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25Q32BV 데이터시트 PDF




Winbond에서 제조한 전자 부품 25Q32BV은 전자 산업 및 응용 분야에서
광범위하게 사용되는 반도체 소자입니다.


 

PDF 형식의 25Q32BV 자료 제공

부품번호 25Q32BV 기능
기능 3v 32M-Bit Serial Flash Memory
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25Q32BV 데이터시트, 핀배열, 회로
W25Q32BV
3V 32M-BIT
SERIAL FLASH MEMORY WITH
DUAL AND QUAD SPI
Publication Release Date: October 04,2013
- 1 - Revision I




25Q32BV pdf, 반도체, 판매, 대치품
W25Q32BV
7.2.37
7.2.38
7.2.39
Erase Security Registers (44h)...........................................................................................58
Program Security Registers (42h) ......................................................................................59
Read Security Registers (48h) ...........................................................................................60
8. ELECTRICAL CHARACTERISTICS .............................................................................................. 61
8.1 Absolute Maximum Ratings (1)(2) ................................................................................... 61
8.2 Operating Ranges .............................................................................................................. 61
8.3 Power-Up Power-Down Timing and Requirements(1 ........................................................ 62
8.4 DC Electrical Characteristics.............................................................................................. 63
8.5 AC Measurement Conditions ............................................................................................. 64
8.6 AC Electrical Characteristics .............................................................................................. 65
8.7 AC Electrical Characteristics (cont’d)................................................................................. 66
8.8 Serial Output Timing........................................................................................................... 67
8.9 Serial Input Timing.............................................................................................................. 67
8.10 HOLD Timing...................................................................................................................... 67
8.11 WP Timing .......................................................................................................................... 67
9. PACKAGE SPECIFICATION.......................................................................................................... 68
9.1 8-Pin SOIC 208-mil (Package Code SS) ........................................................................... 68
9.2 8-Pin VSOP 208-mil (Package Code ST) .......................................................................... 69
9.3 8-Pin PDIP 300-mil (Package Code DA)............................................................................ 70
9.4 8-Pad WSON 6x5-mm (Package Code ZP)....................................................................... 71
9.5 8-Pad WSON 8x6-mm (Package Code ZE)....................................................................... 72
9.6 16-Pin SOIC 300-mil (Package Code SF).......................................................................... 73
9.7 24-Ball TFBGA 8x6-mm (Package Code TB, 5x5-1 ball array) ......................................... 74
9.8 24-Ball TFBGA 8x6-mm (Package Code TC, 6x4 ball array) ............................................ 75
10. ORDERING INFORMATION .......................................................................................................... 76
10.1 Valid Part Numbers and Top Side Marking........................................................................ 77
11. REVISION HISTORY...................................................................................................................... 78
-4-

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25Q32BV 전자부품, 판매, 대치품
W25Q32BV
3.3 Pin Configuration PDIP 300-mil
Top View
/CS 1
8
DO (IO1)
/WP (IO2)
GND
2
3
4
7
6
5
VCC
/HOLD (IO3)
CLK
DI (IO0)
Figure 1c. W25Q32BV Pin Assignments, 8-pin PDIP 300-mil (Package Code DA)
3.4 Pin Description SOIC/VSOP 208-mil, WSON 6x5/8x6-mm and PDIP 300-mil
PIN NO.
1
2
3
4
5
6
7
8
PIN NAME
/CS
DO (IO1)
/WP (IO2)
GND
DI (IO0)
CLK
/HOLD (IO3)
VCC
I/O FUNCTION
I Chip Select Input
I/O Data Output (Data Input Output 1)*1
I/O Write Protect Input ( Data Input Output 2)*2
Ground
I/O Data Input (Data Input Output 0)*1
I Serial Clock Input
I/O Hold Input (Data Input Output 3)*2
Power Supply
*1 IO0 and IO1 are used for Standard and Dual SPI instructions
*2 IO0 IO3 are used for Quad SPI instructions
Publication Release Date: October 04,2013
- 7 - Revision I

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관련 데이터시트

부품번호상세설명 및 기능제조사
25Q32BV

3v 32M-Bit Serial Flash Memory

Winbond
Winbond

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