
2.2 A per pin
(1 pin powered per row)
Ground Plane:
8.5 A per ground plane
(1 ground plane powered)
Operating Temp Range:
-55°C to +125°C
Voltage Rating:
215 VAC
RoHS Compliant:
Yes
Processing:
Lead–Free Solderable:
Yes
SMT Lead Coplanarity:
(0,10 mm) .004" max (018-026)
(0,15 mm) .006" max (036-078)
Board Mates:
QRM8, EQRD
Increased wipe
for rugged applications
Integral
ground/power
plane
Edge Rate
contacts
QRM8/QRF8
7 mm Stack Height
Rated @ 3dB Insertion Loss
Type
with PCB effects* w/o PCB effects**
Single-Ended Signaling –D 9.5 GHz / 19 Gbps 15 GHz / 30 Gbps
Differential Pair Signaling –D 8.5 GHz / 17 Gbps 12.5 GHz / 25 Gbps
Differential Pair Signaling –DP 9 GHz / 18 Gbps
––––
*Performance data includes effects of a non-optimized PCB.
**Test board losses de-embedded from performance data.
Performance data for other stack heights and complete test data
available at www.samtec.com?QRF8 or contact [email protected]
QRF8
PINS PER ROW
NO. OF PAIRS
LEAD
STYLE
PLATING
OPTION
TYPE
(1,20 mm)
.047"
NOMINAL
WIPE
SPuroptpoocrotlesd
CwfoDownrowtwqa.snucalt1eom0sSattd0IiGeocan.G@pscpoobsmnnaEo/mpatreptoseptcnao.octctooemls
A
OTHER
OPTION
RECOGNITIONS
For complete scope of
recognitions see
www.samtec.com/quality
MATED HEIGHT*
QRF8 QRM8 LEAD STYLE
LEAD
STYLE –02.0 –05.0 –07.0
– 05.0
(7,00)
.276
(10,00) (12,00)
.394 .472
– 07.0
(9,00)
.354
(12,00) (14,00)
.472 .551
*Processing conditions will
affect mated height.
–026, –052, –078
(52 total pins per bank = –D)
–018, –036, –054
(18 pairs per bank = –D–DP)
– 05.0
= 5 mm
Body
Height
–07.0
= 7 mm
Body
Height
–L
= 10 µ"
(0,25 µm)
Gold on
contact,
Matte Tin
on tail
(4,60)
.181
No. of Banks x (24,80) .976 + (3,57) .140
01
(0,80)
.0315
02
ALSO AVAILABLE
(MOQ Required)
• Other platings
Contact Samtec.
Note: Patented
Note: Some lengths, styles
and options are non-standard,
non-returnable.
(1,25) A
.049
LEAD
STYLE
A
– 05.0
(5,01)
.197
– 07.0
(7,01)
.276
(0,23) .009
(1,00) .039 DIA
No. of Banks x (24,80) .976 - (2,00) .078
No. of Banks x (24,80) .976 + (5,25) .206
–GP OPTION
WWW.SAMTEC.COM
–D
= Single-Ended
–D–DP
= Differential
Pair
– GP
= Guide Post
(Requires –GP on
mating connector)
–K
= (5,00 mm) .197" DIA
Polyimide Film
Pick & Place Pad
(4,60)
.181
– TR
= Tape & Reel
(–018, –026,
–036, –052 only)
(1,04)
.041
(0,20)
.008
• Edge Rate
contacts
• Increased contact
wipe
• 10 year MFG
• Guide post option
Free Datasheet http://www.Datasheet4U.com





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