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GKI07113 데이터시트 PDF




SANKEN에서 제조한 전자 부품 GKI07113은 전자 산업 및 응용 분야에서
광범위하게 사용되는 반도체 소자입니다.


 

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부품번호 GKI07113 기능
기능 N Channel Trench Power MOSFET
제조업체 SANKEN
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GKI07113 데이터시트, 핀배열, 회로
75 V, 40 A, 7.0 mΩ Low RDS(ON)
N ch Trench Power MOSFET
GKI07113
Features
V(BR)DSS --------------------------------- 75 V (ID = 100 µA)
ID ---------------------------------------------------------- 40 A
RDS(ON) ----------9.5 mΩ max. (VGS = 10 V, ID = 27.2 A)
Qg------ 25.0nC (VGS = 4.5 V, VDS = 38 V, ID = 31.2 A)
Low Total Gate Charge
High Speed Switching
Low On-Resistance
Capable of 4.5 V Gate Drive
100 % UIL Tested
RoHS Compliant
Applications
DC-DC converters
Synchronous Rectification
Power Supplies
Package
DFN 5 × 6 (L)
8pin
DDDD
8pin
DDDD
SSSG
1pin
GSSS
1pin
Not to scale
Equivalent circuit
D(5)(6)(7)(8)
G(4)
Absolute Maximum Ratings
Unless otherwise specified, TA = 25 °C
Parameter
Symbol
Test conditions
Drain to Source Voltage
Gate to Source Voltage
Continuous Drain Current
Pulsed Drain Current
Continuous Source Current
(Body Diode)
Pulsed Source Current
(Body Diode)
Single Pulse Avalanche Energy
Avalanche Current
Power Dissipation
Operating Junction Temperature
VDS
VGS
TC = 25 °C,
ID
with infinite heatsink
TA = 25 °C,
mounted on PCB*
IDM
PW 100µs
Duty cycle 1 %
IS
ISM
PW 100µs
Duty cycle 1 %
VDD = 38V, L = 1 mH,
EAS
IAS = 11.2 A, unclamped,
RG = 4.7 Ω,
Refer to Figure 1
IAS
TC = 25 °C,
PD
with infinite heatsink
TA = 25 °C,
mounted on PCB*
TJ
Storage Temperature Range
TSTG
* 1 inch square 2 oz copper pad on 1.5 × 1.5 inch PCB.
S(1)(2)(3)
Rating
75
± 20
40
9
80
40
80
126
23.3
77
3.1
150
55 to 150
GKI07113-DS Rev.1.6
Mar. 30, 2015
SANKEN ELECTRIC CO.,LTD.
http://www.sanken-ele.co.jp
Unit
V
V
A
A
A
A
A
mJ
A
W
W
°C
°C
1




GKI07113 pdf, 반도체, 판매, 대치품
GKI07113
RDS(ON)-ID characteristics (typical)
VGS=10V
20
18
16
14 Tc = 125
12
75
10
8 25
6
4
2
0
0 10 20 30 40 50 60 70 80
ID (A)
VDS-VGS characteristics (typical)
Tc=25
0.6
0.5
0.4
0.3
0.2
0.1
0.0
0
ID=27.2A
ID=15.6A
ID=13.6A
5 10
VGS (V)
15
RDS(ON)-ID characteristics (typical)
VGS=4.5V
20
18
16 Tc = 125
14
12 75
10
25
8
6
4
2
0
0 10 20 30 40 50 60 70 80
ID (A)
IDR-VSD characteristics (typical)
80
VGS=10V
70
Tc=25
60
50
VGS=4.5V
40
3V
30
20 0V
10
0
0 0.5 1 1.5
VSD (V)
Capacitance-VDS characteristics (typical)
100000
VGS - Qg characteristics (typical)
15
80
70
60
50
40
30
20
10
0
0
ID-VGS characteristics (typical)
VDS=5V
Tc =125
75
25
12345
VGS (V)
IDR-VSD characteristics (typical)
VDS=0V
80
70
60
50
40 Tc =125
30 75
20 25
10
0
0 0.5 1 1.5
VSD (V)
Vth-Tc characteristics (typical)
3
10000
Ciss
1000
Coss
100
10
0
Ta=25
VGS=0V
f =1MHz
10
20
30
VDS (V)
Crss
40 50
RDS(ON)-Tc characteristics (typical)
18
16
14
12
10
8
6
4
ID=27.2A
2 VGS=10V
0
25 50 75 100 125 150
Tc ()
10
5
Tc=25
VDS=38V
ID=31.2A
0
0 20 40 60
Qg (nC)
RDS(ON)-Tc characteristics (typical)
18
16
14
12
10
8
6
4
2 ID=13.6A
VGS=4.5V
0
25 50 75 100 125 150
Tc ()
GKI07113-DS Rev.1.6
Mar. 30, 2015
SANKEN ELECTRIC CO.,LTD.
2
1
ID=1mA
VGS=VDS
0
25 50 75 100 125 150
Tc ()
BVDSS-Tc characteristics (typical)
96
94
92
90
88
86
84
ID=1mA
82 VGS=0V
80
78
25 50 75 100 125 150
Tc ()
4

