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부품번호 | RF5605 기능 |
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기능 | 2.4GHz TO 2.5GHz HIGH POWER FRONT END MODULE | ||
제조업체 | RFMD | ||
로고 | |||
전체 17 페이지수
RF56055.0 V,
2.4GHz TO
2.5GHz HIGH
POWER FRONT
END MODULE
RF5605
5.0V, 2.4GHz TO 2.5GHz HIGH POWER
FRONT END MODULE
Package: 6mmx6mm Laminate
Features
35dB Typical Gain Across
Frequency Band
POUT=27.5dBm<2.5% EVM
2.4GHz to 2.5GHz Frequency
Range
1x1 MIMO architecture
Integrated 3-stage PA,
filtering, and T/R switch.
Integrated power detector
Applications
WiFi IEEE802.11b/g/n
Applications
Customer Premises
Equipment (CPE)
WiFi Access Points and
Gateways
Spread-Spectrum and MMDS
Systems
Vbias
GND
GND
TXIN
GND
Input
Match
Pdown
Inter
Stage
Match
Inter
Stage
Match
Bias
Vtx
GND
GND
ANT
GND
Vrx
Functional Block Diagram
Product Description
RF5605 is a 1x1 MIMO module that is intently specified to address IEEE
802.11b/g/n WiFi 2.4GHz to 2.5GHz customer premises equipment (CPE) applica-
tions. The module has an integrated three-stage linear power amplifier, Tx harmonic
filtering and SPDT switch. The RF5605 has fully matched input and output for a
50 system and incorporates matching networks optimized for linear output power
and efficiency. The RF5605 is housed in a 6mm x 6mm laminate.
Ordering Information
RF5605PCK-410
RF5605SB
RF5605SR
RF5605TR7
RF5605SQ
RF5605 Eval Board with 5 piece Bag
5 Piece Bag
100 piece Reel
2500 piece reel
25 piece Bag
DS120213
Optimum Technology Matching® Applied
GaAs HBT
SiGe BiCMOS
GaAs pHEMT
GaN HEMT
GaAs MESFET
InGaP HBT
Si BiCMOS
SiGe HBT
Si CMOS
Si BJT
BiFET HBT
LDMOS
RF MICRO DEVICES®, RFMD®, Optimum Technology Matching®, Enabling Wireless Connectivity™, PowerStar®, POLARIS™ TOTAL RADIO™ and UltimateBlue™ are trademarks of RFMD, LLC. BLUETOOTH is a trade-
mark owned by Bluetooth SIG, Inc., U.S.A. and licensed for use by RFMD. All other trade names, trademarks and registered trademarks are the property of their respective owners. ©2006, RF Micro Devices, Inc.
7628 Thorndike Road, Greensboro, NC 27409-9421 · For sales or technical
support, contact RFMD at (+1) 336-678-5570 or [email protected].
1 of 17
Free Datasheet http://www.Datasheet4U.com
RF5605
Pin
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
PkG Base
Name
GND
GND
VCC3
VCC2
GND
VCC1
VBIAS
GND
GND
TXIN
GND
PDOWN
VREG1
VREG2
VREG3
PDET
GND
RX
VRX
GND
ANT
GND
GND
VTX
GND
Pin Names and Descriptions
Description
Ground connection
Ground connection
This pin is connected internally to the collector of the 3rd stage RF device. To achieve specified perfor-
mance, the layout of these pins should match the Recommended Land Pattern.
This pin is connected internally to the collector of the 2nd stage RF device. To achieve specified perfor-
mance, the layout of these pins should match the Recommended Land Pattern.
Ground connection
This pin is connected internally to the collector of the 1st stage RF device. To achieve specified perfor-
mance, the layout of these pins should match the Recommended Land Pattern.
Supply voltage for the bias reference and control circuits.
Ground connection
Ground connection
RF input is internally matched to 50 and DC blocked.
Ground connection
Power down pin. Apply <0.3VDC to power down the three power amplifier stages. Apply 1.75VDC to
5.0VDC to power up. If function is not desired, Pin may be connected to VREG.
First stage bias voltage. This Pin requires regulated supply for best performance.
Second stage bias voltage. This Pin requires regulated supply for best performance.
Third stage bias voltage. This Pin requires regulated supply for best performance.
Power detector provides an output voltage proportional to the RF output power level.
Ground connection
RF Output is internally matched to 50 and DC blocked.
Switch control for Rx mode
Ground connection
RF Output is internally matched to 50 and DC blocked.
Ground connection
Ground connection
Switch control for Tx mode
Ground connection
4 of 17
7628 Thorndike Road, Greensboro, NC 27409-9421 · For sales or technical
support, contact RFMD at (+1) 336-678-5570 or [email protected].
DS120213
Free Datasheet http://www.Datasheet4U.com
4페이지 Package Drawing
RF5605
A A A A A A A 7x 2.700
A
20x
0.300
A
A
A
B
A 2x 1.800
A 2x 0.900
A = 0.400 x 0.400 mm
A 0.000 B = 4.400 x 4.400 mm
A 2x 0.900
A A 2x 1.800
A A A A A A A 7x 2.700
A A A A A A A 7x 2.700
A
20x
0.150
A
A
B
A 2x 1.800
A 2x 0.900
A = 0.550 x 0.550 mm
A 0.000 B = 4.550 x 4.550 mm
A A 2x 0.900
A A 2x 1.800
A A A A A A A 7x 2.700
PCB METAL LAND PATTERN
A A A A A A A 7x 2.700
PCB SOLDER MASK PATTERN
A A 2x 1.800
3x 1.550
BBB
A A 2x 0.900
20x
0.385
AB
B
B
A 0.000
A = 0.360 x 0360 mm
B = 1.170 x 1.179 mm
A A 2x 0.900
3x 1.550
BBB
A A 2x 1.800
A A A A A A A 7x 2.700
Notes:
PCB STENCIL PATTERN
1. Shaded area represents Pin 1 location
NOTE: Thermal vias for center slug “B” should be incorporated into the PCB design. The number and size of thermal vias will
depend on the application. Example of the number and size of vias can be found on the RFMD evaluation board layout.
DS120213
7628 Thorndike Road, Greensboro, NC 27409-9421 · For sales or technical
support, contact RFMD at (+1) 336-678-5570 or [email protected].
7 of 17
Free Datasheet http://www.Datasheet4U.com
7페이지 | |||
구 성 | 총 17 페이지수 | ||
다운로드 | [ RF5605.PDF 데이터시트 ] |
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구매 문의 | 일반 IC 문의 : 샘플 및 소량 구매 ----------------------------------------------------------------------- IGBT, TR 모듈, SCR 및 다이오드 모듈을 포함한 광범위한 전력 반도체를 판매합니다. 전력 반도체 전문업체 상호 : 아이지 인터내셔날 사이트 방문 : [ 홈페이지 ] [ 블로그 1 ] [ 블로그 2 ] |
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