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STM32F303VC 데이터시트 PDF




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부품번호 STM32F303VC 기능
기능 ARM Cortex-M4F 32b MCU+FPU
제조업체 STMicroelectronics
로고 STMicroelectronics 로고


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STM32F303VC 데이터시트, 핀배열, 회로
STM32F303xB STM32F303xC
ARM®-based Cortex®-M4 32b MCU+FPU, up to 256KB Flash+
48KB SRAM, 4 ADCs, 2 DAC ch., 7 comp, 4 PGA, timers, 2.0-3.6 V
Datasheet - production data
Features
Core: ARM® Cortex®-M4 32-bit CPU with FPU
(72 MHz max), single-cycle multiplication and
HW division, 90 DMIPS (from CCM), DSP
instruction and MPU (memory protection unit)
Operating conditions:
– VDD, VDDA voltage range: 2.0 V to 3.6 V
Memories
– 128 to 256 Kbytes of Flash memory
– Up to 40 Kbytes of SRAM, with HW parity
check implemented on the first 16 Kbytes.
– Routine booster: 8 Kbytes of SRAM on
instruction and data bus, with HW parity
check (CCM)
CRC calculation unit
Reset and supply management
– Power-on/Power-down reset (POR/PDR)
– Programmable voltage detector (PVD)
– Low-power modes: Sleep, Stop and Standby
– VBAT supply for RTC and backup registers
Clock management
– 4 to 32 MHz crystal oscillator
– 32 kHz oscillator for RTC with calibration
– Internal 8 MHz RC with x 16 PLL option
Internal 40 kHz oscillator
Up to 87 fast I/Os
– All mappable on external interrupt vectors
– Several 5 V-tolerant
Interconnect matrix
12-channel DMA controller
Four ADCs 0.20 µS (up to 39 channels) with
selectable resolution of 12/10/8/6 bits, 0 to
3.6 V conversion range, single
ended/differential input, separate analog supply
from 2 to 3.6 V
Two 12-bit DAC channels with analog supply
from 2.4 to 3.6 V
Seven fast rail-to-rail analog comparators with
analog supply from 2 to 3.6 V
Four operational amplifiers that can be used in
PGA mode, all terminals accessible with analog
supply from 2.4 to 3.6 V
Up to 24 capacitive sensing channels supporting
touchkey, linear and rotary touch sensors
LQFP48 (7 × 7 mm)
LQFP64 (10 × 10 mm)
WLCSP100 (0.4 mm pitch)
LQFP100 (14 × 14 mm)
Up to 13 timers
– One 32-bit timer and two 16-bit timers with
up to 4 IC/OC/PWM or pulse counter and
quadrature (incremental) encoder input
– Two 16-bit 6-channel advanced-control
timers, with up to 6 PWM channels,
deadtime generation and emergency stop
– One 16-bit timer with 2 IC/OCs, 1
OCN/PWM, deadtime generation and
emergency stop
– Two 16-bit timers with IC/OC/OCN/PWM,
deadtime generation and emergency stop
– Two watchdog timers (independent, window)
– SysTick timer: 24-bit downcounter
– Two 16-bit basic timers to drive the DAC
Calendar RTC with Alarm, periodic wakeup
from Stop/Standby
Communication interfaces
– CAN interface (2.0B Active)
– Two I2C Fast mode plus (1 Mbit/s) with
20 mA current sink, SMBus/PMBus, wakeup
from STOP
– Up to five USART/UARTs (ISO 7816
interface, LIN, IrDA, modem control)
– Up to three SPIs, two with multiplexed
half/full duplex I2S interface, 4 to 16
programmable bit frames
– USB 2.0 full speed interface
Infrared transmitter
Serial wire debug, Cortex®-M4 with FPU ETM,
JTAG
96-bit unique ID
Table 1. Device summary
Reference
Part number
STM32F303xB
STM32F303xC
STM32F303CB, STM32F303RB, STM32F303VB
STM32F303CC, STM32F303RC, STM32F303VC
May 2016
This is information on a product in full production.
DocID023353 Rev 13
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STM32F303VC pdf, 반도체, 판매, 대치품
Contents
STM32F303xB STM32F303xC
6.3.4
6.3.5
6.3.6
6.3.7
6.3.8
6.3.9
6.3.10
6.3.11
6.3.12
6.3.13
6.3.14
6.3.15
6.3.16
6.3.17
6.3.18
6.3.19
6.3.20
6.3.21
6.3.22
6.3.23
Embedded reference voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 62
Supply current characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 62
Wakeup time from low-power mode . . . . . . . . . . . . . . . . . . . . . . . . . . . 73
External clock source characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . 74
Internal clock source characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . 79
PLL characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 81
Memory characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 81
EMC characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 82
Electrical sensitivity characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . 83
I/O current injection characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . 84
I/O port characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 86
NRST pin characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 91
Timer characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 92
Communications interfaces . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 94
ADC characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 103
DAC electrical specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 117
Comparator characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 119
Operational amplifier characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . 121
Temperature sensor characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . 123
VBAT monitoring characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 124
7 Package information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 125
7.1 LQFP100 – 14 x 14 mm, low-profile quad flat package
information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 125
7.2 LQFP64 – 10 x 10 mm, low-profile quad flat package
information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 128
7.3 LQFP48 – 7 x 7 mm, low-profile quad flat package
information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 131