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GKI07113 전자부품, 판매, 대치품
GKI07113
OPERATING PRECAUTIONS
In the case that you use Sanken products or design your products by using Sanken products, the reliability largely
depends on the degree of derating to be made to the rated values. Derating may be interpreted as a case that an operation
range is set by derating the load from each rated value or surge voltage or noise is considered for derating in order to
assure or improve the reliability. In general, derating factors include electric stresses such as electric voltage, electric
current, electric power etc., environmental stresses such as ambient temperature, humidity etc. and thermal stress caused
due to self-heating of semiconductor products. For these stresses, instantaneous values, maximum values and minimum
values must be taken into consideration. In addition, it should be noted that since power devices or IC’s including power
devices have large self-heating value, the degree of derating of junction temperature affects the reliability significantly.
Because reliability can be affected adversely by improper storage environments and handling methods, please
observe the following cautions.
Cautions for Storage
Ensure that storage conditions comply with the standard temperature (5 to 35°C) and the standard relative humidity
(around 40 to 75%); avoid storage locations that experience extreme changes in temperature or humidity.
Avoid locations where dust or harmful gases are present and avoid direct sunlight.
Reinspect for rust on leads and solderability of the products that have been stored for a long time.
Cautions for Testing and Handling
When tests are carried out during inspection testing and other standard test periods, protect the products from power
surges from the testing device, shorts between the product pins, and wrong connections. Ensure all test parameters are
within the ratings specified by Sanken for the products.
Remarks About Using Thermal Silicone Grease
When thermal silicone grease is used, it shall be applied evenly and thinly. If more silicone grease than required is
applied, it may produce excess stress.
The thermal silicone grease that has been stored for a long period of time may cause cracks of the greases, and it
cause low radiation performance. In addition, the old grease may cause cracks in the resin mold when screwing the
products to a heatsink.
Fully consider preventing foreign materials from entering into the thermal silicone grease. When foreign material
is immixed, radiation performance may be degraded or an insulation failure may occur due to a damaged insulating
plate.
The thermal silicone greases that are recommended for the resin molded semiconductor should be used.
Our recommended thermal silicone grease is the following, and equivalent of these.
Type
Suppliers
G746 Shin-Etsu Chemical Co., Ltd.
YG6260 Momentive Performance Materials Japan LLC
SC102 Dow Corning Toray Co., Ltd.
Soldering
When soldering the products, please be sure to minimize the working time, within the following limits:
Reflow
Preheat ; 180 °C / 90 ± 30 s
Solder heating ; 250 °C / 10 ± 1s (260 °C peak, 2 times)
Soldering iron ; 380 ± 10 °C / 3.5 ± 0.5s (1 time)
Electrostatic Discharge
When handling the products, the operator must be grounded. Grounded wrist straps worn should have at least 1MΩ
of resistance from the operator to ground to prevent shock hazard, and it should be placed near the operator.
Workbenches where the products are handled should be grounded and be provided with conductive table and floor
mats.
When using measuring equipment such as a curve tracer, the equipment should be grounded.
When soldering the products, the head of soldering irons or the solder bath must be grounded in order to prevent
leak voltages generated by them from being applied to the products.
The products should always be stored and transported in Sanken shipping containers or conductive containers, or
be wrapped in aluminum foil.
GKI07113-DS Rev.1.6
Mar. 30, 2015
SANKEN ELECTRIC CO.,LTD.
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부품번호상세설명 및 기능제조사
GKI07113

N Channel Trench Power MOSFET

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