7.4 WLCSP100 - 0.4 mm pitch wafer level chip scale package information 134
7.5 Thermal characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 138
7.5.1 Reference document . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 138
7.5.2 Selecting the product temperature range . . . . . . . . . . . . . . . . . . . . . . 139
8 Ordering information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 141
9 Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 142
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STM32F303VC 전자부품, 판매, 대치품
STM32F303xB STM32F303xC
List of figures
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Figure 46.
Figure 47.
Figure 48.
STM32F303xB/STM32F303xC block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
Clock tree . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
Infrared transmitter . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28
STM32F303xB/STM32F303xC LQFP48 pinout . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31
STM32F303xB/STM32F303xC LQFP64 pinout . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32
STM32F303xB/STM32F303xC LQFP100 pinout . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33
STM32F303xB/STM32F303xC WLCSP100 pinout . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 34
STM32F303xB/STM32F303xC memory map . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 52
Pin loading conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 55
Pin input voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 55
Power supply scheme. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 56
Current consumption measurement scheme . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 57
Typical VBAT current consumption (LSE and RTC ON/LSEDRV[1:0] = ’00’) . . . . . . . . . . . 66
High-speed external clock source AC timing diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . 74
Low-speed external clock source AC timing diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 75
Typical application with an 8 MHz crystal . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 77
Typical application with a 32.768 kHz crystal . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 79
HSI oscillator accuracy characterization results for soldered parts . . . . . . . . . . . . . . . . . . 80
TC and TTa I/O input characteristics - CMOS port . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 87
TC and TTa I/O input characteristics - TTL port . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 87
Five volt tolerant (FT and FTf) I/O input characteristics - CMOS port. . . . . . . . . . . . . . . . . 88
Five volt tolerant (FT and FTf) I/O input characteristics - TTL port . . . . . . . . . . . . . . . . . . . 88
I/O AC characteristics definition . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 91
Recommended NRST pin protection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 92
I2C bus AC waveforms and measurement circuit . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 95
SPI timing diagram - slave mode and CPHA = 0 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 97
SPI timing diagram - slave mode and CPHA = 1(1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 97
SPI timing diagram - master mode(1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 98
I2S slave timing diagram (Philips protocol)(1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 100
I2S master timing diagram (Philips protocol)(1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 100
USB timings: definition of data signal rise and fall time . . . . . . . . . . . . . . . . . . . . . . . . . . 101
ADC typical current consumption on VDDA pin . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 106
ADC typical current consumption on VREF+ pin . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 106
ADC accuracy characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 116
Typical connection diagram using the ADC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 116
12-bit buffered /non-buffered DAC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 118
Maximum VREFINT scaler startup time from power down . . . . . . . . . . . . . . . . . . . . . . . . 120
OPAMP voltage noise versus frequency . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 123
LQFP100 – 14 x 14 mm, low-profile quad flat package outline . . . . . . . . . . . . . . . . . . . . 125
LQFP100 – 14 x 14 mm, low-profile quad flat package recommended footprint . . . . . . . 126
LQFP100 – 14 x 14 mm, low-profile quad flat package top view example . . . . . . . . . . . . 127
LQFP64 – 10 x 10 mm, low-profile quad flat package outline . . . . . . . . . . . . . . . . . . . . . 128
LQFP64 – 10 x 10 mm, low-profile quad flat package recommended footprint . . . . . . . . 129
LQFP64 – 10 x 10 mm, low-profile quad flat package top view example . . . . . . . . . . . . . 130
LQFP48 – 7 x 7 mm, low-profile quad flat package outline . . . . . . . . . . . . . . . . . . . . . . . 131
LQFP48 - 7 x 7 mm, low-profile quad flat package recommended footprint. . . . . . . . . . . 132
LQFP48 - 7 x 7 mm, low-profile quad flat package top view example . . . . . . . . . . . . . . . 133
WLCSP100 – 100L, 4.166 x 4.628 mm 0.4 mm pitch wafer level chip scale
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관련 데이터시트

부품번호상세설명 및 기능제조사
STM32F303VB

ARM Cortex-M4F 32b MCU+FPU

STMicroelectronics
STMicroelectronics
STM32F303VC

ARM Cortex-M4F 32b MCU+FPU

STMicroelectronics
STMicroelectronics

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